SCHEMBL4084906

SCHEMBL4084906

CC(C)c1ccc(C(C)COOC(C)(C)C)cc1

nearest known ligand 0.37

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 2/20 0.37
TYR P14679 2/20 0.32
RIPK1 Q13546 1/20 0.32
CYP2D6 P10635 1/20 0.32
CYP2C9 P11712 1/20 0.32
HIF1A Q16665 1/20 0.32
SMN1; SMN2 Q16637 2/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
HPGD P15428 1/20 0.31
HTT P42858 2/20 0.31
ACHE P22303 1/20 0.31
LMNA P02545 1/20 0.30
GRIA4 P48058 1/20 0.30
USP5 P45974 1/20 0.30
NOTUM Q6P988 1/20 0.30
CASR P41180 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL361156 0.94 RIPK1 (0.35) RIPK1GRIA4
SCHEMBL1077953 0.85 RIPK1 (0.48) RIPK1CASR
SCHEMBL4074326 0.82 HDAC4 (0.37) TYRRIPK1SMN1; SMN2HPGDHTT
SCHEMBL4187976 0.82 GAA (0.40) L3MBTL1HPGDHTT
SCHEMBL449053 0.82
SCHEMBL28217326 0.80 RIPK1 (0.44) RIPK1CASR
SCHEMBL16703233 0.80
SCHEMBL449071 0.79 RIPK1 (0.35) RIPK1CASR
SCHEMBL20586297 0.79 TSHR (0.44) IDO1TYRCYP2D6CYP2C9HIF1A
SCHEMBL13497350 0.77 IDO1 (0.55) IDO1SMN1; SMN2L3MBTL1HTTACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-8111125-A None JP disclosed
JP-6309931-A None JP disclosed
JP-8222026-A None JP disclosed
EP-2048174-B1 INSULATING POLYMER MATERIAL COMPOSITION MEIDENSHA ELECTRIC MFG CO LTD (JP) 2014-10-08 EP disclosed
US-20090312518-A1 INSULATING POLYMER MATERIAL COMPOSITION MEIDENSHA CORPORATION 2009-12-17 US disclosed
US-20090198040-A1 INSULATING POLYMER MATERIAL COMPOSITION MEIDENSHA CORPORATION 2009-08-06 US disclosed
EP-2048174-A1 INSULATING POLYMER MATERIAL COMPOSITION Meidensha Corporation (JP) 2009-04-15 EP disclosed
EP-2048175-A1 INSULATING POLYMER MATERIAL COMPOSITION Meidensha Corporation (JP) 2009-04-15 EP disclosed
US-6534119-B1 Wire and a process for its production MITSUI CHEMICALS, INC. (JP) 2003-03-18 US disclosed
JP-H08222026-A COMPOSITION FOR ELECTRICAL INSULATION AND ELECTRIC CABLE HITACHI CABLE LTD 1996-08-30 JP disclosed
JP-H08111125-A ELECTRIC WIRE/CABLE HITACHI CABLE LTD 1996-04-30 JP disclosed
JP-H06309931-A ELECTRICALLY INSULATIVE COMPOSITION AND ELECTRIC WIRE/ CABLE HITACHI CABLE LTD 1994-11-04 JP disclosed