Known targets — ChEMBL curated mechanism
ADORA1ADORA2AADORA2BADORA3PDE3APDE3BPDE4APDE4BPDE4CPDE4D
The experimentally established mechanism targets of Ethylenediamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.74 |
| ▸ | BLM | P54132 | 2/20 | 0.74 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.74 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.74 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.74 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.63 |
| ▸ | TYMS | P04818 | 1/20 | 0.61 |
| ▸ | LPAR3 | Q9UBY5 | 3/20 | 0.59 |
| ▸ | LPAR2 | Q9HBW0 | 1/20 | 0.59 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.46 |
| ▸ | GABBR2 | O75899 | 1/20 | 0.46 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 1/20 | 0.46 |
| ▸ | THPO | P40225 | 1/20 | 0.46 |
| ▸ | GABBR1 | Q9UBS5 | 1/20 | 0.46 |
| ▸ | BBOX1 | O75936 | 2/20 | 0.44 |
| ▸ | ENPEP | Q07075 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethylenediamine SCHEMBL5157252 | 1.00 | LMNA (0.74) | LMNABLMCYP3A4NFKB1PMP22 | |
| Ethylenediamine SCHEMBL69119 | 0.97 | LMNA (0.78) | LMNABLMCYP3A4NFKB1PMP22 | |
| Ethylenediamine SCHEMBL15053407 | 0.94 | LMNA (0.74) | LMNABLMCYP3A4NFKB1PMP22 | |
| Ethylenediamine SCHEMBL11090194 | 0.94 | LMNA (0.74) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL4530130 | 0.92 | LMNA (0.79) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL4532973 | 0.92 | LMNA (0.79) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL4524881 | 0.92 | LMNA (0.79) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL768276 | 0.92 | LMNA (0.79) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL4517389 | 0.92 | LMNA (0.79) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL767253 | 0.92 | LMNA (0.79) | LMNABLMCYP3A4NFKB1PMP22 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090008600-A1 | METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE | APPLIED MATERIALS, INC. | 2009-01-08 | — | — | US | disclosed |
| US-7390744-B2 | Method and composition for polishing a substrate | APPLIED MATERIALS, INC. (US) | 2008-06-24 | — | — | US | disclosed |
| US-20070295611-A1 | METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE | APPLIED MATERIALS, INC. | 2007-12-27 | — | — | US | disclosed |
| US-7232514-B2 | Method and composition for polishing a substrate | APPLIED MATERIALS, INC. (US) | 2007-06-19 | — | — | US | disclosed |
| US-7160432-B2 | Method and composition for polishing a substrate | APPLIED MATERIALS, INC. (US) | 2007-01-09 | — | — | US | disclosed |
| US-7128825-B2 | Method and composition for polishing a substrate | APPLIED MATERIALS, INC. (US) | 2006-10-31 | — | — | US | disclosed |
| US-20050233578-A1 | Method and composition for polishing a substrate | APPLIED MATERIALS, INC. | 2005-10-20 | — | — | US | disclosed |
| US-20050092620-A1 | Methods and apparatus for polishing a substrate | APPLIED MATERIALS, INC. | 2005-05-05 | — | — | US | disclosed |
| WO-2004111146-A1 | POLISHING COMPOSITION AND METHOD FOR POLISHING A CONDUCTIVE MATERIAL | APPLIED MATERIALS, INC. (US) | 2004-12-23 | — | — | WO | disclosed |
| US-6830503-B1 | Catalyst/oxidizer-based CMP system for organic polymer films | CABOT MICROELECTRONICS CORPORATION | 2004-12-14 | — | — | US | disclosed |
| US-6604987-B1 | CMP compositions containing silver salts | CABOT MICROELECTRONICS CORPORATION | 2003-08-12 | — | — | US | disclosed |
| US-20020077035-A1 | Ion exchange materials for chemical mechanical polishing | APPLIED MATERIALS, INC. | 2002-06-20 | — | — | US | disclosed |
| US-6316366-B1 | Method of polishing using multi-oxidizer slurry | CABOT MICROELECTRONICS CORPORATION | 2001-11-13 | — | — | US | disclosed |
| US-6039891-A | POLISHING COMPOSITION OF UREA, ALUMINA, AMMONIUM PERSULFATE AND SUCCINIC ACID | CABOT CORPORATION (US) | 2000-03-21 | — | — | US | disclosed |
| US-6033596-A | ALUMINA, UREA HYDROGEN PEROXIDE, AMMONIUM PERSULFATE, SUCCINIC ACID | CABOT CORPORATION (US) | 2000-03-07 | — | — | US | disclosed |
| EP-0866830-A1 | POLYESTER PARTICLES | MONSANTO COMPANY (US) | 1998-09-30 | — | — | EP | disclosed |
| US-5783489-A | COMPRISING WATER, AN ABRASIVE, A FIRST OXIDIZER AND A SECOND OXIDIZER; LOW DIELECTRIC POLISHING SELECTIVITY; HIGH POLISHING SELECTIVITIES TOWARDS TITANIUM, TITANIUM NITRIDE AND ALUMINUM ALLOY; INTEGRATED CIRCUITS | CABOT CORPORATION (US) | 1998-07-21 | — | — | US | disclosed |
| WO-1998013536-A1 | MULTI-OXIDIZER SLURRY FOR CHEMICAL MECHANICAL POLISHING | CABOT CORPORATION (US) | 1998-04-02 | — | — | WO | disclosed |
| EP-0831136-A2 | Multi-oxidizer slurry for chemical mechanical polishing | CABOT CORPORATION (US) | 1998-03-25 | — | — | EP | disclosed |
| WO-1997022654-A1 | POLYESTER PARTICLES | MONSANTO COMPANY (US) | 1997-06-26 | — | — | WO | disclosed |