Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL4168987

COC(=O)Oc1ccc([S+](C)C)cc1.O=S(=O)([O-])C(F)(F)F

nearest known ligand 0.40

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MMP2 P08253 1/20 0.40
▸ MMP9 P14780 1/20 0.40
▸ MMP14 P50281 1/20 0.40
▸ ELANE P08246 5/20 0.36
▸ KMT2A Q03164 3/20 0.35
▸ MAPT P10636 2/20 0.35
▸ POLB P06746 1/20 0.35
▸ PKM P14618 1/20 0.35
▸ MEN1 O00255 1/20 0.35
▸ CXCR2 P25025 1/20 0.34
▸ PRTN3 P24158 1/20 0.33
▸ CNR1 P21554 1/20 0.33
▸ KCNH2 Q12809 1/20 0.33
▸ ACHE P22303 3/20 0.33
▸ ALDH1A1 P00352 1/20 0.33
▸ LMNA P02545 1/20 0.33
▸ HTT P42858 1/20 0.33
▸ HSD17B10 Q99714 1/20 0.33
▸ MMP1 P03956 2/20 0.32
▸ MMP13 P45452 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29634757 0.88 MMP2 (0.44) MMP2MMP9MMP14ELANEKMT2A
Trifluoromethanesulfonic Acid SCHEMBL4175814 0.85 MAPT (0.51) ELANEKMT2AMAPTPOLBPKM
SCHEMBL6561499 0.84 KMT2A (0.46) MMP2MMP9MMP14ELANEKMT2A
Trifluoromethanesulfonic Acid SCHEMBL31564959 0.82 SRD5A1 (0.41) ELANEKMT2AMAPTPOLBPKM
SCHEMBL31038957 0.82 MMP9 (0.42) MMP2MMP9MMP14MAPTPOLB
Trifluoromethanesulfonic Acid SCHEMBL30925711 0.82 THRB (0.42) MMP2MMP9ELANEMAPTPOLB
Trifluoromethanesulfonic Acid SCHEMBL5146818 0.82 KCNH2 (0.46) MMP2MMP9KMT2APKMKCNH2
Trifluoromethanesulfonic Acid SCHEMBL4178807 0.81 MMP2 (0.37) MMP2MMP9MMP14CNR1ALDH1A1
Trifluoromethanesulfonic Acid SCHEMBL31564995 0.81 ELANE (0.43) ELANEKMT2AMAPTPOLBPKM
Trifluoromethanesulfonic Acid SCHEMBL30536267 0.77 KIF11 (0.43) MMP2MMP9MMP14ACHEALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12434998-B2 Resin-coated ultra-thin glass TORAY INDUSTRIES, INC. (JP) 2025-10-07 — — US disclosed
CN-114730132-B Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2025-05-09 — — CN disclosed
CN-116648353-B Resin coated ultra-thin plate glass and display device 东丽株式会社 2025-01-21 — — CN disclosed
CN-114761466-B Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2024-12-10 — — CN disclosed
CN-114008527-B Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polyimide or polyimide precursor 富士胶片株式会社 2024-11-01 — — CN disclosed
US-20230365458-A1 RESIN-COATED ULTRA-THIN GLASS TORAY INDUSTRIES, INC. (JP) 2023-11-16 — — US disclosed
CN-115867866-A Method for producing cured product, resin composition, developer, method for producing laminate, and method for producing semiconductor device 富士胶片株式会社 2023-03-28 — — CN disclosed
CN-115768832-A Resin composition, method for producing same, and method for producing composition for pattern formation 富士胶片株式会社 2023-03-07 — — CN disclosed
CN-115190891-A Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2022-10-14 — — CN disclosed
CN-115103871-A Resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2022-09-23 — — CN disclosed
CN-114761466-A Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2022-07-15 — — CN disclosed
CN-114730132-A Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2022-07-08 — — CN disclosed
CN-108700836-B Method for manufacturing laminate and method for manufacturing semiconductor device 富士胶片株式会社 2022-06-28 — — CN disclosed
CN-112368336-A Resin composition and cured film thereof 东丽株式会社 2021-02-12 — — CN disclosed
CN-108026253-B Polymer compound and method for producing same, resin composition, film, solid-state imaging device and method for producing same, and optical device 东丽株式会社 2020-06-12 — — CN disclosed
WO-2020045214-A1 RESIN COMPOSITION AND CURED FILM OBTAINED THEREFROM 東レ株式会社 2020-03-05 — — WO disclosed
EP-1942150-B1 SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES (JP) 2018-08-22 — — EP disclosed
US-20120237873-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM TORAY INDUSTRIES INC. (JP) 2012-09-20 — — US disclosed
US-20090105360-A1 SILOXANE RESIN COMPOSITION AND PRODUCTION METHOD THEREOF TORAY INDUSTRIES, INC. (JP) 2009-04-23 — — US disclosed
EP-1942150-A1 SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES, INC. (JP) 2008-07-09 — — EP disclosed
Send feedback