Known targets — ChEMBL curated mechanism
ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MMP2 | P08253 | 3/20 | 0.44 |
| ▸ | MMP9 | P14780 | 3/20 | 0.44 |
| ▸ | MMP14 | P50281 | 2/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | MEN1 | O00255 | 2/20 | 0.39 |
| ▸ | POLB | P06746 | 1/20 | 0.39 |
| ▸ | PKM | P14618 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.36 |
| ▸ | ELANE | P08246 | 3/20 | 0.36 |
| ▸ | MMP1 | P03956 | 4/20 | 0.35 |
| ▸ | MMP13 | P45452 | 3/20 | 0.35 |
| ▸ | CA1 | P00915 | 1/20 | 0.34 |
| ▸ | CA2 | P00918 | 1/20 | 0.34 |
| ▸ | MMP8 | P22894 | 1/20 | 0.34 |
| ▸ | ACR | P10323 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6561499 | 0.90 | KMT2A (0.46) | MMP2MMP9MMP14KMT2AMAPT | |
| Trifluoromethanesulfonic Acid SCHEMBL4168987 | 0.88 | MMP2 (0.40) | MMP2MMP9MMP14KMT2AMAPT | |
| SCHEMBL31038957 | 0.87 | MMP9 (0.42) | MMP2MMP9MMP14MAPTPOLB | |
| SCHEMBL9574184 | 0.81 | ELANE (0.51) | MMP2MMP9MMP14KMT2AMAPT | |
| SCHEMBL10434604 | 0.80 | KMT2A (0.50) | KMT2AMAPTMEN1POLBPKM | |
| SCHEMBL9619082 | 0.79 | MAPT (0.40) | MMP2MMP9MMP14KMT2AMAPT | |
| SCHEMBL30313539 | 0.78 | ELANE (0.48) | KMT2AMAPTMEN1POLBPKM | |
| SCHEMBL9646952 | 0.77 | MAPT (0.54) | KMT2AMAPTMEN1POLBPKM | |
| SCHEMBL676909 | 0.76 | KMT2A (0.58) | MMP2MMP9MMP14KMT2AMAPT | |
| SCHEMBL9356342 | 0.76 | ELANE (0.53) | KMT2AMAPTMEN1POLBPKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114730132-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-114761466-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2024-12-10 | — | — | CN | disclosed |
| CN-114008527-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polyimide or polyimide precursor | 富士胶片株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-115867866-A | Method for producing cured product, resin composition, developer, method for producing laminate, and method for producing semiconductor device | 富士胶片株式会社 | 2023-03-28 | — | — | CN | disclosed |
| CN-115768832-A | Resin composition, method for producing same, and method for producing composition for pattern formation | 富士胶片株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115190891-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-115103871-A | Resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-09-23 | — | — | CN | disclosed |
| CN-115038755-A | Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-114981360-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-08-30 | — | — | CN | disclosed |
| CN-114761466-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2022-07-15 | — | — | CN | disclosed |
| CN-114730145-A | Pattern forming method, photocurable resin composition, method for producing laminate, and method for producing electronic device | 富士胶片株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-114730132-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-108700836-B | Method for manufacturing laminate and method for manufacturing semiconductor device | 富士胶片株式会社 | 2022-06-28 | — | — | CN | disclosed |
| CN-114514470-A | Pattern forming method, photosensitive resin composition, method for manufacturing laminate, and method for manufacturing semiconductor device | 富士胶片株式会社 | 2022-05-17 | — | — | CN | disclosed |