Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KIF11 | P52732 | 3/20 | 0.38 |
| ▸ | HDAC3 | O15379 | 3/20 | 0.36 |
| ▸ | HDAC4 | P56524 | 3/20 | 0.36 |
| ▸ | HDAC1 | Q13547 | 3/20 | 0.36 |
| ▸ | HDAC7 | Q8WUI4 | 3/20 | 0.36 |
| ▸ | HDAC2 | Q92769 | 3/20 | 0.36 |
| ▸ | HDAC10 | Q969S8 | 3/20 | 0.36 |
| ▸ | HDAC11 | Q96DB2 | 3/20 | 0.36 |
| ▸ | HDAC8 | Q9BY41 | 3/20 | 0.36 |
| ▸ | HDAC6 | Q9UBN7 | 3/20 | 0.36 |
| ▸ | HDAC9 | Q9UKV0 | 3/20 | 0.36 |
| ▸ | HDAC5 | Q9UQL6 | 3/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | IDO1 | P14902 | 1/20 | 0.32 |
| ▸ | KCNN4 | O15554 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.32 |
| ▸ | DRD2 | P14416 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19064319 | 0.78 | KIF11 (0.38) | KIF11TSHRKCNN4ALDH1A1TAAR1 | |
| SCHEMBL4660210 | 0.78 | KIF11 (0.38) | KIF11SMN1; SMN2LMNAKCNN4CYP2D6 | |
| SCHEMBL9106222 | 0.77 | KIF11 (0.61) | KIF11HDAC3HDAC4HDAC1HDAC7 | |
| SCHEMBL7452693 | 0.76 | KIF11 (0.39) | KIF11HDAC3HDAC4HDAC1HDAC7 | |
| SCHEMBL29214644 | 0.75 | SIGMAR1 (0.40) | MEN1KMT2A | |
| SCHEMBL7427624 | 0.73 | TDP1 (0.37) | KIF11SMN1; SMN2TSHRKCNN4ALDH1A1 | |
| SCHEMBL864054 | 0.73 | KCNN4 (0.41) | KIF11SMN1; SMN2LMNATSHRKCNN4 | |
| SCHEMBL4661593 | 0.70 | KIF11 (0.32) | KIF11 | |
| SCHEMBL6404738 | 0.70 | KIF11 (0.57) | KIF11HDAC3HDAC4HDAC1HDAC7 | |
| SCHEMBL14954530 | 0.68 | TSHR (0.40) | KIF11SMN1; SMN2TSHRKCNN4ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | claimed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | claimed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | claimed |
| US-20090121251-A1 | Siloxane-hydantoin copolymer, optoelectronic device encapsulated therewith and method | LUMINATION LLC | 2009-05-14 | — | — | US | disclosed |
| US-20080160317-A1 | Optoelectronic device | GELCORE LLC | 2008-07-03 | — | — | US | disclosed |
| US-20080001140-A1 | Optoelectronic device | GELCORE LLC | 2008-01-03 | — | — | US | disclosed |
| US-20070299162-A1 | Light emitting semiconductor and encapsulant is made from nano-functionalized zirconia; silicone epoxy, epoxy isocyanurate and succinic anhydride, dodecenylsuccinic anhydride, phthalic anhydride curing agent; ancillary curing catalyst, cure modifier, coupling agent, UV, thermal stabilizer | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| US-20070295956-A1 | Optoelectronic device | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| US-20070295983-A1 | Optoelectronic device | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| EP-1408087-B1 | Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method | GEN ELECTRIC (US) | 2007-10-10 | — | — | EP | disclosed |
| US-7144763-B2 | light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging | GENERAL ELECTRIC COMPANY (US) | 2006-12-05 | — | — | US | disclosed |
| US-6617401-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | disclosed |
| US-6617400-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | disclosed |
| US-20030071366-A1 | For encapsulating a solid state device, such as a light emitting diode | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| US-20030071368-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| US-20030071367-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| EP-1285939-A1 | Epoxy resin compositions and solid state devices encapsulated therewith | GENERAL ELECTRIC COMPANY (US) | 2003-02-26 | — | — | EP | disclosed |
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | disclosed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | disclosed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | disclosed |