SCHEMBL422110

SCHEMBL422110

C=C(C)C(=O)OCCCCOC(=O)C1CCCCC1C(=O)OCCCCOC(=O)C(=C)C

nearest known ligand 0.64

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.56
THRB P10828 1/20 0.44
POLB P06746 1/20 0.43
APEX1 P27695 1/20 0.43
HTT P42858 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ALDH1A1 P00352 2/20 0.42
TP53 P04637 1/20 0.42
CYP3A4 P08684 1/20 0.42
FKBP1A P62942 3/20 0.36
EPHX1 P07099 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL422679 0.97 TSHR (0.51) TSHRTHRBPOLBAPEX1HTT
SCHEMBL194104 0.94 TSHR (0.50) TSHRTHRBPOLBAPEX1HTT
SCHEMBL208911 0.93 THRB (0.52) TSHRTHRBPOLBAPEX1HTT
SCHEMBL12192405 0.92 TSHR (0.53) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16466670 0.91 TSHR (0.46) TSHRTHRBPOLBAPEX1HTT
SCHEMBL195287 0.91 TSHR (0.46) TSHRTHRBPOLBAPEX1HTT
SCHEMBL14473517 0.87 THRB (0.46) TSHRTHRBPOLBAPEX1HTT
SCHEMBL513380 0.87 THRB (0.46) TSHRTHRBPOLBAPEX1HTT
SCHEMBL73761 0.87 THRB (0.46) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16466610 0.87 THRB (0.46) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170160637-A9 UPPER LAYER-FORMING COMPOSITION AND RESIST PATTERNING METHOD JSR CORPORATION (JP) 2017-06-08 US disclosed
US-20160109801-A1 UPPER LAYER-FORMING COMPOSITION AND RESIST PATTERNING METHOD JSR CORPORATION (JP) 2016-04-21 US disclosed
US-9285681-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2016-03-15 US disclosed
US-9261789-B2 Liquid immersion lithography upper-layer film-forming composition and photoresist pattern-forming method JSR CORPORATION (JP) 2016-02-16 US disclosed
US-9086532-B2 Blue photosensitive resin composition for color filter and uses thereof CHI MEI CORPORATION (TW) 2015-07-21 US disclosed
US-9029051-B2 Photosensitive resin composition, color filter and liquid crystal display device CHI MEI CORPORATION (TW) 2015-05-12 US disclosed
US-20150042931-A1 BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTER AND USES THEREOF CHI MEI CORPORATION (TW) 2015-02-12 US disclosed
US-20140356786-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2014-12-04 US disclosed
US-8722768-B2 Liquid resin composition and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2014-05-13 US disclosed
US-8697344-B2 Composition for forming upper layer film for immersion exposure, upper layer film for immersion exposure, and method of forming photoresist pattern JSR CORPORATION (JP) 2014-04-15 US disclosed
US-20130244177-A1 PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER AND LIQUID CRYSTAL DISPLAY DEVICE CHI MEI CORPORATION (TW) 2013-09-19 US disclosed
US-20130216961-A1 COMPOSITION FOR FORMING UPPER LAYER FILM FOR IMMERSION EXPOSURE, UPPER LAYER FILM FOR IMMERSION EXPOSURE, AND METHOD OF FORMING PHOTORESIST PATTERN JSR CORPORATION (JP) 2013-08-22 US disclosed
EP-2624287-A1 LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2013-08-07 EP disclosed
US-20130143983-A1 LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2013-06-06 US disclosed
US-8431332-B2 Composition for forming upper layer film for immersion exposure, upper layer film for immersion exposure, and method of forming photoresist pattern JSR CORPORATION (JP) 2013-04-30 US disclosed
US-20120021359-A1 UPPER LAYER-FORMING COMPOSITION AND RESIST PATTERNING METHOD JSR CORPORATION (JP) 2012-01-26 US disclosed
US-20100255416-A1 COMPOSITION FOR FORMING UPPER LAYER FILM FOR IMMERSION EXPOSURE, UPPER LAYER FILM FOR IMMERSION EXPOSURE, AND METHOD OF FORMING PHOTORESIST PATTERN JSR CORPORATION (JP) 2010-10-07 US disclosed