SCHEMBL425864

SCHEMBL425864

COc1cccc([PH](=O)C(=O)c2c(C)cc(C)cc2C)c1OC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ABCB1 P08183 1/20 0.39
LMNA P02545 3/20 0.38
ALDH1A1 P00352 2/20 0.38
NPC1 O15118 2/20 0.38
RAB9A P51151 2/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
KDM4E B2RXH2 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
CA12 O43570 1/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
CA7 P43166 1/20 0.38
CA9 Q16790 1/20 0.38
CA14 Q9ULX7 1/20 0.38
NFE2L2 Q16236 2/20 0.38
KMT2A Q03164 2/20 0.37
MEN1 O00255 1/20 0.37
MAPT P10636 2/20 0.36
KCNB1 Q14721 1/20 0.36
HTT P42858 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL710802 0.87 ABCB1 (0.44) ABCB1LMNAALDH1A1NPC1RAB9A
SCHEMBL425712 0.81 MAPT (0.38) ALDH1A1KDM4EMAPTL3MBTL1GAA
SCHEMBL7175680 0.80 HPGD (0.40) LMNAALDH1A1SMN1; SMN2KDM4ENPSR1
SCHEMBL28061700 0.79 CA12 (0.43) LMNAALDH1A1SMN1; SMN2KDM4ECA12
SCHEMBL27762470 0.77 CA12 (0.46) ABCB1LMNAALDH1A1KDM4ENPSR1
SCHEMBL29044846 0.77 RAPGEF4 (0.37) LMNAALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL28049109 0.77 ALDH1A1 (0.40) LMNAALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL28200325 0.76 LMNA (0.36) LMNAALDH1A1SMN1; SMN2KDM4ENPSR1
SCHEMBL710598 0.76 THRB (0.41) LMNAALDH1A1NPC1RAB9AKDM4E
SCHEMBL155285 0.76 IRAK4 (0.40) ABCB1LMNAALDH1A1KDM4ENPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12421425-B2 Resin composition and display apparatus including the same SAMSUNG DISPLAY CO., LTD. (KR) 2025-09-23 US disclosed
US-20240043596-A1 ULTRAVIOLET CURABLE RESIN COMPOSITION DENKA COMPANY LIMITED (JP) 2024-02-08 US disclosed
US-20240043575-A1 ULTRAVIOLET CURABLE RESIN COMPOSITION DENKA COMPANY LIMITED (JP) 2024-02-08 US disclosed
WO-2024024687-A1 PHOTOCURABLE COMPOSITION, CURED PRODUCT OF PHOTOCURABLE COMPOSITION, AND LIGHT EMITTING DISPLAY DEVICE デンカ株式会社 2024-02-01 WO disclosed
EP-4269103-A1 ULTRAVIOLET-CURABLE RESIN COMPOSITION Denka Company Limited (JP) 2023-11-01 EP disclosed
EP-4269102-A1 ULTRAVIOLET-CURABLE RESIN COMPOSITION Denka Company Limited (JP) 2023-11-01 EP disclosed
WO-2023182283-A1 SEALING AGENT AND SEALING MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENTS, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, AND METHOD FOR PRODUCING SEALING AGENT FOR ORGANIC ELECTROLUMINESCENT ELEMENTS デンカ株式会社 2023-09-28 WO disclosed
WO-2023182281-A1 ENCAPSULANT FOR ORGANIC ELECTROLUMINESCENT ELEMENT, ENCAPSULATION MATERIAL, AND ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE デンカ株式会社 2023-09-28 WO disclosed
US-20230265314-A1 RESIN COMPOSITION AND DISPLAY APPARATUS INCLUDING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2023-08-24 US disclosed
US-20220411668-A1 ADHESIVE FILM FOR DISPLAY INNOX ADVANCED MATERIALS CO., LTD. (KR) 2022-12-29 US disclosed
US-20130248104-A1 METHOD OF PROCESSING TRANSLUCENT RIGID SUBSTRATE LAMINATE, AND PROCESS OF MANUFACTURING PLATE-SHAPED PRODUCT EMPLOYING THE METHOD DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2013-09-26 US disclosed
US-20120018088-A1 METHOD FOR CONNECTING ELECTRODES AND BONDING COMPOSITION USED THEREFOR HENKEL CORPORATION (US) 2012-01-26 US disclosed
US-8048258-B2 Resin composition, and temporary fixing method and surface protecting method for members to be processed, by means thereof DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2011-11-01 US disclosed
US-7988811-B2 Adhesive composition and method for temporarily fixing member by using the same DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2011-08-02 US disclosed
US-20110128023-A1 PROBE INSPECTING METHOD AND CURABLE RESIN COMPOSITION DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2011-06-02 US disclosed
EP-2030995-B1 RESIN COMPOSITION, AND TEMPORARY FIXATION METHOD AND SURFACE PROTECTION METHOD FOR MEMBER TO BE PROCESSED EACH USING THE RESIN COMPOSITION DENKI KAGAKU KOGYO KK (JP) 2010-06-23 EP disclosed
US-20100000670-A1 ADHESIVE COMPOSITION AND METHOD FOR TEMPORARILY FIXING MEMBER BY USING THE SAME DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2010-01-07 US disclosed
US-20090196987-A1 RESIN COMPOSITION, AND TEMPORARY FIXATION METHOD AND SURFACE PROTECTION METHOD FOR MEMBER TO BE PROCESSED EACH USING THE RESIN COMPOSITION NATIONAL UNIVERSITY CORPORATION TOKYO MEDICAL AND DENTAL UNIVERITY 2009-08-06 US disclosed
EP-2050799-A1 ADHESIVE COMPOSITION AND METHOD FOR TEMPORARILY FIXING MEMBER BY USING THE SAME Denki Kagaku Kogyo Kabushiki Kaisha (JP) 2009-04-22 EP disclosed
EP-2030995-A1 RESIN COMPOSITION, AND TEMPORARY FIXATION METHOD AND SURFACE PROTECTION METHOD FOR MEMBER TO BE PROCESSED EACH USING THE RESIN COMPOSITION Denki Kagaku Kogyo Kabushiki Kaisha (JP) 2009-03-04 EP disclosed