Known targets — ChEMBL curated mechanism
GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5883448 | 0.92 | FDPS (0.37) | FDPSSLC34A1 | |
| SCHEMBL1766191 | 0.92 | FDPS (0.37) | FDPSSLC34A1 | |
| SCHEMBL7939080 | 0.84 | — | — | |
| SCHEMBL2127103 | 0.83 | FDPS (0.39) | FDPSSLC34A1 | |
| SCHEMBL61410 | 0.81 | FDPS (0.48) | FDPS | |
| SCHEMBL906524 | 0.78 | LMNA (0.30) | — | |
| SCHEMBL7940236 | 0.78 | — | — | |
| SCHEMBL7939094 | 0.78 | — | — | |
| SCHEMBL7931667 | 0.78 | — | — | |
| Potassium Ion SCHEMBL6009416 | 0.78 | SLC34A1 (0.35) | SLC34A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090143511-A1 | ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090137717-A1 | ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-7397139-B2 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20060214153-A1 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2006-09-28 | — | — | US | disclosed |
| JP-2000226499-A | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE | HITACHI CHEM CO LTD | 2000-08-15 | — | — | JP | disclosed |