SCHEMBL4326288

SCHEMBL4326288

CCCCOCCC(C)OC(C)=O

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.45
FAAH O00519 5/20 0.42
TSHR P16473 4/20 0.42
CHRM2 P08172 1/20 0.41
CHRM4 P08173 1/20 0.41
CHRM1 P11229 1/20 0.41
TBXA2R P21731 1/20 0.41
MAPT P10636 2/20 0.40
CES2 O00748 1/20 0.40
GALR3 O60755 1/20 0.40
BLM P54132 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
CNR1 P21554 1/20 0.38
CNR2 P34972 1/20 0.38
PLA2G2C Q5R387 1/20 0.38
HSD17B10 Q99714 1/20 0.38
CYP3A4 P08684 1/20 0.37
PTGS2 P35354 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4329575 0.89 TSHR (0.44) ALDH1A1FAAHTSHRCHRM2CHRM4
SCHEMBL11518644 0.85 TSHR (0.42) ALDH1A1FAAHTSHRMAPTCES2
SCHEMBL11529240 0.85 TSHR (0.42) ALDH1A1FAAHTSHRMAPTCES2
SCHEMBL11529242 0.84 TSHR (0.41) ALDH1A1FAAHTSHRMAPTCES2
SCHEMBL28120656 0.84 ALDH1A1 (0.44) ALDH1A1TSHRCHRM2CHRM4CHRM1
SCHEMBL107643 0.83 ALDH1A1 (0.47) ALDH1A1TSHRCHRM2CHRM4CHRM1
SCHEMBL296975 0.82 TSHR (0.48) ALDH1A1FAAHTSHRCHRM2CHRM4
SCHEMBL181003 0.82 FAAH (0.53) ALDH1A1FAAHTSHRCHRM2CHRM4
Water SCHEMBL27447449 0.81 ALDH1A1 (0.45) ALDH1A1TSHRCHRM2CHRM4CHRM1
SCHEMBL11518649 0.81 TSHR (0.38) ALDH1A1FAAHTSHRMAPTCES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215318-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT TOKYO OHKA KOGYO CO., LTD. (JP) 2025-07-03 US disclosed
WO-2023204141-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 東京応化工業株式会社 2023-10-26 WO disclosed
CN-111624852-A Photosensitive resin composition and method for etching glass substrate 东京应化工业株式会社 2020-09-04 CN disclosed
US-20090324831-A1 CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-31 US disclosed