SCHEMBL4329575

SCHEMBL4329575

CCCOCCC(C)OC(C)=O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.44
CHRM2 P08172 1/20 0.44
CHRM4 P08173 1/20 0.44
CHRM1 P11229 1/20 0.44
TBXA2R P21731 1/20 0.44
GALR3 O60755 1/20 0.42
MAPT P10636 1/20 0.42
BLM P54132 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
HSD17B10 Q99714 1/20 0.39
FAAH O00519 5/20 0.38
TDP1 Q9NUW8 1/20 0.37
ALDH1A1 P00352 2/20 0.34
ALOX15 P16050 2/20 0.33
CNR1 P21554 1/20 0.33
CNR2 P34972 1/20 0.33
TRPV1 Q8NER1 1/20 0.33
NOS3 P29474 1/20 0.31
NOS1 P29475 1/20 0.31
NOS2 P35228 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4326288 0.89 ALDH1A1 (0.45) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL296975 0.86 TSHR (0.48) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL21850333 0.82 FAAH (0.39) MAPTHSD17B10FAAHTDP1ALDH1A1
SCHEMBL105187 0.82 TDP1 (0.52) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL23529849 0.81 TSHR (0.64) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL21850400 0.81 ALDH1A1 (0.40) MAPTHSD17B10FAAHTDP1ALDH1A1
SCHEMBL13034085 0.81
SCHEMBL14396410 0.81
SCHEMBL97889 0.81
Methyl Alcohol SCHEMBL15345249 0.80 TDP1 (0.50) TSHRCHRM2CHRM4CHRM1TBXA2R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215318-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT TOKYO OHKA KOGYO CO., LTD. (JP) 2025-07-03 US disclosed
WO-2023204141-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 東京応化工業株式会社 2023-10-26 WO disclosed
CN-111624852-A Photosensitive resin composition and method for etching glass substrate 东京应化工业株式会社 2020-09-04 CN disclosed
US-20090324831-A1 CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-31 US disclosed
EP-2048196-A1 CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM Daicel Chemical Industries, Ltd. (JP) 2009-04-15 EP disclosed