SCHEMBL4349485

SCHEMBL4349485

C=C(C)C(=O)OCc1cc(CO)c2ccccc2c1

nearest known ligand 0.41

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TACR1 P25103 4/20 0.41
F2 P00734 2/20 0.39
ALDH1A1 P00352 3/20 0.37
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
HPGD P15428 2/20 0.37
MAPT P10636 1/20 0.37
SIRT5 Q9NXA8 1/20 0.35
ATM Q13315 1/20 0.35
PARP15 Q460N3 1/20 0.34
PARP10 Q53GL7 1/20 0.34
TOP2A P11388 1/20 0.34
TOP2B Q02880 1/20 0.34
NPC1 O15118 1/20 0.33
RAB9A P51151 1/20 0.33
AKR1B1 P15121 1/20 0.33
FDPS P14324 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4354595 0.87 TACR1 (0.40) TACR1MEN1KMT2ASIRT5ATM
SCHEMBL28900127 0.82 MTNR1A (0.38) TACR1MEN1KMT2AATMNPC1
SCHEMBL4349486 0.79 MTNR1A (0.40) TACR1MEN1KMT2AATMNPC1
SCHEMBL2036053 0.79 ALDH1A1 (0.40) ALDH1A1MEN1KMT2AHPGDMAPT
SCHEMBL29503697 0.79 TACR1 (0.47) TACR1ALDH1A1RAB9A
SCHEMBL1130685 0.79 KMT2A (0.50) TACR1MEN1KMT2ASIRT5ATM
SCHEMBL29625710 0.79 EPHX1 (0.49) TACR1ALDH1A1MEN1KMT2AHPGD
SCHEMBL2619047 0.79 TACR1 (0.47) TACR1ALDH1A1RAB9A
SCHEMBL216321 0.79 EPHX1 (0.49) TACR1ALDH1A1MEN1KMT2AHPGD
SCHEMBL216103 0.78 MTNR1A (0.46) TACR1ALDH1A1MEN1KMT2ASIRT5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed