Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DRD2 | P14416 | 1/20 | 0.38 |
| ▸ | DRD3 | P35462 | 1/20 | 0.38 |
| ▸ | HTR1A | P08908 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28679348 | 0.86 | DRD2 (0.43) | DRD2DRD3HTR1A | |
| SCHEMBL2421840 | 0.78 | SLC6A3 (0.39) | — | |
| SCHEMBL2237897 | 0.78 | SLC6A3 (0.39) | — | |
| SCHEMBL7937573 | 0.76 | DRD2 (0.37) | DRD2DRD3HTR1A | |
| SCHEMBL27909472 | 0.75 | DRD2 (0.50) | DRD2DRD3HTR1A | |
| SCHEMBL9681051 | 0.74 | HTR1A (0.36) | DRD2DRD3HTR1A | |
| SCHEMBL913262 | 0.72 | DRD2 (0.46) | DRD2DRD3HTR1A | |
| SCHEMBL7938959 | 0.71 | DRD2 (0.34) | DRD2DRD3 | |
| SCHEMBL28062964 | 0.71 | SLC6A3 (0.36) | — | |
| SCHEMBL27547345 | 0.70 | DRD2 (0.41) | DRD2DRD3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7614145-B2 | Method for manufacturing multilayer circuit board and resin base material | ZEON CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| CN-100496195-C | Mulitilayer circuit board, resin base material, and its production method | ZEON CORP (JP) | 2009-06-03 | — | — | CN | disclosed |
| US-20080217617-A1 | Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same | ZEON CORPORATION (JP) | 2008-09-11 | — | — | US | disclosed |
| CN-100383278-C | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board | ZEON CORP (JP) | 2008-04-23 | — | — | CN | disclosed |
| US-20050153059-A1 | Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board | ZEON CORPORATION (JP) | 2005-07-14 | — | — | US | disclosed |
| CN-1639384-A | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board | ZEON CORP (JP) | 2005-07-13 | — | — | CN | disclosed |
| US-20040237295-A1 | Multilayer circuit board and resin base material, and its production method | ZEON CORPORATION (JP) | 2004-12-02 | — | — | US | disclosed |
| CN-1552174-A | Mulitilayer circuit board, resin base material, and its production method | �ձ�������ʽ���� | 2004-12-01 | — | — | CN | disclosed |