SCHEMBL437240

SCHEMBL437240

FN(F)c1ccccc1N(F)F

nearest known ligand 0.33

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
APOBEC3G Q9HC16 1/20 0.33
CYP2A6 P11509 1/20 0.31
ALOX12 P18054 1/20 0.31
ALDH1A1 P00352 1/20 0.31
TP53 P04637 1/20 0.31
GAA P10253 1/20 0.31
MAPT P10636 1/20 0.31
TSHR P16473 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL163434 0.81 ACHE (0.39) ALDH1A1SMN1; SMN2
SCHEMBL29523028 0.81 ACHE (0.39) ALDH1A1SMN1; SMN2
SCHEMBL5730842 0.78 ALDH1A1 (0.38) ALDH1A1GAA
SCHEMBL7654371 0.78 TSHR (0.47) CYP2A6ALDH1A1TSHRSMN1; SMN2
SCHEMBL12476122 0.78 C1R (0.32)
Methane SCHEMBL7871211 0.78 ACHE (0.38) ALDH1A1SMN1; SMN2
SCHEMBL7517260 0.78 CYP3A4 (0.47) APOBEC3GALDH1A1TP53GAAMAPT
SCHEMBL29132912 0.78 ACHE (0.38) ALDH1A1SMN1; SMN2
SCHEMBL9140529 0.77
SCHEMBL7833204 0.77 ALDH1A1 (0.33) ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120040992-A Silver-plated aluminum powder modified by high-temperature-resistant polyimide, and preparation method and application thereof 陕西华秦科技实业股份有限公司 2025-05-27 CN claimed
CN-104744614-A Preparation method of resin for extracting vanadium from stone coal ZHEJIANG QUZHOU WANNENGDA SCIENCE AND TECHNOLOGY CO LTD 2015-07-01 CN claimed
JP-11152335-A None JP disclosed
CN-120040992-A Silver-plated aluminum powder modified by high-temperature-resistant polyimide, and preparation method and application thereof 陕西华秦科技实业股份有限公司 2025-05-27 CN disclosed
CN-115073802-B Organic polymer monolithic column containing fluorine-functionalized covalent organic framework nano-sheets and application thereof 福州大学 2023-06-23 CN disclosed
CN-115073802-A Organic polymerization monolithic column containing fluorine functional covalent organic framework nanosheet and application thereof 福州大学 2022-09-20 CN disclosed
US-11319410-B2 Precursor for polyimide and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2022-05-03 US disclosed
US-10731004-B2 Polyimide precursor composition and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2020-08-04 US disclosed
US-10626220-B2 Precursor for polyimide and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2020-04-21 US disclosed
CN-105590635-B Equipment including amorphous gas-barrier layer 希捷科技有限公司 2019-06-18 CN disclosed
US-20180194899-A1 PRECURSOR FOR POLYIMIDE AND USE THEREOF ETERNAL MATERIALS CO., LTD. (TW) 2018-07-12 US disclosed
US-5449741-A Electronics with impact strength NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1995-09-12 US disclosed
EP-0623830-A1 Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1994-11-09 EP disclosed
US-5233018-A Heat resistance and low optical transmission loss in the near-infrared region; integrated circuits NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1993-08-03 US disclosed
US-5112989-A Process for producing unsaturated mono and dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS LTD. (JP) 1992-05-12 US disclosed
EP-0480266-A2 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-04-15 EP disclosed
US-5047499-A Solution polymerization, trimellitic acid derivative and aromatic diamine, multistage, dehydration catalyst HITACHI CHEMICAL CO., LTD. (JP) 1991-09-10 US disclosed
EP-0387381-A1 Process for producing unsaturated dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1990-09-19 EP disclosed
EP-0382864-A1 Process for the production of high molecular weight polyamide-imide resin Hitachi Chemical Co., Ltd. (JP) 1990-08-22 EP disclosed
US-4046777-A INTERMEDIATES FOR HEAT-RESISTANT POLYMERS CIBA-GEIGY CORPORATION (US) 1977-09-06 US disclosed