Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | TSHR | P16473 | 3/20 | 0.30 |
| ▸ | DPP4 | P27487 | 2/20 | 0.30 |
| ▸ | F2 | P00734 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10801908 | 0.87 | ALDH1A1 (0.40) | ALDH1A1TSHR | |
| SCHEMBL47554 | 0.87 | ALDH1A1 (0.40) | ALDH1A1TSHR | |
| SCHEMBL8076653 | 0.85 | — | — | |
| SCHEMBL5403764 | 0.85 | ACHE (0.43) | TSHR | |
| SCHEMBL645902 | 0.85 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL12762137 | 0.83 | ALDH1A1 (0.38) | ALDH1A1TSHR | |
| Methane SCHEMBL2440754 | 0.83 | ALDH1A1 (0.38) | ALDH1A1TSHR | |
| Methane SCHEMBL3253432 | 0.83 | ALDH1A1 (0.38) | ALDH1A1TSHR | |
| Bromide SCHEMBL60557 | 0.83 | ALDH1A1 (0.38) | ALDH1A1TSHR | |
| SCHEMBL2058664 | 0.83 | ALDH1A1 (0.38) | ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0745633-B1 | Si containing high molecular compound and photosensitive resin composition | NEC CORP (JP) | 2000-08-02 | — | — | EP | claimed |
| WO-2024029445-A1 | RESIST UNDERLAYER FILM FORMING COMPOSITION, AND RESIST PATTERN FORMATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING SAID COMPOSITION | 日産化学株式会社 | 2024-02-08 | — | — | WO | disclosed |
| WO-2024018957-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-01-25 | — | — | WO | disclosed |
| WO-2023162653-A1 | RESIST UNDERLAYER FILM FORMATION COMPOSITION | 日産化学株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023149553-A1 | METHOD FOR IMPROVING HARDNESS OF FIRED PRODUCT | 日産化学株式会社 | 2023-08-10 | — | — | WO | disclosed |
| WO-2023145923-A1 | RESIST UNDERLAYER FILM FORMING COMPOSITION FOR NANOIMPRINTING | 日産化学株式会社 | 2023-08-03 | — | — | WO | disclosed |
| WO-2023100506-A1 | RESIST UNDERLAYER FILM FORMATION COMPOSITION INCLUDING HYDROXYCINNAMIC ACID DERIVATIVE | 日産化学株式会社 | 2023-06-08 | — | — | WO | disclosed |
| WO-2022186231-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION HAVING BENZYLIDENE CYANOACETIC ACID ESTER GROUP | 日産化学株式会社 | 2022-09-09 | — | — | WO | disclosed |
| WO-2021125036-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM FOR NANOIMPRINTING | 日産化学株式会社 | 2021-06-24 | — | — | WO | disclosed |
| WO-2021070775-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2021-04-15 | — | — | WO | disclosed |
| US-6326122-B1 | HEAT SENSITIVE ELEMENTS | MITSUBISHI CHEMICAL CORPORATION (JP) | 2001-12-04 | — | — | US | disclosed |
| US-6313327-B1 | Carboxylic acid derivatives and their synthesis method | KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) | 2001-11-06 | — | — | US | disclosed |
| US-6284430-B1 | Positive-working chemical-amplification photoresist composition and method for forming a resist pattern using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-09-04 | — | — | US | disclosed |
| EP-0985975-A1 | Positive-working chemical-amplification photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-03-15 | — | — | EP | disclosed |
| US-6033826-A | POLYHYDROXYSTYRENE DERIVATIVE CONTAINING AN ACETAL OR KETAL GROUP WHICH CAN EASILY BE ELIMINATED IN THE PRESENCE OF AN ACID IN THE MOLECULE AND HAVING A VERY NARROW MOLECULAR WEIGHT DISTRIBUTION GIVES A RESIST MATERIAL | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2000-03-07 | — | — | US | disclosed |
| US-5723257-A | POLYVINYLSILSESQUIOXANES OR OTHER POLYSILOXANES | NEC CORPORATION (JP) | 1998-03-03 | — | — | US | disclosed |
| EP-0823327-A2 | Positive photosensitive composition, positive photosensitive lithographic printing plate and method for making positive photosensitive lithographic printing plate | Mitsubishi Chemical Corporation (JP) | 1998-02-11 | — | — | EP | disclosed |
| EP-0758102-A1 | Terpolymers containing organosilicon side chains and their use for the production of relief structures | OLIN MICROELECTRONIC CHEMICALS, INC. (US) | 1997-02-12 | — | — | EP | disclosed |
| US-5023164-A | Highly sensitive dry developable deep UV photoresist | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1991-06-11 | — | — | US | disclosed |
| EP-0425411-A2 | Highly sensitive dry developable deep UV photoresist | International Business Machines Corporation (US) | 1991-05-02 | — | — | EP | disclosed |