Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL445270 | 0.91 | FBP1 (0.31) | ALDH1A1LMNA | |
| SCHEMBL7118265 | 0.91 | FBP1 (0.31) | ALDH1A1LMNA | |
| Fluoride Ion SCHEMBL7263684 | 0.88 | FBP1 (0.30) | — | |
| Fluoride Ion SCHEMBL7263681 | 0.88 | FBP1 (0.30) | — | |
| SCHEMBL927141 | 0.86 | — | — | |
| SCHEMBL8418924 | 0.86 | — | — | |
| SCHEMBL740608 | 0.86 | — | — | |
| SCHEMBL9171104 | 0.86 | — | — | |
| SCHEMBL4389080 | 0.85 | ALDH1A1 (0.32) | ALDH1A1 | |
| SCHEMBL1883593 | 0.76 | CES1 (0.32) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0745633-B1 | Si containing high molecular compound and photosensitive resin composition | NEC CORP (JP) | 2000-08-02 | — | — | EP | claimed |
| US-5723257-A | POLYVINYLSILSESQUIOXANES OR OTHER POLYSILOXANES | NEC CORPORATION (JP) | 1998-03-03 | — | — | US | claimed |
| EP-0745633-A2 | Si containing high molecular compound and photosensitive resin composition | NEC CORPORATION (JP) | 1996-12-04 | — | — | EP | claimed |
| US-20150076552-A1 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF | NITTO DENKO CORPORATION (JP) | 2015-03-19 | — | — | US | disclosed |
| US-20130341671-A1 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF | NITTO DENKO CORPORATION (JP) | 2013-12-26 | — | — | US | disclosed |
| EP-2677005-A1 | Silicone resin composition, semi-cured material sheet, producing method of silicone cured material, light emitting diode device, and producing method thereof | NITTO DENKO CORPORATION (JP) | 2013-12-25 | — | — | EP | disclosed |
| US-8119323-B2 | Process for producing patterned film and photosensitive resin composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-20090206328-A1 | Silicon-Containing Photosensitive Composition, Method for Forming Thin Film Pattern Using Same, Protective Film for Electronic Device, Gate Insulating Film And Thin Film Transistor | Matsukawa, Kimihiro (JP) | 2009-08-20 | — | — | US | disclosed |
| US-20090202942-A1 | PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-1835344-A1 | SILICON-CONTAINING PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING THIN FILM PATTERN USING SAME, PROTECTIVE FILM FOR ELECTRONIC DEVICE, GATE INSULATING FILM AND THIN FILM TRANSISTOR | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-09-19 | — | — | EP | disclosed |
| US-6767983-B1 | SILICONE RESINS HAVING SPECIFIED TRIORGANOSILYL GROUP LINKED TO ALL OR PART OF ENDS OF BACKBONE CHAIN OF POLYSILSESQUIOXANES; PHOTORESISTS | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2004-07-27 | — | — | US | disclosed |
| EP-1004936-B1 | RESIST RESIN, RESIST RESIN COMPOSITION, AND PROCESS FOR PATTERNING THEREWITH | SHOWA DENKO KK (JP) | 2003-10-08 | — | — | EP | disclosed |
| US-6303268-B1 | SENSITIVITY TO RADIATION | SHOWA DENKO K.K. (JP) | 2001-10-16 | — | — | US | disclosed |
| EP-0745633-B1 | Si containing high molecular compound and photosensitive resin composition | NEC CORP (JP) | 2000-08-02 | — | — | EP | disclosed |
| EP-1004936-A1 | RESIST RESIN, RESIST RESIN COMPOSITION, AND PROCESS FOR PATTERNING THEREWITH | Showa Denko K K (JP) | 2000-05-31 | — | — | EP | disclosed |
| US-5723257-A | POLYVINYLSILSESQUIOXANES OR OTHER POLYSILOXANES | NEC CORPORATION (JP) | 1998-03-03 | — | — | US | disclosed |
| EP-0745633-A2 | Si containing high molecular compound and photosensitive resin composition | NEC CORPORATION (JP) | 1996-12-04 | — | — | EP | disclosed |