SCHEMBL4389083

SCHEMBL4389083

FC(F)(F)S(c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.41
TSHR P16473 2/20 0.41
HTR6 P50406 1/20 0.41
APOBEC3G Q9HC16 1/20 0.39
CA1 P00915 3/20 0.38
CA2 P00918 3/20 0.38
CA5A P35218 2/20 0.38
CA9 Q16790 2/20 0.38
HSD17B10 Q99714 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
CA12 O43570 1/20 0.38
CA3 P07451 1/20 0.38
CA4 P22748 1/20 0.38
CA6 P23280 1/20 0.38
CA7 P43166 1/20 0.38
PLA2G7 Q13093 1/20 0.38
CA13 Q8N1Q1 1/20 0.38
CA14 Q9ULX7 1/20 0.38
CA5B Q9Y2D0 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23045338 0.86 GAA (0.42) ALDH1A1TSHRCA1CA2CA9
SCHEMBL15865829 0.86 CA12 (0.42) ALDH1A1CA1CA2CA9TDP1
SCHEMBL27898174 0.83 TSHR (0.38) ALDH1A1TSHRHTR6APOBEC3GCA1
SCHEMBL8829563 0.82 HSD11B1 (0.46) ALDH1A1TSHRCA1CA2HSD11B1
SCHEMBL29266699 0.78 CA1 (0.39) ALDH1A1TSHRHTR6CA1CA2
SCHEMBL6279692 0.77 TSHR (0.41) ALDH1A1TSHRHTR6APOBEC3GCA1
SCHEMBL2470750 0.76 HTR6 (0.42) ALDH1A1TSHRHTR6APOBEC3GCA1
SCHEMBL21585240 0.74 ALDH1A1 (0.39) ALDH1A1TSHRHTR6APOBEC3GCA1
SCHEMBL777153 0.72 HTR6 (0.50) ALDH1A1TSHRHTR6APOBEC3GCA1
Perflubutane SCHEMBL28185214 0.71 HSD11B1 (0.41) ALDH1A1TSHRCA1CA2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119087744-A Immersion photoresist composition 万华化学集团股份有限公司 2024-12-06 CN claimed
CN-118732392-A Photoresist composition and preparation method thereof 万华化学集团股份有限公司 2024-10-01 CN claimed
CN-118295208-A Chemical amplification type photoresist and preparation method and application thereof 万华化学集团股份有限公司 2024-07-05 CN claimed
EP-0745633-B1 Si containing high molecular compound and photosensitive resin composition NEC CORP (JP) 2000-08-02 EP claimed
CN-119087744-A Immersion photoresist composition 万华化学集团股份有限公司 2024-12-06 CN disclosed
CN-118732392-A Photoresist composition and preparation method thereof 万华化学集团股份有限公司 2024-10-01 CN disclosed
CN-118295208-A Chemical amplification type photoresist and preparation method and application thereof 万华化学集团股份有限公司 2024-07-05 CN disclosed
WO-2024029445-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION, AND RESIST PATTERN FORMATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING SAID COMPOSITION 日産化学株式会社 2024-02-08 WO disclosed
WO-2024018957-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 日産化学株式会社 2024-01-25 WO disclosed
WO-2023162653-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION 日産化学株式会社 2023-08-31 WO disclosed
WO-2023149553-A1 METHOD FOR IMPROVING HARDNESS OF FIRED PRODUCT 日産化学株式会社 2023-08-10 WO disclosed
WO-2023145923-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION FOR NANOIMPRINTING 日産化学株式会社 2023-08-03 WO disclosed
US-7202011-B2 Photosensitive polymer including fluorine and resist composition containing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-04-10 US disclosed
US-20060281025-A1 Chemically amplified resist material and pattern formation method using the same BARINGS FINANCE LLC, AS COLLATERAL AGENT 2006-12-14 US disclosed
US-20060148266-A1 Pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2006-07-06 US disclosed
US-20030228537-A1 Photosensitive polymer including fluorine and resist composition containing the same SAMSUNG ELECTRONICS CO.; LTD. (KR) 2003-12-11 US disclosed
US-6313327-B1 Carboxylic acid derivatives and their synthesis method KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2001-11-06 US disclosed
US-5380882-A Phenylacetates and the use thereof CIBA-GEIGY CORPORATION (US) 1995-01-10 US disclosed
US-5023164-A Highly sensitive dry developable deep UV photoresist INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1991-06-11 US disclosed
EP-0425411-A2 Highly sensitive dry developable deep UV photoresist International Business Machines Corporation (US) 1991-05-02 EP disclosed