SCHEMBL4433517

SCHEMBL4433517

CCCCN1CCN(CC)C1=O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MEN1 O00255 1/20 0.41
▸ KMT2A Q03164 1/20 0.41
▸ GAA P10253 2/20 0.41
▸ TP53 P04637 1/20 0.41
▸ DPP4 P27487 1/20 0.39
▸ CYP1A1 P04798 4/20 0.38
▸ RGS4 P49798 3/20 0.36
▸ RGS8 P57771 2/20 0.36
▸ GSK3B P49841 1/20 0.36
▸ KDM4E B2RXH2 1/20 0.36
▸ NPC1 O15118 1/20 0.36
▸ ALDH1A1 P00352 1/20 0.36
▸ HPGD P15428 1/20 0.36
▸ TSHR P16473 1/20 0.36
▸ RAB9A P51151 1/20 0.36
▸ SMN1; SMN2 Q16637 1/20 0.36
▸ HSD17B10 Q99714 1/20 0.36
▸ S1PR1 P21453 1/20 0.35
▸ BCHE P06276 1/20 0.35
▸ ACHE P22303 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4424409 0.93 MEN1 (0.45) MEN1KMT2AGAATP53DPP4
SCHEMBL24822290 0.92 PER2 (0.39) MEN1KMT2AGAATP53DPP4
SCHEMBL7044546 0.89 MEN1 (0.42) MEN1KMT2AGAATP53DPP4
SCHEMBL4423724 0.86 L3MBTL1 (0.39) GAACYP1A1GSK3BSMN1; SMN2L3MBTL1
SCHEMBL4421172 0.86 GBA1 (0.44) MEN1KMT2AGAATP53CYP1A1
SCHEMBL8773320 0.85 GNAI3 (0.42) MEN1KMT2AGAATP53DPP4
SCHEMBL9769271 0.84 GBA1 (0.47) GAATP53CYP1A1ALDH1A1HPGD
SCHEMBL9617015 0.84 GBA1 (0.47) GAATP53CYP1A1ALDH1A1HPGD
SCHEMBL10416554 0.84 MEN1 (0.42) MEN1KMT2AGAATP53DPP4
SCHEMBL9769185 0.84 GBA1 (0.47) GAATP53CYP1A1ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090042762-A1 CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2009-02-12 — — US disclosed
EP-1295935-B1 DETERGENT COMPOSITION ARAKAWA CHEM IND (JP) 2007-03-21 — — EP disclosed
US-7018964-B2 The cleaning composition of this invention comprises, as effective components, a compound (A) represented by the formula (1) and a nonionic surfactant (B): polyoxyethylene glycol phosphate ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2006-03-28 — — US disclosed
US-20030181349-A1 The cleaning composition of this invention comprises, as effective components, a compound (A) represented by the formula (1) and a nonionic surfactant (B): polyoxyethylene glycol phosphate ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2003-09-25 — — US disclosed
EP-1295935-A1 DETERGENT COMPOSITION Arakawa Chemical Industries, Ltd. (JP) 2003-03-26 — — EP disclosed
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