Propylene Glycol

Propylene Glycol

SCHEMBL443949

CC(O)CO.CCC(=O)O.CCCCOCCCC

nearest known ligand 0.48

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

SLC5A2

The experimentally established mechanism targets of Propylene Glycol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.48
USP2 O75604 1/20 0.43
MAPT P10636 3/20 0.39
MEN1 O00255 1/20 0.39
THRB P10828 1/20 0.39
HTT P42858 1/20 0.39
KMT2A Q03164 1/20 0.39
HSD17B10 Q99714 2/20 0.39
FFAR3 O14843 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
CYP3A4 P08684 1/20 0.38
ALDH1A1 P00352 1/20 0.38
RARB P10826 1/20 0.37
CES2 O00748 1/20 0.37
PLA2G2C Q5R387 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propylene Glycol SCHEMBL8961548 0.93 USP2 (0.53) USP2MAPTMEN1THRBHTT
Propylene Glycol SCHEMBL282614 0.90 TSHR (0.50) TSHRUSP2MAPTMEN1THRB
Butyric Acid SCHEMBL7037547 0.89 FFAR3 (0.46) TSHRUSP2MEN1KMT2AHSD17B10
Valeric Acid SCHEMBL25305990 0.89 AKR1B1 (0.47) TSHRMAPTMEN1KMT2AHSD17B10
Propylene Glycol SCHEMBL445698 0.88 HSD17B10 (0.50) TSHRUSP2MAPTMEN1KMT2A
Propylene Glycol SCHEMBL55673 0.88 TSHR (0.61) TSHRUSP2MAPTMEN1THRB
Propylene Glycol SCHEMBL4954281 0.88 TSHR (0.61) TSHRUSP2MAPTMEN1THRB
Propylene Glycol SCHEMBL3738772 0.87 EPHX2 (0.44) TSHRUSP2MAPTHSD17B10TDP1
Propylene Glycol SCHEMBL28120659 0.87 TSHR (0.47) TSHRUSP2MAPTMEN1THRB
Propylene Glycol SCHEMBL3930378 0.86 TSHR (0.58) TSHRUSP2MAPTMEN1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 189 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US claimed
WO-2025071108-A1 RESIN COMPOSITION FOR ANTI-REFLECTIVE FILM, ANTI-REFLECTIVE FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2025-04-03 WO disclosed
WO-2024158178-A1 THERMOSETTING RESIN COMPOSITION, CURED FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-08-02 WO disclosed
WO-2024147537-A1 RESIN COMPOSITION FOR ANTI-REFLECTION FILM, ANTI-REFLECTION FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-07-11 WO disclosed
CN-109976097-B Method of forming micropattern and substrate processing apparatus 三星电子株式会社 2024-06-18 CN disclosed
CN-110007563-B Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element 奇美实业股份有限公司 2024-04-02 CN disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
CN-116648671-A Negative photosensitive resin composition capable of realizing low-temperature curing and low refractive index 株式会社东进世美肯 2023-08-25 CN disclosed
CN-108255017-B Negative photosensitive resin composition 株式会社东进世美肯 2023-03-31 CN disclosed
CN-109799680-B Chemically amplified positive photosensitive resin composition and use thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
US-20030064303-A1 Composition having refractive index sensitively changeable by radiation and method for forming refractive index pattern JSR CORPORATION (JP) 2003-04-03 US disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
EP-1235104-A1 COMPOSITION HAVING REFRACTIVE INDEX SENSITIVELY CHANGEABLE BY RADIATION AND METHOD FOR FORMING REFRACTIVE INDEX PATTERN JSR Corporation (JP) 2002-08-28 EP disclosed
US-6399267-B1 COPOLYMER CONTAINING UNSATURATED CARBOXY ACID OR ANHYDRIDE AND MONOMER OF EPOXY CONTAINING ACRYLIC ESTER JSR CORPORATION (JP) 2002-06-04 US disclosed
US-20020055059-A1 Radiation sensitive resin composition, cathode separator and el display device JSR CORPORATION (JP) 2002-05-09 US disclosed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US disclosed
EP-1193557-A1 Use of a radiation sensitive resin composition for the formation of cathode separator, cathode separator and electroluminescent display device JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010044075-A1 Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element JSR CORPORATION (JP) 2001-11-22 US disclosed
EP-1150165-A1 Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element JSR Corporation (JP) 2001-10-31 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed