Ether

Ether

SCHEMBL445125

CCC(=O)OCC(C)OC(=O)CC.CCOCC.OCCO

nearest known ligand 0.36

Full drug profile on Sugi Atlas →

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
PRKCA P17252 2/20 0.33
NAAA Q02083 1/20 0.32
PRKCE Q02156 1/20 0.31
PRKCQ Q04759 1/20 0.31
PRKCD Q05655 1/20 0.31
MAPT P10636 1/20 0.31
ALDH1A1 P00352 2/20 0.30
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene Glycol SCHEMBL1490293 0.93 PRKCA (0.36) PRKCANAAAPRKCEPRKCQPRKCD
SCHEMBL181935 0.87 NAAA (0.39) PRKCANAAAPRKCEPRKCQPRKCD
SCHEMBL104602 0.81 MEN1 (0.34) ALDH1A1LMNA
Ether SCHEMBL2250844 0.81 PRKCA (0.50) PRKCAPRKCEPRKCQPRKCDMAPT
SCHEMBL6062167 0.80 NAAA (0.34) PRKCANAAAPRKCEPRKCQPRKCD
SCHEMBL6062790 0.80 NAAA (0.34) PRKCANAAAPRKCEPRKCQPRKCD
SCHEMBL181619 0.80 NAAA (0.34) PRKCANAAAPRKCEPRKCQPRKCD
Propylene Glycol Diacetate SCHEMBL534273 0.77 TSHR (0.42) PRKCAMAPTALDH1A1LMNA
SCHEMBL17322486 0.77 ALDH1A1 (0.46) PRKCAPRKCEPRKCQPRKCDMAPT
SCHEMBL181870 0.77 ALDH1A1 (0.46) PRKCANAAAPRKCEPRKCQPRKCD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 254 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114556216-B Positive photosensitive resin composition and display element using same 株式会社东进世美肯 2025-04-25 CN claimed
CN-113260922-B Positive photosensitive resin composition 株式会社东进世美肯 2025-02-25 CN claimed
CN-110967927-B Photosensitive resin composition and display device including the same 三星显示有限公司 2025-01-28 CN claimed
CN-111123644-B Photosensitive resin composition, display, and method for forming pattern of display 株式会社东进世美肯 2024-09-03 CN claimed
CN-108572516-B Positive photosensitive resin composition, display device and pattern forming method thereof 株式会社东进世美肯 2023-10-17 CN claimed
CN-116648671-A Negative photosensitive resin composition capable of realizing low-temperature curing and low refractive index 株式会社东进世美肯 2023-08-25 CN claimed
WO-2022145795-A1 NEGATIVE PHOTO-SENSITIVE RESIN COMPOSITION WITH LOW-TEMPERATURE CURABILITY AND LOW REFRACTIVE INDEX 주식회사 동진쎄미켐 2022-07-07 WO claimed
CN-114556216-A Positive photosensitive resin composition and display element using the same 株式会社东进世美肯 2022-05-27 CN claimed
WO-2022065886-A1 LOW-REFRACTIVE-INDEX THERMOSETTING COMPOSITION, OPTICAL MEMBER FORMED THEREFROM, AND DISPLAY APPARATUS 주식회사 동진쎄미켐 2022-03-31 WO claimed
CN-114133484-A Method for preparing acrylic resin by adopting tubular reactor 江西联合化工有限公司 2022-03-04 CN claimed
CN-113260922-A Positive photosensitive resin composition 株式会社东进世美肯 2021-08-13 CN claimed
US-10982061-B2 Photosensitive resin composition and display device including the same SAMSUNG DISPLAY CO., LTD. (KR) 2021-04-20 US claimed
CN-105759568-B Positive photosensitive siloxane resin composition and display device formed using the same 三星显示有限公司 2021-03-19 CN claimed
CN-111123644-A Photosensitive resin composition, display, and method for forming pattern of display 株式会社东进世美肯 2020-05-08 CN claimed
CN-110967927-A Photosensitive resin composition and display device including the same 三星显示有限公司 2020-04-07 CN claimed
US-20200102433-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE INCLUDING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2020-04-02 US claimed
US-8492459-B2 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2013-07-23 US claimed
US-20090176936-A1 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2009-07-09 US claimed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US claimed
US-20250280668-A1 DISPLAY DEVICE LG DISPLAY CO., LTD. (KR) 2025-09-04 US disclosed
WO-2025071108-A1 RESIN COMPOSITION FOR ANTI-REFLECTIVE FILM, ANTI-REFLECTIVE FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2025-04-03 WO disclosed
CN-119638322-A Environment-friendly recycled concrete and preparation method thereof 丽洲建设集团有限公司 2025-03-18 CN disclosed
CN-112241107-B Positive photosensitive resin composition, photosensitive resin film and display device using the same 株式会社东进世美肯 2025-03-11 CN disclosed
CN-113260922-B Positive photosensitive resin composition 株式会社东进世美肯 2025-02-25 CN disclosed
CN-110967927-B Photosensitive resin composition and display device including the same 三星显示有限公司 2025-01-28 CN disclosed
CN-119213898-A Display element and photosensitive resin composition for same 株式会社东进世美肯 2024-12-27 CN disclosed
CN-108803240-B Photosensitive resin composition 株式会社东进世美肯 2024-12-03 CN disclosed
CN-111123644-B Photosensitive resin composition, display, and method for forming pattern of display 株式会社东进世美肯 2024-09-03 CN disclosed
WO-2024158178-A1 THERMOSETTING RESIN COMPOSITION, CURED FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-08-02 WO disclosed
WO-2024147537-A1 RESIN COMPOSITION FOR ANTI-REFLECTION FILM, ANTI-REFLECTION FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-07-11 WO disclosed
CN-109976097-B Method of forming micropattern and substrate processing apparatus 三星电子株式会社 2024-06-18 CN disclosed
WO-2024112097-A1 CERAMIC INK COMPOSITION FOR LOW-TEMPERATURE FIRING CAPABLE OF CHEMICAL STRENGTHENING, AND METHOD FOR MANUFACTURING GLASS SUBSTRATE PRINTED WITH SAME (주)이노시아 2024-05-30 WO disclosed
CN-110007563-B Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element 奇美实业股份有限公司 2024-04-02 CN disclosed
CN-108073042-B Positive photosensitive resin composition 株式会社东进世美肯 2024-01-23 CN disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
CN-108572516-B Positive photosensitive resin composition, display device and pattern forming method thereof 株式会社东进世美肯 2023-10-17 CN disclosed
CN-116648671-A Negative photosensitive resin composition capable of realizing low-temperature curing and low refractive index 株式会社东进世美肯 2023-08-25 CN disclosed
CN-116057089-A Low refractive thermosetting composition, optical member and display device using the same 株式会社东进世美肯 2023-05-02 CN disclosed
CN-108255017-B Negative photosensitive resin composition 株式会社东进世美肯 2023-03-31 CN disclosed
CN-109799680-B Chemically amplified positive photosensitive resin composition and use thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-115598925-A Composition for optical sensor, and solid-state imaging element and camera module using the optical sensor JSR株式会社(JP) 2023-01-13 CN disclosed
CN-115509086-A Method for manufacturing semiconductor device 台湾积体电路制造股份有限公司 2022-12-23 CN disclosed
CN-108241257-B Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating 奇美实业股份有限公司 2022-11-08 CN disclosed
CN-108241258-B Resin composition for liquid crystal display device, film for liquid crystal display device, and copolymer 住友化学株式会社 2022-10-18 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
WO-2022181419-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, DISPLAY DEVICE, ORGANIC EL DISPLAY DEVICE, AND SEMICONDUCTOR DEVICE 東レ株式会社 2022-09-01 WO disclosed
WO-2022145795-A1 NEGATIVE PHOTO-SENSITIVE RESIN COMPOSITION WITH LOW-TEMPERATURE CURABILITY AND LOW REFRACTIVE INDEX 주식회사 동진쎄미켐 2022-07-07 WO disclosed
CN-114556216-A Positive photosensitive resin composition and display element using the same 株式会社东进世美肯 2022-05-27 CN disclosed
WO-2022065886-A1 LOW-REFRACTIVE-INDEX THERMOSETTING COMPOSITION, OPTICAL MEMBER FORMED THEREFROM, AND DISPLAY APPARATUS 주식회사 동진쎄미켐 2022-03-31 WO disclosed
CN-114133484-A Method for preparing acrylic resin by adopting tubular reactor 江西联合化工有限公司 2022-03-04 CN disclosed
CN-104007616-B Photosensitive resin composition and display device using the same 三星显示有限公司 2022-01-28 CN disclosed
CN-106773534-B Photosensitive resin composition 株式会社东进世美肯 2021-12-21 CN disclosed
CN-113260922-A Positive photosensitive resin composition 株式会社东进世美肯 2021-08-13 CN disclosed
CN-106249546-B Negative photosensitive resin composition 东进世美肯株式会社 2021-07-27 CN disclosed
CN-108604061-B Cured film and positive photosensitive resin composition 东丽株式会社 2021-07-16 CN disclosed
CN-107533293-B Positive photosensitive resin composition for display device and display device comprising same 株式会社东进世美肯 2021-06-22 CN disclosed
US-10982061-B2 Photosensitive resin composition and display device including the same SAMSUNG DISPLAY CO., LTD. (KR) 2021-04-20 US disclosed
CN-105759568-B Positive photosensitive siloxane resin composition and display device formed using the same 三星显示有限公司 2021-03-19 CN disclosed
CN-107272342-B Negative photosensitive resin composition 东友精细化工有限公司 2021-03-05 CN disclosed
US-10916437-B2 Methods of forming micropatterns and substrate processing apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-02-09 US disclosed
US-10895807-B2 Cured film and positive photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2021-01-19 US disclosed
CN-105938298-B Negative photosensitive resin composition, photocured pattern formed by using same and image display device 东友精细化工有限公司 2020-12-29 CN disclosed
CN-111999980-A Chemically amplified positive photosensitive resin composition, protective film and module 奇美实业股份有限公司 2020-11-27 CN disclosed
CN-107434941-B Resin composition and cured film 住友化学株式会社 2020-10-30 CN disclosed
CN-107949876-B Window substrate, method of manufacturing the same, and image display device having the same 东友精细化工有限公司 2020-07-31 CN disclosed
CN-111381442-A Chemically amplified positive photosensitive resin composition and use thereof 奇美实业股份有限公司 2020-07-07 CN disclosed
CN-105319852-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2020-06-26 CN disclosed
CN-111324013-A Chemically amplified positive photosensitive resin composition and use thereof 奇美实业股份有限公司 2020-06-23 CN disclosed
CN-106909028-B Photosensitive resin composition, protective film and liquid crystal display element 奇美实业股份有限公司 2020-06-05 CN disclosed
CN-104730861-B Positive photosensitive resin composition, photosensitive resin film produced using the same, and display device 三星SDI株式会社 2020-05-26 CN disclosed
CN-104011594-B Photoresist composition 东进世美肯株式会社 2020-04-24 CN disclosed
CN-105319845-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2020-04-21 CN disclosed
CN-110967927-A Photosensitive resin composition and display device including the same 三星显示有限公司 2020-04-07 CN disclosed
US-20200102433-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE INCLUDING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2020-04-02 US disclosed
CN-105785720-B Photosensitive resin composition, photocured pattern formed therefrom, and image display device having the same 东友精细化工有限公司 2020-02-07 CN disclosed
CN-104937491-B Photosensitive resin composition and method for forming pattern using the same 东进世美肯株式会社 2020-01-14 CN disclosed
CN-105278243-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2020-01-07 CN disclosed
CN-104808439-B Photoresist composition and method for manufacturing thin film transistor substrate 三星显示有限公司 2019-12-31 CN disclosed
CN-104793464-B Photoresist composition, method for forming pattern and method for manufacturing thin film transistor substrate 三星显示有限公司 2019-12-24 CN disclosed
CN-104950578-B Colored photosensitive resin composition and color filter produced therefrom 东友精细化工有限公司 2019-12-06 CN disclosed
US-20190198342-A1 Methods of Forming Micropatterns and Substrate Processing Apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-06-27 US disclosed
US-10324376-B2 Negative type colored photosensitive resin composition, cured film, element, and display device TORAY INDUSTRIES, INC. (JP) 2019-06-18 US disclosed
EP-2119744-B1 TWO-COMPONENT CURING COMPOSITION SUNSTAR ENGINEERING INC (JP) 2019-06-05 EP disclosed
EP-2530524-B1 POSITIVE-TYPE RESIST COMPOSITION AND METHOD FOR PRODUCING MICROLENS NISSAN CHEMICAL CORP (JP) 2019-05-29 EP disclosed
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 US disclosed
US-20180356727-A1 CURED FILM AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-12-13 US disclosed
US-20180267405-A1 NEGATIVE TYPE COLORED PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2018-09-20 US disclosed
US-9851638-B2 Photosensitive polysiloxane composition and uses thereof CHI MEI CORPORATION (TW) 2017-12-26 US disclosed
US-20170293224-A1 ORGANIC EL DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-12 US disclosed
US-9773672-B2 Method of forming micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-09-26 US disclosed
US-20170168390-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT CHI MEI CORPORATION (TW) 2017-06-15 US disclosed
US-9678257-B2 Photoresist composition for green color filter SAMSUNG DISPLAY CO., LTD. (KR) 2017-06-13 US disclosed
US-9606436-B2 Photosensitive resin composition and application thereof CHI MEI CORPORATION (TW) 2017-03-28 US disclosed
US-20170052446-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2017-02-23 US disclosed
US-20170023860-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORP (TW) 2017-01-26 US disclosed
US-9541832-B2 Photosensitive resin composition, protective film and element having the same CHI MEI CORPORATION (TW) 2017-01-10 US disclosed
US-20160327709-A1 PHOTORESIST COMPOSITION FOR GREEN COLOR FILTER SAMSUNG DISPLAY CO., LTD. (KR) 2016-11-10 US disclosed
US-9448476-B2 Photoresist composition and method of manufacturing a thin film transistor substrate SAMSUNG DISPLAY CO., LTD. (KR) 2016-09-20 US disclosed
US-9428606-B2 Polyfunctional epoxy compound NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-08-30 US disclosed
US-9422446-B2 Photosensitive resin composition, protective film and element having the same CHI MEI CORPORATION (TW) 2016-08-23 US disclosed
US-9417521-B2 Photoresist composition and method for forming a metal pattern SAMSUNG DISPLAY CO., LTD. (KR) 2016-08-16 US disclosed
US-20160233083-A1 METHOD OF FORMING MICROPATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-08-11 US disclosed
US-9366959-B2 Negative photosensitive resin composition and application thereof CHI MEI CORPORATION (TW) 2016-06-14 US disclosed
US-9343553-B2 Photoresist composition, method of forming a pattern and method of manufacturing a thin film transistor substrate SAMSUNG DISPLAY CO., LTD. (KR) 2016-05-17 US disclosed
US-9337032-B2 Method of forming pattern of semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-05-10 US disclosed
US-9316907-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2016-04-19 US disclosed
US-9285681-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2016-03-15 US disclosed
EP-2182405-B1 LIQUID CRYSTAL ALIGNING AGENT, METHOD FOR PRODUCING LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY DEVICE JSR CORP (JP) 2016-01-13 EP disclosed
US-20150378256-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME CHI MEI CORPORATION (TW) 2015-12-31 US disclosed
US-20150376355-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME CHI MEI CORPORATION (TW) 2015-12-31 US disclosed
US-9169409-B2 Ink composition for imprint lithography and roll printing LG DISPLAY CO., LTD. (KR) 2015-10-27 US disclosed
US-20150241774-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2015-08-27 US disclosed
US-9102663-B2 Method for producing epoxy compound having cyanuric acid skeleton NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-08-11 US disclosed
US-20150212411-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A THIN FILM TRANSISTOR SUBSTRATE SAMSUNG DISPLAY CO., LTD. (KR) 2015-07-30 US disclosed
US-20150205200-A1 PHOTORESIST COMPOSITION, METHOD OF FORMING A PATTERN AND METHOD OF MANUFACTURING A THIN FILM TRANSISTOR SUBSTRATE SAMSUNG DISPLAY CO., LTD. (KR) 2015-07-23 US disclosed
US-20150133582-A1 INK COMPOSITION FOR IMPRINT LITHOGRAPHY AND ROLL PRINTING LG DISPLAY CO., LTD. (KR) 2015-05-14 US disclosed
US-20150118852-A1 METHOD OF FORMING PATTERN OF SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-04-30 US disclosed
US-8980506-B2 Photosensitive resin composition and application thereof CHI MEI CORPORATION (TW) 2015-03-17 US disclosed
US-20150044790-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2015-02-12 US disclosed
US-20150031808-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-01-29 US disclosed
US-8911926-B2 Photoresist composition and method of forming a metal pattern using the same SAMSUNG DISPLAY CO., LTD. (KR) 2014-12-16 US disclosed
US-20140356786-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2014-12-04 US disclosed
US-8883377-B2 Photoresist composition for forming a color filter and method of manufacturing a substrate for a display device SAMSUNG DISPLAY CO., LTD. (KR) 2014-11-11 US disclosed
US-20140255845-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2014-09-11 US disclosed
US-20140240645-A1 PHOTOSENSITIVE RESIN COMPOSITION, DISPLAY DEVICE USING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2014-08-28 US disclosed
US-8808963-B2 Photoresist composition and method of manufacturing array substrate using the same SAMSUNG DISPLAY CO., LTD. (KR) 2014-08-19 US disclosed
US-8778597-B2 Long-chain alkylene-containing curable epoxy resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-07-15 US disclosed
US-20140183162-A1 PHOTORESIST COMPOSITION AND METHOD FOR FORMING A METAL PATTERN SAMSUNG DISPLAY CO., LTD (KR) 2014-07-03 US disclosed
US-8765835-B2 Epdxy resin composition having monocyclic aliphatic hydrocarbon ring NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-07-01 US disclosed
US-8722755-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2014-05-13 US disclosed
US-8722311-B2 Positive resist composition and method for producing microlens NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-05-13 US disclosed
US-20140076847-A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING A METAL PATTERN USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2014-03-20 US disclosed
US-20140051017-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2014-02-20 US disclosed
US-20130295495-A1 PHOTORESIST COMPOSITION FOR FORMING A COLOR FILTER AND METHOD OF MANUFACTURING A SUBSTRATE FOR A DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2013-11-07 US disclosed
US-8563214-B2 Radiation sensitive resin composition and method of forming an interlayer insulating film SHARP CORPORATION (JP) 2013-10-22 US disclosed
US-20130274433-A1 POLYFUNCTIONAL EPOXY COMPOUND NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-17 US disclosed
EP-2641926-A1 POLYFUNCTIONAL EPOXY COMPOUND Nissan Chemical Industries, Ltd. (JP) 2013-09-25 EP disclosed
US-20130245150-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2013-09-19 US disclosed
US-8492459-B2 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2013-07-23 US disclosed
US-20130177849-A1 EPOXY RESIN COMPOSITION HAVING MONOCYCLIC ALIPHATIC HYDROCARBON RING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-07-11 US disclosed
US-20130172525-A1 METHOD FOR PRODUCING EPOXY COMPOUND HAVING CYANURIC ACID SKELETON NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-07-04 US disclosed
US-20130172522-A1 EPOXY COMPOUND WITH NITROGEN-CONTAINING RING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-07-04 US disclosed
EP-2602274-A1 EPOXY RESIN COMPOSITION HAVING MONOCYCLIC ALIPHATIC HYDROCARBON RING Nissan Chemical Industries, Ltd. (JP) 2013-06-12 EP disclosed
EP-2602257-A1 EPOXY COMPOUND WITH NITROGEN-CONTAINING RING Nissan Chemical Industries, Ltd. (JP) 2013-06-12 EP disclosed
EP-2602256-A1 METHOD FOR PRODUCING EPOXY COMPOUND HAVING CYANURIC ACID SKELETON Nissan Chemical Industries, Ltd. (JP) 2013-06-12 EP disclosed
US-8409783-B2 Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer TOKYO OHKA KOGYO CO., LTD. (JP) 2013-04-02 US disclosed
US-8399068-B2 Liquid crystal aligning agent, method of producing a liquid crystal alignment film and liquid crystal display device JSR CORPORATION (JP) 2013-03-19 US disclosed
US-20130048604-A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING A FINE PATTERN USING THE SAME AZ ELECTRONIC MATERIALS (KOREA), LTD. (KR) 2013-02-28 US disclosed
EP-2530098-A1 LONG-CHAIN ALKYLENE-CONTAINING CURABLE EPOXY RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2012-12-05 EP disclosed
EP-2530524-A1 POSITIVE-TYPE RESIST COMPOSITION AND METHOD FOR PRODUCING MICROLENS Nissan Chemical Industries, Ltd. (JP) 2012-12-05 EP disclosed
US-20120295199-A1 LONG-CHAIN ALKYLENE-CONTAINING CURABLE EPOXY RESIN COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-11-22 US disclosed
US-20120292487-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR PRODUCING MICROLENS NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-11-22 US disclosed
US-20120270151-A1 RADIATION SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING AN INTERLAYER INSULATING FILM JSR CORPORATION (JP) 2012-10-25 US disclosed
US-20120270142-A1 PHOTOSENSITIVE COMPOSITION AND METHOD OF MANUFACTURING A SUBSTRATE FOR A DISPLAY DEVICE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-10-25 US disclosed
US-8257905-B2 Method of fabricating thin film transistor substrate and negative photoresist composition used therein SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-09-04 US disclosed
US-8216649-B2 Liquid crystal aligning agent, method of producing a liquid crystal alignment film and liquid crystal display device JSR CORPORATION (JP) 2012-07-10 US disclosed
US-8173729-B2 Photosensitive resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2012-05-08 US disclosed
US-20120064463-A1 Method of Forming Micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-15 US disclosed
US-20120064455-A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG TECHWIN CO., LTD. (KR) 2012-03-15 US disclosed
US-20110294243-A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2011-12-01 US disclosed
US-20110224335-A1 INK COMPOSITION AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME KIM SUNG-HEE 2011-09-15 US disclosed
US-7989136-B2 Photoresist composition and method of forming a photoresist pattern using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-08-02 US disclosed
US-20110171581-A1 PHOTORESIST COMPOSTION AND METHOD OF MANUFACTURING ARRAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-07-14 US disclosed
US-20110118422-A1 LIQUID CRYSTAL ALIGNING AGENT, METHOD OF PRODUCING A LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY DEVICE JSR CORPORATION (JP) 2011-05-19 US disclosed
US-7935552-B2 Ink composition and method of fabricating liquid crystal display device using the same LG DISPLAY CO., LTD. (KR) 2011-05-03 US disclosed
US-7927897-B2 Photoresist composition and method of manufacturing array substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-04-19 US disclosed
US-20110068301-A1 LIQUID CRYSTAL ALIGNING AGENT, METHOD OF PRODUCING A LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY DEVICE JSR CORPORATION (JP) 2011-03-24 US disclosed
EP-1323742-B1 Radiation sensitive refractive index changing composition and refractive index changing method JSR CORP (JP) 2011-02-16 EP disclosed
US-7879961-B2 Resin composition for organic insulating layer, method of manufacturing resin composition, and display panel including resin composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-02-01 US disclosed
US-7811726-B2 Photoresist composition and method of manufacturing a color filter substrate by using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-10-12 US disclosed
US-7799509-B2 Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-09-21 US disclosed
US-20100222473-A1 PHOTOSENSITIVE RESIN COMPOSITION DONGJIN SEMICHEM CO., LTD. (KR) 2010-09-02 US disclosed
US-20100209847-A1 COPOLYMER, RESIN COMPOSITION, SPACER FOR DISPLAY PANEL, PLANARIZATION FILM, THERMOSETTING PROTECTIVE FILM, MICROLENS, AND PROCESS FOR PRODUCING COPOLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-19 US disclosed
US-20100203449-A1 METHOD OF FABRICATING THIN FILM TRANSISTOR SUBSTRATE AND NEGATIVE PHOTORESIST COMPOSITION USED THEREIN SAMSUNG DISPLAY CO., LTD. (KR) 2010-08-12 US disclosed
US-20100167206-A1 PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A DISPLAY SUBSTRATE USING THE PHOTORESIST COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-07-01 US disclosed
US-20100120181-A1 INK COMPOSITION AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME LG DISPLAY CO., LTD. (KR) 2010-05-13 US disclosed
US-7713680-B2 Radiation sensitive resin composition for forming a protective film, method of forming a protective film from the composition, liquid crystal display device and solid-state image sensing device JSR CORPORATION (JP) 2010-05-11 US disclosed
EP-2182405-A1 LIQUID CRYSTAL ALIGNING AGENT, METHOD FOR PRODUCING LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY DEVICE JSR Corporation (JP) 2010-05-05 EP disclosed
EP-2182407-A1 LIQUID CRYSTAL ALIGNING AGENT, METHOD FOR PRODUCING LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY DEVICE JSR Corporation (JP) 2010-05-05 EP disclosed
US-7691915-B2 Photosensitive resin composition for forming organic insulating film and device using the same CHEIL INDUSTRIES INC. (KR) 2010-04-06 US disclosed
US-20100021832-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A COLOR FILTER SUBSTRATE BY USING THE SAME TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2010-01-28 US disclosed
US-20100016486-A1 TWO-COMPONENT HARDENING COMPOSITION SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 2010-01-21 US disclosed
EP-1475665-B1 Positive-type photosensitive resin composition TORAY INDUSTRIES (JP) 2009-12-30 EP disclosed
US-7638253-B2 Photoresist composition and method of manufacturing a thin-film transistor substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-12-29 US disclosed
EP-1655346-B1 TWO-PART CURABLE COMPOSITION SUNSTAR ENGINEERING INC (JP) 2009-12-09 EP disclosed
US-7622525-B2 Two-part curable composition SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 2009-11-24 US disclosed
EP-2119744-A1 TWO-COMPONENT HARDENING COMPOSITION Sunstar Giken Kabushiki Kaisha (JP) 2009-11-18 EP disclosed
US-7615322-B2 Photoresist composition and method of manufacturing a color filter substrate by using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-11-10 US disclosed
US-7595143-B2 Containing two binder resins produced by reacting m-cresol and p-cresol with salicylic aldehyde for first and with formaldehyde for second; heat resistance, pattern adhesion; photomasks, photoresists SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-09-29 US disclosed
US-20090227058-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING ARRAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-09-10 US disclosed
US-20090215233-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING ARRAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-08-27 US disclosed
US-20090176936-A1 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2009-07-09 US disclosed
US-20090169736-A1 THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING ANTIHALATION FILM OF SOLID-STATE IMAGING DEVICE, ANTIHALATION FILM FOR SOLID-STATE IMAGING DEVICES, AND SOLID-STATE IMAGING DEVICE JSR CORPORATION (JP) 2009-07-02 US disclosed
US-20090042127-A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING A PHOTORESIST PATTERN USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-02-12 US disclosed
US-20080254634-A1 Photoresist composition and method of manufacturing a thin-film transistor substrate using the same SAMSUNG ELECTRONICS CO., LTD. 2008-10-16 US disclosed
US-20080233515-A1 RADIATION SENSITIVE RESIN COMPOSITION FOR FORMING A PROTECTIVE FILM, METHOD OF FORMING A PROTECTIVE FILM FROM THE COMPOSITION, LIQUID CRYSTAL DISPLAY DEVICE AND SOLID-STATE IMAGE SENSING DEVICE JSR CORPORATION (JP) 2008-09-25 US disclosed
EP-1972673-A1 Radiation sensitive resin composition for forming a protective film, method of forming a protective film from the composition, liquid crystal display device and solid-state image sensing device JSR Corporation (JP) 2008-09-24 EP disclosed
US-20080145786-A1 Photosensitive Resin Composition for Forming Organic Insulating Film and Device Using the Same CHEIL INDUSTRIES INC. (KR) 2008-06-19 US disclosed
US-7378224-B2 Method for forming pattern, and optical element JSR CORPORATION (JP) 2008-05-27 US disclosed
US-20080044766-A1 a coloring agent including an anthraquinone-based dye and an organic pigment; a meta-cresol-formaldehyde novolak resin binder, hexakis/methoxymethyl/melamine crosslinker and propylene glycol methyl ether propionate as a solvent, benzophenone photopolymerization initiator; exposing to light, developing SAMSUNG ELECTRONICS CO., LTD. 2008-02-21 US disclosed
US-7320854-B2 Mixture of oxide particles, polymerizable compound,radiation sensitive decomposer and releasing agent JSR CORPORATION (JP) 2008-01-22 US disclosed
US-20070184293-A1 RESIN COMPOSITION FOR ORGANIC INSULATING LAYER, METHOD OF MANUFACTURING RESIN COMPOSITION, AND DISPLAY PANEL INCLUDING RESIN COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-08-09 US disclosed
US-7205085-B2 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern JSR CORPORATION (JP) 2007-04-17 US disclosed
US-20070048662-A1 Containing two binder resins produced by reacting m-cresol and p-cresol with salicylic aldehyde for first and with formaldehyde for second; heat resistance, pattern adhesion; photomasks, photoresists SAMSUNG ELECTRONICS CO., LTD. 2007-03-01 US disclosed
US-20060293437-A1 Two-part curable composition SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 2006-12-28 US disclosed
US-20060275700-A1 Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same SAMSUNG ELECTRONICS CO., LTD. 2006-12-07 US disclosed
US-7125647-B2 Radiation-sensitive composition changing in refractive index and utilization thereof JSR CORPORATION (JP) 2006-10-24 US disclosed
US-20060210929-A1 Photosensitive composition and forming process of structured material using the composition CANON KABUSHIKI KAISHA (JP) 2006-09-21 US disclosed
US-7108954-B2 Radiation-sensitive composition changing in refractive index and method of changing refractive index JSR CORPORATION (JP) 2006-09-19 US disclosed
US-20060177767-A1 Photosensitive resin composition, thin film panel including a layer made from photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. 2006-08-10 US disclosed
US-7071255-B2 Radiation-sensitive composition capable of having refractive index distribution JSR CORPORATION (JP) 2006-07-04 US disclosed
EP-1655346-A1 TWO-PART CURABLE COMPOSITION SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 2006-05-10 EP disclosed
US-6994944-B2 Radiation sensitive resin composition, cathode separator and EL display device JSR CORPORATION (JP) 2006-02-07 US disclosed
US-6984476-B2 Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device SHARP KABUSHIKI KAISHA (JP) 2006-01-10 US disclosed
US-20050260526-A1 Radiation sensitive resin composition, cathode separator and EL display device JSR CORPORATION (JP) 2005-11-24 US disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050014100-A1 Method for forming pattern, and optical element JSR CORPORATION (JP) 2005-01-20 US disclosed
EP-1498776-A2 Method for forming pattern, and optical element JSR Corporation (JP) 2005-01-19 EP disclosed
EP-1494072-A2 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR Corporation (JP) 2005-01-05 EP disclosed
US-20040265737-A1 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR CORPORATION (JP) 2004-12-30 US disclosed
US-6828078-B2 Photoresist for use in optoelectronic and display fields; porosity; optical fibers JSR CORPORATION (JP) 2004-12-07 US disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-6797450-B2 ALKALI-SOLUBLE RESIN HAVING NO EPOXY GROUP AND A 1,2-QUINONEDIAZIDE COMPOUND JSR CORPORATION (JP) 2004-09-28 US disclosed
US-6797453-B2 WHICH HAS RESOLUTION HIGH ENOUGH TO FORM THROUGH HOLE OR U-SHAPED DEPRESSION; COMPRISES SILANE COUPLING AGENT; FOR ELECTROLUMINESCENT LIQUID CRYSTAL DISPLAYS JSR CORPORATION (JP) 2004-09-28 US disclosed
US-6787289-B2 OPTICS JSR CORPORATION (JP) 2004-09-07 US disclosed
US-6756165-B2 ALKALI SOLUBLE RESIN, UNSATURATED POLYMERIZABLE COMPOUND, RADIATION SENSITIVE POLYMERIZATION INITIATOR JSR CORPORATION (JP) 2004-06-29 US disclosed
EP-1057859-B1 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR CORP (JP) 2004-05-19 EP disclosed
EP-1413924-A1 COMPOSITION HAVING PERMITIVITY BEING RADIATION-SENSITIVELY CHANGEABLE AND METHOD FOR FORMING PERMITIVITY PATTERN JSR Corporation (JP) 2004-04-28 EP disclosed
US-20040013972-A1 Radiation-sensitive composition changing in refractive index and method of changing refractive index JSR CORPORATION (JP) 2004-01-22 US disclosed
US-20040005506-A1 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern JSR CORPORATION (JP) 2004-01-08 US disclosed
EP-1375597-A1 RADIATION-SENSITIVE COMPOSITION CHANGING IN REFRACTIVE INDEX AND UTILIZATION THEREOF JSR Corporation (JP) 2004-01-02 EP disclosed
EP-1369459-A1 RADIATION-SENSITIVE COMPOSITION CAPABLE OF HAVING REFRACTIVE INDEX DISTRIBUTION JSR Corporation (JP) 2003-12-10 EP disclosed
US-20030215737-A1 Radiation sensitive composition for forming an insulating film, insulating film and display device JSR CORPORATION (JP) 2003-11-20 US disclosed
US-20030193624-A1 Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device SHARP KABUSHIKI KAISHA (JP) 2003-10-16 US disclosed
EP-1350814-A1 RADIATION-SENSITIVE COMPOSITION CHANGING IN REFRACTIVE INDEX AND METHOD OF CHANGING REFRACTIVE INDEX JSR Corporation (JP) 2003-10-08 EP disclosed
US-20030187119-A1 Radiation-sensitive composition capable of having refractive index distribution JSR CORPORATION (JP) 2003-10-02 US disclosed
US-20030171468-A1 Radiation-sensitive composition changing in refractive index and utilization thereof JSR CORPORATION (JP) 2003-09-11 US disclosed
EP-1331518-A2 Radiation sensitive composition for forming an insulating film, insulating film and display device JSR Corporation (JP) 2003-07-30 EP disclosed
US-20030139486-A1 Radiation sensitive refractive index changing composition and refractive index changing method JSR CORPORATION (JP) 2003-07-24 US disclosed
EP-1323742-A2 Radiation sensitive refractive index changing composition and refractive index changing method JSR Corporation (JP) 2003-07-02 EP disclosed
EP-1312982-A1 RADIATION-SENSITIVE COMPOSITION, INSULATING FILM AND ORGANIC EL DISPLAY ELEMENT JSR Corporation (JP) 2003-05-21 EP disclosed
US-20030064303-A1 Composition having refractive index sensitively changeable by radiation and method for forming refractive index pattern JSR CORPORATION (JP) 2003-04-03 US disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
US-6491729-B1 Dry-cleaning solvent composition Lee, Chin Yen (TW) 2002-12-10 US disclosed
US-6491729-B1 Dry-cleaning solvent composition Lee, Chin Yen (TW) 2002-12-10 US disclosed
EP-1235104-A1 COMPOSITION HAVING REFRACTIVE INDEX SENSITIVELY CHANGEABLE BY RADIATION AND METHOD FOR FORMING REFRACTIVE INDEX PATTERN JSR Corporation (JP) 2002-08-28 EP disclosed
US-6399267-B1 COPOLYMER CONTAINING UNSATURATED CARBOXY ACID OR ANHYDRIDE AND MONOMER OF EPOXY CONTAINING ACRYLIC ESTER JSR CORPORATION (JP) 2002-06-04 US disclosed
US-20020055059-A1 Radiation sensitive resin composition, cathode separator and el display device JSR CORPORATION (JP) 2002-05-09 US disclosed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US disclosed
EP-1193557-A1 Use of a radiation sensitive resin composition for the formation of cathode separator, cathode separator and electroluminescent display device JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010044075-A1 Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element JSR CORPORATION (JP) 2001-11-22 US disclosed
EP-1150165-A1 Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element JSR Corporation (JP) 2001-10-31 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20130172525-A1 METHOD FOR PRODUCING EPOXY COMPOUND HAVING CYANURIC ACID SKELETON C9, EPX, C5 PRKCA 1089/4885NAAA 1782/4885PRKCE 1206/4885
US-20130172522-A1 EPOXY COMPOUND WITH NITROGEN-CONTAINING RING C5, EPB41, H1-4 PRKCA 4152/4885NAAA 1599/4885PRKCE 3351/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.