SCHEMBL4452103

SCHEMBL4452103

O=C(Oc1ccc([N+](=O)[O-])cc1)c1ccccc1Oc1ccc([N+](=O)[O-])cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.53
KMT2A Q03164 4/20 0.53
PKM P14618 1/20 0.51
KDM4E B2RXH2 3/20 0.51
GAA P10253 2/20 0.51
MAPT P10636 5/20 0.51
PPARG P37231 1/20 0.50
BCL9 O00512 1/20 0.49
CTNNB1 P35222 1/20 0.49
ALOX5 P09917 1/20 0.49
HSPB1 P04792 2/20 0.49
SMN1; SMN2 Q16637 2/20 0.48
FAAH O00519 1/20 0.47
MEN1 O00255 1/20 0.47
NPC1 O15118 1/20 0.47
MAPK1 P28482 1/20 0.47
RAB9A P51151 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
MYOC Q99972 1/20 0.47
HPGD P15428 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10917701 0.97 ALOX5 (0.54) ALDH1A1KMT2APKMKDM4EGAA
SCHEMBL10922122 0.87 KMT2A (0.51) ALDH1A1KMT2AMAPTHSPB1SMN1; SMN2
SCHEMBL4452102 0.85 KMT2A (0.55) ALDH1A1KMT2AKDM4EMAPTCTNNB1
SCHEMBL10918802 0.84 CTNNB1 (0.66) ALDH1A1KMT2AKDM4EGAAMAPT
SCHEMBL9068240 0.84 HSPB1 (0.50) ALDH1A1KMT2APKMKDM4EGAA
SCHEMBL28160007 0.83 TSHR (0.51) ALDH1A1KMT2AMAPTBCL9CTNNB1
SCHEMBL2823735 0.82 ALDH1A1 (0.68) ALDH1A1KMT2APKMKDM4EGAA
SCHEMBL28491071 0.82 KMT2A (0.62) ALDH1A1KMT2APKMKDM4EGAA
SCHEMBL7761819 0.81 KMT2A (0.58) ALDH1A1KMT2AMAPTSMN1; SMN2MEN1
SCHEMBL11021047 0.81 MAPT (0.62) ALDH1A1KMT2APKMKDM4EGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1895580-B1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE MAKING USE OF THE SAME AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2016-09-07 EP disclosed
US-8653202-B2 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device TORAY INDUSTRIES, INC. (JP) 2014-02-18 US disclosed
US-20090123747-A1 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device TORAY INDUSTRIES, INC. (JP) 2009-05-14 US disclosed
EP-1895580-A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE MAKING USE OF THE SAME AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2008-03-05 EP disclosed