Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.36 |
| ▸ | LMNA | P02545 | 3/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.34 |
| ▸ | TSHR | P16473 | 2/20 | 0.34 |
| ▸ | ESR1 | P03372 | 1/20 | 0.34 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.34 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.34 |
| ▸ | KDR | P35968 | 1/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
| ▸ | MGAM | O43451 | 1/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.32 |
| ▸ | SI | P14410 | 1/20 | 0.32 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.32 |
| ▸ | SOAT1 | P35610 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3027521 | 0.88 | HCAR2 (0.39) | HCAR2ALDH1A1LMNATDP1TSHR | |
| SCHEMBL31210051 | 0.87 | CA1 (0.33) | HCAR2ALDH1A1TSHRHSD17B10MAPK1 | |
| SCHEMBL448441 | 0.87 | ALDH1A1 (0.50) | HCAR2ALDH1A1LMNATDP1TSHR | |
| SCHEMBL29448871 | 0.84 | NAAA (0.52) | HCAR2ALDH1A1LMNATSHR | |
| SCHEMBL37035 | 0.83 | ALDH1A1 (0.46) | HCAR2ALDH1A1LMNAHSD17B10ALOX15 | |
| SCHEMBL446645 | 0.83 | ALDH1A1 (0.45) | HCAR2ALDH1A1LMNATDP1TSHR | |
| SCHEMBL9937652 | 0.83 | TSHR (0.37) | ALDH1A1LMNATDP1TSHRHSD17B10 | |
| SCHEMBL15788324 | 0.83 | ALDH1A1 (0.34) | ALDH1A1LMNATDP1TSHRHSD17B10 | |
| SCHEMBL9936746 | 0.83 | ALDH1A1 (0.54) | ALDH1A1LMNATDP1TSHRHSD17B10 | |
| SCHEMBL27625735 | 0.83 | TSHR (0.36) | HCAR2ALDH1A1LMNATDP1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 403 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-1194267-C | Diluent composition for removing unnecessary sensitive resin | DONGJIN THEMIKAN CO LTD (KR) | 2005-03-23 | — | — | CN | claimed |
| US-6183942-B1 | CAN BE USED IN WASHING AND REMOVING THE UNNECESSARY SPIN-ON-GLASS (SOG) OF AN SOG LAYER AT EDGES AND BACKSIDE ON SEMICONDUCTOR SUBSTRATES | DONGJIN SEMICHEM CO., LTD. (KR) | 2001-02-06 | — | — | US | claimed |
| CN-1271113-A | Diluent composition for removing unnecessary sensitive resin | DONGJIN THEMIKAN CO LTD (KR) | 2000-10-25 | — | — | CN | claimed |
| US-12637529-B2 | Resin composition and display device using the same | SAMSUNG DISPLAY CO., LTD. (KR) | 2026-05-26 | — | — | US | disclosed |
| CN-116648313-B | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2025-05-16 | — | — | CN | disclosed |
| CN-114730132-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-119968421-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| WO-2025071108-A1 | RESIN COMPOSITION FOR ANTI-REFLECTIVE FILM, ANTI-REFLECTIVE FILM, AND SOLID-STATE IMAGING DEVICE | 동우 화인켐 주식회사 | 2025-04-03 | — | — | WO | disclosed |
| CN-119731225-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| CN-119731595-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| CN-119343395-A | Polyimide resin, negative photosensitive resin composition comprising same, and electronic device | 株式会社LG化学 | 2025-01-21 | — | — | CN | disclosed |
| US-6313233-B1 | CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| EP-1150165-A1 | Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element | JSR Corporation (JP) | 2001-10-31 | — | — | EP | disclosed |
| US-6183942-B1 | CAN BE USED IN WASHING AND REMOVING THE UNNECESSARY SPIN-ON-GLASS (SOG) OF AN SOG LAYER AT EDGES AND BACKSIDE ON SEMICONDUCTOR SUBSTRATES | DONGJIN SEMICHEM CO., LTD. (KR) | 2001-02-06 | — | — | US | disclosed |
| US-6168908-B1 | COATING AN ALKALI-SOLUBLE THERMOSETTING RESIN ON A SUBSTRATE, AND BAKING IT, COATING A RADIATION SENSITIVE RESIN ON THE COATED FILM, AND BAKING, EXPOSING THE RADIATION SENSITIVE FILM TO A RADIATION THROUGH A MASK AND BAKING, DEVELOPING | JSR CORPORATION (JP) | 2001-01-02 | — | — | US | disclosed |
| EP-1057859-A2 | Radiation sensitive resin composition and use of the same in an interlaminar insulating film | JSR Corporation (JP) | 2000-12-06 | — | — | EP | disclosed |
| CN-1271113-A | Diluent composition for removing unnecessary sensitive resin | DONGJIN THEMIKAN CO LTD (KR) | 2000-10-25 | — | — | CN | disclosed |
| US-6011123-A | ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. | JSR CORPORATION (JP) | 2000-01-04 | — | — | US | disclosed |
| EP-0908780-A1 | Process for forming a cured film of a thermosetting resin | JSR Corporation (JP) | 1999-04-14 | — | — | EP | disclosed |
| EP-0844283-A1 | Curable resin composition and cured products | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-27 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12637529-B2 | Resin composition and display device using the same | JMJD6, ALKBH2, ARID2 | HCAR2 668/4885ALDH1A1 209/4885LMNA 4011/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.