SCHEMBL448764

SCHEMBL448764

CCC(=O)OCC(CC)OC

nearest known ligand 0.42

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ENPP2 Q13822 10/20 0.42
LPAR3 Q9UBY5 4/20 0.41
LPAR6 P43657 3/20 0.41
LPAR1 Q92633 3/20 0.41
LPAR4 Q99677 3/20 0.41
LPAR5 Q9H1C0 3/20 0.41
LPAR2 Q9HBW0 3/20 0.41
ALDH1A1 P00352 1/20 0.39
LMNA P02545 1/20 0.39
NAAA Q02083 1/20 0.38
RECQL P46063 1/20 0.36
BLM P54132 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
PRKCA P17252 1/20 0.36
PRKCE Q02156 1/20 0.36
PRKCQ Q04759 1/20 0.36
PRKCD Q05655 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7148370 0.83 ENPP2 (0.51) ENPP2LPAR3LPAR6LPAR1LPAR4
SCHEMBL15198874 0.83 ALDH1A1 (0.47) ENPP2LPAR3LPAR1LPAR2ALDH1A1
SCHEMBL1470166 0.82 ALDH1A1 (0.42) ENPP2LPAR3LPAR6LPAR1LPAR4
SCHEMBL15131421 0.82 MGAM (0.46) ENPP2LPAR3LPAR6LPAR1LPAR4
SCHEMBL450002 0.81 ALDH1A1 (0.38) ENPP2ALDH1A1LMNANAAABLM
SCHEMBL29057731 0.80 ENPP2 (0.45) ENPP2LPAR3LPAR6LPAR1LPAR4
SCHEMBL139623 0.80 ALDH1A1 (0.44) ENPP2LPAR3LPAR6LPAR1LPAR4
SCHEMBL1470013 0.80 CA1 (0.41) ENPP2LPAR3LPAR6LPAR1LPAR4
SCHEMBL12311547 0.80 ENPP2 (0.37) ENPP2LPAR3LPAR6LPAR1LPAR4
SCHEMBL10438208 0.79 NAAA (0.44) ENPP2LPAR3LPAR6LPAR1LPAR4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4342920-A1 SILICONE CHAIN-CONTAINING POLYMER, COATING COMPOSITION, RESIST COMPOSITION AND ARTICLE DIC CORPORATION (JP) 2024-03-27 EP disclosed
CN-106883195-B Compound, coloring composition, color filter and display device 东友精细化工有限公司 2022-06-24 CN disclosed
CN-108073041-B Colored composition, colored curable resin composition, color filter, and display device 东友精细化工有限公司 2022-04-29 CN disclosed
CN-108073038-B Colored curable resin composition, color filter formed from colored curable resin composition, and display device including color filter 东友精细化工有限公司 2022-04-01 CN disclosed
CN-107522685-B Compound, colored curable resin composition, color filter, and display device 东友精细化工有限公司 2022-03-18 CN disclosed
CN-106892891-B Compound, colored curable resin composition, color filter, and liquid crystal display device 东友精细化工有限公司 2022-02-11 CN disclosed
CN-106892855-B Novel compound, colored dispersion liquid, colored curable resin composition, color filter, and display device 东友精细化工有限公司 2021-11-19 CN disclosed
CN-107861336-B Red curable resin composition, color filter formed from red curable resin composition, and display device including color filter 东友精细化工有限公司 2021-10-29 CN disclosed
CN-107121891-B Colored curable resin composition, color filter, and liquid crystal display device 东友精细化工有限公司 2021-08-10 CN disclosed
CN-106019840-B Colored curable resin composition 东友精细化工有限公司 2021-01-29 CN disclosed
US-10391750-B2 Cover window plate and image display device including the same DONGWOO FINE-CHEM CO., LTD. (KR) 2019-08-27 US disclosed
US-20180178494-A1 COVER WINDOW PLATE AND IMAGE DISPLAY DEVICE INCLUDING THE SAME DONGWOO FINE-CHEM CO., LTD. (KR) 2018-06-28 US disclosed
EP-1698644-B1 FLUORINE-CONTAINING PHOTOCURING COMPOSITION DAINIPPON INK & CHEMICALS (JP) 2013-02-27 EP disclosed
US-20120270142-A1 PHOTOSENSITIVE COMPOSITION AND METHOD OF MANUFACTURING A SUBSTRATE FOR A DISPLAY DEVICE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-10-25 US disclosed
US-20120064455-A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG TECHWIN CO., LTD. (KR) 2012-03-15 US disclosed
US-7592405-B2 Fluorine-containing photocurable composition DIC CORPORATION (JP) 2009-09-22 US disclosed
US-20070066779-A1 Fluorine-containing photocurable composition DIC CORPORATION (JP) 2007-03-22 US disclosed
EP-1698644-A1 FLUORINE-CONTAINING PHOTOCURING COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 2006-09-06 EP disclosed
CN-1818778-A Photosensitive resin composition, thin film panel and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD (KR) 2006-08-16 CN disclosed
US-20060177767-A1 Photosensitive resin composition, thin film panel including a layer made from photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. 2006-08-10 US disclosed