SCHEMBL450233

SCHEMBL450233

COc1ccc([S+](c2ccc(OC)cc2)c2ccc(OC)cc2)cc1.O=S(=O)([O-])c1ccccc1C(F)(F)F

nearest known ligand 0.53

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.53
KMT2A Q03164 2/20 0.53
SLC22A12 Q96S37 3/20 0.47
KDM4E B2RXH2 1/20 0.43
PTGDR2 Q9Y5Y4 1/20 0.43
NFE2L2 Q16236 1/20 0.41
FFAR4 Q5NUL3 1/20 0.41
MAOB P27338 2/20 0.40
ALDH1A1 P00352 1/20 0.40
BMP1 P13497 1/20 0.40
NPC1 O15118 1/20 0.40
RAB9A P51151 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
MEN1 O00255 1/20 0.40
LMNA P02545 1/20 0.40
MAPT P10636 1/20 0.40
HSD11B1 P28845 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3183361 0.97 GAA (0.51) GAAKMT2ASLC22A12KDM4EPTGDR2
SCHEMBL2898284 0.95 GAA (0.49) GAAKMT2ASLC22A12KDM4EPTGDR2
SCHEMBL3192045 0.86 SLC22A12 (0.39) GAAKMT2ASLC22A12ALDH1A1MEN1
SCHEMBL451959 0.84 KMT2A (0.46) GAAKMT2ASLC22A12ALDH1A1MEN1
SCHEMBL5445938 0.83 HSD11B1 (0.47) KMT2ASLC22A12FFAR4ALDH1A1MEN1
SCHEMBL3204977 0.82 SLC22A12 (0.42) GAAKMT2ASLC22A12FFAR4ALDH1A1
SCHEMBL2956231 0.82 PKM (0.41) GAAKMT2ANFE2L2ALDH1A1NPC1
SCHEMBL38660618 0.82 KAT6A (0.42) GAAKMT2ASLC22A12FFAR4MAOB
SCHEMBL2898422 0.82 GAA (0.51) GAAKMT2ASLC22A12KDM4EPTGDR2
SCHEMBL452162 0.81 HSD11B1 (0.45) KMT2ASLC22A12FFAR4ALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 214 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040253547-A1 Pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-12-16 US claimed
US-5994022-A BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID JSR CORPORATION (JP) 1999-11-30 US claimed
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD CANON KABUSHIKI KAISHA (JP) 2026-03-19 US disclosed
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD CANON KK (JP) 2026-02-12 US disclosed
US-12449731-B2 Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product ISR CORPORATION (JP) 2025-10-21 US disclosed
WO-2025075090-A1 ADHESIVE COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE 日東電工株式会社 2025-04-10 WO disclosed
WO-2025075091-A1 ADHESIVE COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE 日東電工株式会社 2025-04-10 WO disclosed
WO-2025041686-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR株式会社 2025-02-27 WO disclosed
WO-2025041685-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCING PLATED MOLDED ARTICLE, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE JSR株式会社 2025-02-27 WO disclosed
US-12174538-B2 Photosensitive resin composition, method for producing resist pattern film, method for producing plated formed product, and method for producing tin-silver plated-formed product JSR CORPORATION (JP) 2024-12-24 US disclosed
US-12158700-B2 Photosensitive resin composition, method for forming resist pattern, method for manufacturing plated molded article, and semiconductor apparatus JSR CORPORATION (JP) 2024-12-03 US disclosed
EP-0959389-A1 Diazodisulfone compound and radiation-sensitive resin composition JSR Corporation (JP) 1999-11-24 EP disclosed
US-5962180-A COMPRISING (A) A COPOLYMER COMPRISING RECURRING UNITS OF A P-HYDROXYSTYRENE UNIT AND A STYRENE UNIT HAVING AN ACETAL GROUP OR A KETAL GROUP AT THE P-POSITION, (B) A COPOLYMER COMPRISING RECURRING UNITS OF A T-BUTYL (METH)ACRYLATE UNIT JSR CORPORATION (JP) 1999-10-05 US disclosed
EP-0901043-A1 Radiation-sensitive resin composition JSR Corporation (JP) 1999-03-10 EP disclosed
EP-0898201-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-02-24 EP disclosed
EP-0843220-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-05-20 EP disclosed
US-5679495-A TERPOLYMER PHOTORESIST CONTAINING VINYLPHENOL DERIVATIVE, TERT-BUTYL (METH)ACRYLATE, AND A UNIT TO REDUCE ALKALINE SOLUBILITY; DRY ETCH RESISTANCE JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-10-21 US disclosed
EP-0793144-A2 Radiation sensitive composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-09-03 EP disclosed
US-5556734-A RESISTS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-09-17 US disclosed
EP-0660187-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-06-28 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD EEF1D, RHOA, YWHAH GAA 4403/4885KMT2A 1496/4885SLC22A12 4565/4885
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD SMCHD1, PIM1, PIM2 GAA 2794/4885KMT2A 407/4885SLC22A12 4619/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.