SCHEMBL4556902

SCHEMBL4556902

NC(=O)c1ccc(C(N)=O)c2c1CCCCCCCCCCC2

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 5/20 0.46
MAPK1 P28482 4/20 0.46
ALOX15 P16050 3/20 0.46
CASP1 P29466 1/20 0.46
CASP7 P55210 1/20 0.46
ALDH1A1 P00352 6/20 0.41
MAPT P10636 5/20 0.41
KDM4E B2RXH2 4/20 0.41
KMT2A Q03164 4/20 0.41
HPGD P15428 3/20 0.41
MEN1 O00255 3/20 0.41
NPC1 O15118 1/20 0.41
USP2 O75604 2/20 0.40
IKBKB O14920 1/20 0.40
TP53 P04637 1/20 0.40
MAPK10 P53779 1/20 0.40
HTR1A P08908 1/20 0.39
FABP4 P15090 1/20 0.38
TSHR P16473 1/20 0.38
HTT P42858 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8708889 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL35787 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL5459284 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL16739249 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL35972 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL919063 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL1160668 0.98 HSD17B10 (0.47) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL8362799 0.87 MAPT (0.42) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL6052857 0.85 HSD17B10 (0.40) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL472879 0.85 ALDH1A1 (0.43) HSD17B10MAPK1ALOX15CASP1CASP7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0262796-B1 Resin compositons and their manufacturing method TORAY INDUSTRIES (JP) 1993-11-03 EP claimed
US-4923925-A BLENDS OF POLYAMIDES AND POLYOLEFINS MODIFIED WITH IMIDE, AMIDE, ANHYDRIDE AND ACID FUNCTIONAL GROUPS; MOLDABILITY, IMPACT RESISTANCE TORAY INDUSTRIES, INC. 1990-05-08 US claimed
EP-0128775-B1 RESINOUS COMPOSITION TORAY INDUSTRIES, INC. (JP) 1989-11-15 EP claimed
EP-0262796-A2 Resin compositons and their manufacturing method TORAY INDUSTRIES, INC. (JP) 1988-04-06 EP claimed
US-4612346-A BLEND OF POLYAMIDE AND MODIFIED POLYOLEFIN TORAY INDUSTRIES, INC. (JP) 1986-09-16 US claimed
EP-0128775-A2 Resinous composition TORAY INDUSTRIES, INC. (JP) 1984-12-19 EP claimed
US-11993713-B2 Polyamide resin composition and method for producing same TOYOBO MC CORPORATION (JP) 2024-05-28 US disclosed
EP-3875532-B1 METALLIC-TONE THERMOPLASTIC RESIN PELLET UNITIKA LTD (JP) 2024-01-17 EP disclosed
EP-3560987-B1 GLASS FIBER-REINFORCED RESIN MOLDED ARTICLE NITTO BOSEKI CO LTD (JP) 2023-09-13 EP disclosed
US-20230174782-A1 POLYAMIDE RESIN COMPOSITION AND SLIDING MEMBER OILES CORPORATION (JP) 2023-06-08 US disclosed
US-20230136764-A1 ENDOSCOPIC FLEXIBLE TUBE, ENDOSCOPIC MEDICAL APPARATUS, AND ENDOSCOPIC-FLEXIBLE-TUBE-BASE-COVERING MATERIAL FUJIFILM CORPORATION (JP) 2023-05-04 US disclosed
EP-4173548-A1 FLEXIBLE TUBE FOR ENDOSCOPE, ENDOSCOPIC MEDICAL DEVICE, AND MATERIAL FOR COATING FLEXIBLE TUBE BASE MATERIAL FOR ENDOSCOPE FUJIFILM Corporation (JP) 2023-05-03 EP disclosed
EP-4141279-A1 POLYAMIDE RESIN COMPOSITION AND SLIDING MEMBER Oiles Corporation (JP) 2023-03-01 EP disclosed
EP-0128775-B1 RESINOUS COMPOSITION TORAY INDUSTRIES, INC. (JP) 1989-11-15 EP disclosed
EP-0262796-A2 Resin compositons and their manufacturing method TORAY INDUSTRIES, INC. (JP) 1988-04-06 EP disclosed
US-4612346-A BLEND OF POLYAMIDE AND MODIFIED POLYOLEFIN TORAY INDUSTRIES, INC. (JP) 1986-09-16 US disclosed
EP-0073557-B1 COPOLYAMIDE, PROCESS FOR PRODUCING THEREOF AND COPOLYAMIDE MOLDING COMPOSITION COMPRISING THEREOF TORAY INDUSTRIES, INC. (JP) 1985-09-25 EP disclosed
EP-0128775-A2 Resinous composition TORAY INDUSTRIES, INC. (JP) 1984-12-19 EP disclosed
US-4471088-A MOLDING MATERIALS, HEXAMETHYLENEDIAMINE, UNDECAMETHYLENEDIAMINE TORAY INDUSTRIES, INC. (JP) 1984-09-11 US disclosed
EP-0073557-A1 Copolyamide, process for producing thereof and copolyamide molding composition comprising thereof TORAY INDUSTRIES, INC. (JP) 1983-03-09 EP disclosed