SCHEMBL919063

SCHEMBL919063

NC(=O)c1ccc(C(N)=O)c2c1CCCCCCCCC2

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HSD17B10 Q99714 5/20 0.46
▸ MAPK1 P28482 4/20 0.46
▸ ALOX15 P16050 3/20 0.46
▸ CASP1 P29466 1/20 0.46
▸ CASP7 P55210 1/20 0.46
▸ ALDH1A1 P00352 6/20 0.41
▸ MAPT P10636 5/20 0.41
▸ KDM4E B2RXH2 4/20 0.41
▸ KMT2A Q03164 4/20 0.41
▸ HPGD P15428 3/20 0.41
▸ MEN1 O00255 3/20 0.41
▸ NPC1 O15118 1/20 0.41
▸ USP2 O75604 2/20 0.40
▸ IKBKB O14920 1/20 0.40
▸ TP53 P04637 1/20 0.40
▸ MAPK10 P53779 1/20 0.40
▸ HTR1A P08908 1/20 0.39
▸ FABP4 P15090 1/20 0.38
▸ TSHR P16473 1/20 0.38
▸ HTT P42858 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35972 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL4556902 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL35787 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL5459284 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL16739249 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL8708889 1.00 HSD17B10 (0.46) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL1160668 0.98 HSD17B10 (0.47) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL8362799 0.87 MAPT (0.42) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL472879 0.85 ALDH1A1 (0.43) HSD17B10MAPK1ALOX15CASP1CASP7
SCHEMBL6052857 0.85 HSD17B10 (0.40) HSD17B10MAPK1ALOX15CASP1CASP7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11993713-B2 Polyamide resin composition and method for producing same TOYOBO MC CORPORATION (JP) 2024-05-28 — — US disclosed
EP-3875532-B1 METALLIC-TONE THERMOPLASTIC RESIN PELLET UNITIKA LTD (JP) 2024-01-17 — — EP disclosed
EP-3560987-B1 GLASS FIBER-REINFORCED RESIN MOLDED ARTICLE NITTO BOSEKI CO LTD (JP) 2023-09-13 — — EP disclosed
US-20230174782-A1 POLYAMIDE RESIN COMPOSITION AND SLIDING MEMBER OILES CORPORATION (JP) 2023-06-08 — — US disclosed
EP-4141279-A1 POLYAMIDE RESIN COMPOSITION AND SLIDING MEMBER Oiles Corporation (JP) 2023-03-01 — — EP disclosed
CN-115605544-A Polyamide resin composition and sliding member 奥依列斯工业株式会社(JP) 2023-01-13 — — CN disclosed
CN-114773841-A Polyamide composition and molded article 旭化成株式会社 2022-07-22 — — CN disclosed
US-20220127458-A1 TUBE, AND POLYAMIDE RESIN COMPOSITION KURARAY CO., LTD. (JP) 2022-04-28 — — US disclosed
EP-3932975-A1 TUBE, AND POLYAMIDE RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2022-01-05 — — EP disclosed
US-20210403710-A1 METALLIC-TONE THERMOPLASTIC RESIN PELLET UNITIKA LTD. (JP) 2021-12-30 — — US disclosed
EP-1270671-B1 RESIN STRUCTURE AND USE THEREOF TORAY INDUSTRIES (JP) 2006-04-19 — — EP disclosed
US-6998434-B2 Blend of a polymer selected from polyamide, styrenic resin, polyolefin,polycarbonate, polyphenylenesulfide, liquid crystal polymer, phenolic resin and elastomer and conductive carbon fiber for achieving higher conductivity TORAY INDUSTRIES, INC. (JP) 2006-02-14 — — US disclosed
US-20050181158-A1 Resin structure and use thereof TORAY INDUSTRIES, INC. (JP) 2005-08-18 — — US disclosed
US-6900272-B2 Resin structure TORAY INDUSTRIES, INC. (JP) 2005-05-31 — — US disclosed
US-6830792-B1 Resin structure and use thereof TORAY INDUSTRIES, INC. (JP) 2004-12-14 — — US disclosed
US-20040138377-A1 Resin structure TORAY INDUSTRIES, INC. A CORPORATION OF JAPAN (JP) 2004-07-15 — — US disclosed
US-20040077771-A1 Blend of a polymer selected from polyamide, styrenic resin, polyolefin,polycarbonate, polyphenylenesulfide, liquid crystal polymer, phenolic resin and elastomer and conductive carbon fiber for achieving higher conductivity TORAY INDUSTRIES, INC. (JP) 2004-04-22 — — US disclosed
EP-1367097-A1 CARBON FIBER REINFORCED RESIN COMPOSITION, MOLDING MATERIAL AND MOLDED ARTICLE THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-12-03 — — EP disclosed
EP-1270671-A1 RESIN STRUCTURE AND USE THEREOF TORAY INDUSTRIES, INC. (JP) 2003-01-02 — — EP disclosed
EP-1262526-A1 RESIN STRUCTURE AND USE THEREOF TORAY INDUSTRIES, INC. (JP) 2002-12-04 — — EP disclosed
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