Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.56 |
| ▸ | ADORA3 | P0DMS8 | 3/20 | 0.47 |
| ▸ | ADORA2A | P29274 | 3/20 | 0.47 |
| ▸ | ADORA1 | P30542 | 3/20 | 0.47 |
| ▸ | TP53 | P04637 | 2/20 | 0.42 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.42 |
| ▸ | RAB9A | P51151 | 4/20 | 0.40 |
| ▸ | MEN1 | O00255 | 2/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.40 |
| ▸ | PDGFRB | P09619 | 1/20 | 0.39 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.39 |
| ▸ | TNKS2 | Q9H2K2 | 1/20 | 0.39 |
| ▸ | NPC1 | O15118 | 2/20 | 0.37 |
| ▸ | PKM | P14618 | 1/20 | 0.37 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.37 |
| ▸ | RECQL | P46063 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1917870 | 0.85 | ADORA3 (0.50) | SMN1; SMN2ADORA3ADORA2AADORA1TP53 | |
| SCHEMBL948854 | 0.83 | GSK3B (0.44) | SMN1; SMN2TP53RAB9ANPC1MAPT | |
| SCHEMBL27909694 | 0.83 | RAD51 (0.42) | SMN1; SMN2ADORA3ADORA1L3MBTL1RAB9A | |
| SCHEMBL14039561 | 0.83 | METAP2 (0.47) | SMN1; SMN2TP53RAB9AMEN1KMT2A | |
| Hydrochloric Acid SCHEMBL27508453 | 0.83 | SMN1; SMN2 (0.42) | SMN1; SMN2ADORA3ADORA2AADORA1RAB9A | |
| SCHEMBL6618330 | 0.82 | GSK3B (0.44) | SMN1; SMN2ADORA3ADORA2AADORA1TP53 | |
| SCHEMBL8012285 | 0.81 | TLR8 (0.39) | SMN1; SMN2ADORA3ADORA2AADORA1TP53 | |
| SCHEMBL8010665 | 0.81 | SMN1; SMN2 (0.38) | SMN1; SMN2ADORA3ADORA2AADORA1DDAH1 | |
| SCHEMBL19405233 | 0.81 | ALDH1A1 (0.39) | SMN1; SMN2ADORA3ADORA2AADORA1L3MBTL1 | |
| SCHEMBL28079633 | 0.81 | NPC1 (0.42) | SMN1; SMN2ADORA2AADORA1TP53L3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 145 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119978718-A | High-heat-conductivity epoxy resin composition for copper-clad plate and preparation method thereof | 江西五阳新材料有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-119371819-A | Glue solution, glue solution preparation method and method for manufacturing halogen-free high-Tg copper-clad plate | 宁波甬强科技有限公司 | 2025-01-28 | — | — | CN | claimed |
| CN-119217811-A | Low-dielectric high-heat-resistance copper-clad plate and preparation method thereof | 宁波甬强科技有限公司 | 2024-12-31 | — | — | CN | claimed |
| CN-115458809-B | Electrolyte and lithium ion battery comprising same | 湖州昆仑亿恩科电池材料有限公司 | 2024-12-13 | — | — | CN | claimed |
| CN-118146614-A | Hole plugging resin composition for circuit board, preparation method of hole plugging resin composition and hole plugging circuit board | 珠海市板明科技有限公司 | 2024-06-07 | — | — | CN | claimed |
| CN-116178890-A | Thermosetting resin composition, prepreg for PCB and copper-clad plate for PCB | 深圳伊帕思新材料科技有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-115458809-A | Electrolyte and lithium ion battery comprising same | 香河昆仑新能源材料股份有限公司 | 2022-12-09 | — | — | CN | claimed |
| CN-112250999-A | Heat-resistant epoxy resin composition, halogen-free middle-Tg copper-clad plate and preparation method thereof | 广德龙泰电子科技有限公司 | 2021-01-22 | — | — | CN | claimed |
| CN-112175354-A | Heat-resistant epoxy resin composition, lead-free high-Tg copper-clad plate and preparation method thereof | 广德龙泰电子科技有限公司 | 2021-01-05 | — | — | CN | claimed |
| CN-112063111-A | Modified epoxy resin composition, high-Tg low-loss laminated copper-clad plate and preparation method thereof | 广德龙泰电子科技有限公司 | 2020-12-11 | — | — | CN | claimed |
| CN-101914265-A | A kind of non-halogen phosphorus-containing flame retardant high-frequency epoxy resin based composition and the application in bonding sheet and copper-clad plate thereof | GUANGZHOU MICA AVA ELECTRONIC MATERIALS CO LTD | 2010-12-15 | — | — | CN | claimed |
| US-20100240811-A1 | Thermosetting Resin Composition and Application Thereof | ITEQ (DONGGUAN) CORPORATION (CN) | 2010-09-23 | — | — | US | claimed |
| CN-101602881-A | Thermosetting resin composition and application thereof | ITEQ CORP (CN) | 2009-12-16 | — | — | CN | claimed |
| CN-101481490-A | Thermosetting resin composition and application thereof | DONGGUAN ITEQ CORP (CN) | 2009-07-15 | — | — | CN | claimed |
| EP-1270635-B1 | Solvent-based process for manufacturing latent curing catalysts | NAT STARCH CHEM INVEST (US) | 2005-08-24 | — | — | EP | claimed |
| EP-0866819-B1 | METHOD FOR PREPARING A CURING AGENT FOR EPOXY RESINS | MINNESOTA MINING & MFG (US) | 2000-01-26 | — | — | EP | claimed |
| EP-0866819-A1 | METHOD FOR PREPARING A CURING AGENT FOR EPOXY RESINS | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1998-09-30 | — | — | EP | claimed |
| US-5801218-A | IMIDAZOLE-EPOXY ADDUCTS AS CURING AGENTS FOR EPOXY RESINS | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1998-09-01 | — | — | US | claimed |
| US-5717011-A | AGITATING MIXTURE OF EPOXY COMPOUND, IMIDAZOLE COMPOUND AND WATER WITH HEATING TO FORM CURING AGENT | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1998-02-10 | — | — | US | claimed |
| WO-1997021751-A1 | METHOD FOR PREPARING A CURING AGENT FOR EPOXY RESINS | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1997-06-19 | — | — | WO | claimed |