SCHEMBL4580201

SCHEMBL4580201

NCCCCCC(CCN)CCCCN

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 5/20 0.50
CA12 O43570 2/20 0.50
CA1 P00915 2/20 0.50
CA2 P00918 2/20 0.50
CA3 P07451 2/20 0.50
CA4 P22748 2/20 0.50
CA6 P23280 2/20 0.50
CA5A P35218 2/20 0.50
CA7 P43166 2/20 0.50
CA9 Q16790 2/20 0.50
CA14 Q9ULX7 2/20 0.50
CA5B Q9Y2D0 2/20 0.50
TSHR P16473 2/20 0.50
LMNA P02545 1/20 0.50
BLM P54132 1/20 0.50
NFKB1 P19838 1/20 0.44
GSR P00390 1/20 0.39
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8642553 0.97 NFKB1 (0.47) DNM1CA12CA1CA2CA3
SCHEMBL34891 0.94 NFKB1 (0.44) DNM1CA12CA1CA2CA3
SCHEMBL6449322 0.90 DNM1 (0.53) DNM1CA12CA1CA2CA3
SCHEMBL11152332 0.90 DNM1 (0.53) DNM1CA12CA1CA2CA3
SCHEMBL25323554 0.88 DNM1 (0.44) DNM1CA12CA1CA2CA3
SCHEMBL31537592 0.87 DNM1 (0.48) DNM1CA12CA1CA2CA3
SCHEMBL3835219 0.87 DNM1 (0.62) DNM1TSHRLMNAMEN1KMT2A
SCHEMBL6903341 0.87 LMNA (0.40) DNM1CA12CA1CA2CA3
SCHEMBL31537636 0.87 DNM1 (0.48) DNM1CA12CA1CA2CA3
SCHEMBL18059884 0.87 DNM1 (0.55) DNM1TSHRLMNAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7358312-B2 Epoxy resin curing agent of epoxy resin-liquid amine adduct and polyamidoamine HEXION SPECIALTY CHEMICALS, INC. (US) 2008-04-15 US disclosed
EP-1436339-B1 LOW VISCOSITY CURING AGENTS COMPOSITIONS IN EPOXY RESIN SYSTEMS FOR LOW TEMPERATURE CURE APPLICATIONS RESOLUTION RES NEDERLAND BV (NL) 2005-10-19 EP disclosed
US-20040242835-A1 Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications Westlake Epoxy Inc. 2004-12-02 US disclosed
EP-1436339-A1 LOW VISCOSITY CURING AGENTS COMPOSITIONS IN EPOXY RESIN SYSTEMS FOR LOW TEMPERATURE CURE APPLICATIONS Resolution Research Nederland B.V. (NL) 2004-07-14 EP disclosed
WO-2003020789-A1 LOW VISCOSITY CURING AGENTS COMPOSITIONS IN EPOXY RESIN SYSTEMS FOR LOW TEMPERATURE CURE APPLICATIONS RESOLUTION RESEARCH NEDERLAND B.V. (NL) 2003-03-13 WO disclosed