SCHEMBL4586446

SCHEMBL4586446

Cc1ccc(S(=O)(=O)C(=[N+]=[N-])C(=O)O)cc1C(C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.35
WDR5 P61964 1/20 0.33
HTT P42858 1/20 0.33
LMNA P02545 3/20 0.33
GABBR2 O75899 1/20 0.30
GABBR1 Q9UBS5 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1089447 0.76 ALDH1A1 (0.43) ALDH1A1HTTLMNA
SCHEMBL4279667 0.72 LMNA (0.42) ALDH1A1LMNA
SCHEMBL3975777 0.70 SMN1; SMN2 (0.42) ALDH1A1HTTLMNA
SCHEMBL16355399 0.70 LMNA (0.43) ALDH1A1LMNA
SCHEMBL562964 0.69 ALDH1A1 (0.43) ALDH1A1HTTLMNA
SCHEMBL17298623 0.67 ALDH1A1 (0.50) ALDH1A1HTTLMNA
SCHEMBL24335748 0.66 LMNA (0.37) ALDH1A1HTTLMNA
SCHEMBL384657 0.66 ALDH1A1 (0.44) ALDH1A1HTTLMNA
SCHEMBL31757009 0.66 ALDH1A1 (0.44) ALDH1A1HTTLMNA
SCHEMBL7765176 0.65 LMNA (0.50) ALDH1A1WDR5LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1579272-A4 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS FUJIFILM ELECTRONIC MATERIALS (US) 2008-12-17 EP disclosed
US-7018776-B2 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. (US) 2006-03-28 US disclosed
EP-1609026-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE FujiFilm Electronic Materials USA, Inc. (US) 2005-12-28 EP disclosed
EP-1579272-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS Fujifilm Electronic Materials USA, Inc. (US) 2005-09-28 EP disclosed
EP-1299774-A4 PERFLUOROALKYLSULFONIC ACID COMPOUNDS FOR PHOTORESISTS ARCH SPEC CHEM INC (US) 2005-06-08 EP disclosed
US-6855476-B2 Photoacid generators for use in photoresist compositions ARCH SPECIALTY CHEMICALS, INC. (US) 2005-02-15 US disclosed
US-20040161711-A1 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US disclosed
US-20040161619-A1 Process for producing a heat resistant relief structure ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US disclosed
WO-2004055592-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO disclosed
WO-2004055593-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO disclosed
EP-1299774-A1 PERFLUOROALKYLSULFONIC ACID COMPOUNDS FOR PHOTORESISTS ARCH SPECIALTY CHEMICALS, INC. (US) 2003-04-09 EP disclosed
US-20020197558-A1 Photoacid generators for use in photoresist compositions ARCH SPECIALTY CHEMICALS, INC. 2002-12-26 US disclosed
WO-2002082185-A1 PERFLUOROALKYLSULFONIC ACID COMPOUNDS FOR PHOTORESISTS ARCH SPECIALTY CHEMICALS, INC. (US) 2002-10-17 WO disclosed