Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.38 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.31 |
| ▸ | PDE4A | P27815 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | BLM | P54132 | 1/20 | 0.31 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL458345 | 0.94 | APP (0.39) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL17819146 | 0.92 | APP (0.38) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL518982 | 0.82 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL422953 | 0.80 | APP (0.42) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL13417438 | 0.80 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL16499985 | 0.80 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL28767276 | 0.80 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL856905 | 0.80 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL16500026 | 0.80 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL17819134 | 0.78 | APP (0.41) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20080142370-A1 | Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-06-19 | — | — | US | claimed |
| EP-1651801-B1 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-01-23 | — | — | EP | claimed |
| EP-0785297-B1 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH DEUTSCHLAND GMBH (DE) | 2000-01-05 | — | — | EP | claimed |
| EP-0554275-B1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | ATOTECH DEUTSCHLAND GMBH (DE) | 1994-12-14 | — | — | EP | claimed |
| EP-0297306-B1 | AQUEOUS ACID BATH FOR THE GALVANIC DEPOSITION OF BRIGHTENING AND LEVELING COPPER COATINGS | SCHERING AKTIENGESELLSCHAFT (DE) | 1993-01-20 | — | — | EP | claimed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | claimed |
| US-20080142370-A1 | Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-06-19 | — | — | US | disclosed |
| EP-1651801-B1 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-01-23 | — | — | EP | disclosed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | disclosed |