Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 4/20 | 0.58 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.58 |
| ▸ | LMNA | P02545 | 3/20 | 0.58 |
| ▸ | MAPT | P10636 | 3/20 | 0.58 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.58 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.58 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.43 |
| ▸ | MYC | P01106 | 1/20 | 0.43 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.43 |
| ▸ | PDK2 | Q15119 | 6/20 | 0.42 |
| ▸ | HNF4A | P41235 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 3/20 | 0.40 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | NPC1 | O15118 | 1/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
| ▸ | RAB9A | P51151 | 1/20 | 0.39 |
| ▸ | GFER | P55789 | 1/20 | 0.39 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31198543 | 1.00 | MEN1 (0.58) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL9220275 | 0.87 | HNF4A (0.45) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL9557304 | 0.84 | MEN1 (0.60) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL5968745 | 0.84 | PDK2 (0.56) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL6869548 | 0.83 | ALDH1A1 (0.51) | MEN1KMT2ALMNAMAPTALDH1A1 | |
| SCHEMBL9549747 | 0.82 | ESR1 (0.47) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL5968721 | 0.81 | MYC (0.49) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL22862273 | 0.79 | DDAH1 (0.42) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL31275905 | 0.78 | ESR1 (0.66) | MEN1KMT2ALMNAMAPTKDM4E | |
| SCHEMBL4660239 | 0.77 | MEN1 (0.68) | MEN1KMT2ALMNAMAPTKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024204336-A1 | RESIN COMPOSITION, CURED ARTICLE, SUBSTRATE WITH CURED ARTICLE, LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024204181-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2024-10-03 | — | — | WO | disclosed |
| EP-4397731-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2024-07-10 | — | — | EP | disclosed |
| US-11787905-B2 | Polyamide compound | TOYOTA BOSHOKU KABUSHIKI KAISHA (JP) | 2023-10-17 | — | — | US | disclosed |
| WO-2023032888-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-11186757-B2 | Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2021-11-30 | — | — | US | disclosed |
| US-20210139700-A1 | RESIN COMPOSITION, RESIN LAYER, PERMANENT ADHESIVE, ADHESIVE FOR TEMPORARY BONDING, LAMINATED FILM, PROCESSED WAFER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2021-05-13 | — | — | US | disclosed |
| US-10941320-B2 | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion | TORAY INDUSTRIES, INC. (JP) | 2021-03-09 | — | — | US | disclosed |
| EP-3187559-B1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, METHOD FOR MANUFACTURING WAFER WORK PIECE AND SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2021-02-17 | — | — | EP | disclosed |
| EP-2902447-B1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-10-28 | — | — | EP | disclosed |
| EP-2902447-A1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2015-08-05 | — | — | EP | disclosed |
| EP-2735580-A1 | POLYIMIDE RESIN, RESIN COMPOSITION AND LAMINATED FILM THAT USE SAME | Toray Industries, Inc. (JP) | 2014-05-28 | — | — | EP | disclosed |
| US-8668992-B2 | Fluorinated polyimides with fluorene cardo structure as optical materials that have low absolute thermo-optic coefficients | BREWER SCIENCE INC. (US) | 2014-03-11 | — | — | US | disclosed |
| US-20120308835-A1 | FLUORINATED POLYIMIDES WITH FLUORENE CARDO STRUCTURE AS OPTICAL MATERIALS THAT HAVE LOW ABSOLUTE THERMO-OPTIC COEFFICIENTS | BREWER SCIENCE INC. (US) | 2012-12-06 | — | — | US | disclosed |
| EP-1739114-B1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2008-12-17 | — | — | EP | disclosed |
| US-20070260035-A1 | Polyimide Resin, Laminate Film, Metal Layer-Bearing Laminate Film, and Semiconductor Device | TORAY INDUSTRIES, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| EP-1739114-A1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2007-01-03 | — | — | EP | disclosed |
| EP-1213049-B1 | GAS SEPARATION MEMBRANE AND PROCESS FOR PRODUCING A POLYMER | NAT INST OF ADVANCED IND SCIEN (JP) | 2006-11-15 | — | — | EP | disclosed |
| US-6531569-B1 | Halogenated polyimides having heat and chemical resistance used as permselective membranes | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2003-03-11 | — | — | US | disclosed |
| EP-1213049-A1 | RESIN MATERIAL FOR GAS SEPARATION BASE AND PROCESS FOR PRODUCING THE SAME | National Institute of Advanced Industrial Science and Technology (JP) | 2002-06-12 | — | — | EP | disclosed |