SCHEMBL473219

SCHEMBL473219

Cc1c(N(CC2CO2)CC2CO2)ccc(O)c1CC1CO1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL412529 0.79 KDM4E (0.35)
SCHEMBL27143677 0.77 TRPA1 (0.41) MEN1KMT2A
SCHEMBL22689633 0.76 ESR1 (0.36)
SCHEMBL31504058 0.75 PTPN1 (0.35)
SCHEMBL9778183 0.75 PTPN1 (0.35)
Ethane SCHEMBL8847362 0.73 KDM4E (0.37) MEN1KMT2A
SCHEMBL26141 0.73 MEN1 (0.35) MEN1KMT2A
SCHEMBL1644776 0.71 ALDH1A1 (0.39) MEN1KMT2A
SCHEMBL31201888 0.70 MEN1 (0.35) MEN1KMT2A
SCHEMBL11348951 0.70 HTR1D (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 212 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4714984-A1 DUAL CURE STRUCTURAL ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2026-03-25 EP claimed
US-11441027-B2 Epoxy resin composition, prepreg, and fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2022-09-13 US claimed
US-7883766-B2 carbon fiber reinforced epoxy resin formulation: an epoxy resin component (A) formed by mixing and heating a bifunctional, trifunctional epoxy resin, a phenol compound and a polyamide; a trifunctional epoxy resin(B), a tetrafunctional epoxy resin (C) an aromatic amine compound(D); heat resistant MITSUBISHI RAYON CO., LTD. (JP) 2011-02-08 US claimed
EP-0397860-B1 EPOXY RESIN COMPOSITION MITSUBISHI RAYON CO (JP) 1999-03-03 EP claimed
EP-0326177-B1 Epoxy resin composition and prepreg for composite materials using the same MITSUBISHI RAYON CO (JP) 1995-01-18 EP claimed
EP-0366068-B1 Epoxy resin composition MITSUBISHI RAYON CO (JP) 1995-01-18 EP claimed
US-5179139-A POLYAMINES MITSUBISHI RAYON CO., LTD. (JP) 1993-01-12 US claimed
US-4959438-A Epoxy resin composition and prepreg for composite materials using the same from bi and tri-epoxides, triarylbisphenols and diaminodiphenylsulfones MITSUBISHI RAYON COMPANY, LTD. (JP) 1990-09-25 US claimed
JP-2051538-A None JP disclosed
JP-63305124-A None JP disclosed
JP-63305123-A None JP disclosed
US-12637536-B2 Epoxy resin composition, prepreg, fiber-reinforced resin molded body, and integrated product TORAY INDUSTRIES, INC. (JP) 2026-05-26 US disclosed
EP-4714984-A1 DUAL CURE STRUCTURAL ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2026-03-25 EP disclosed
US-12558816-B2 Prepreg, molded article, and integrally molded article TORAY INDUSTRIES, INC. (JP) 2026-02-24 US disclosed
US-4959438-A Epoxy resin composition and prepreg for composite materials using the same from bi and tri-epoxides, triarylbisphenols and diaminodiphenylsulfones MITSUBISHI RAYON COMPANY, LTD. (JP) 1990-09-25 US disclosed
EP-0366068-A2 Epoxy resin composition MITSUBISHI RAYON CO., LTD. (JP) 1990-05-02 EP disclosed
JP-H0251538-A FIBER-REINFORCED COMPOSITE MATERIAL SUMITOMO CHEM CO LTD 1990-02-21 JP disclosed
EP-0326177-A2 Epoxy resin composition and prepreg for composite materials using the same MITSUBISHI RAYON COMPANY, LTD. (JP) 1989-08-02 EP disclosed
JP-S63305124-A EPOXY RESIN COMPOSITION MITSUBISHI RAYON CO LTD 1988-12-13 JP disclosed
JP-S63305123-A EPOXY RESIN COMPOSITION MITSUBISHI RAYON CO LTD 1988-12-13 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12637536-B2 Epoxy resin composition, prepreg, fiber-reinforced resin molded body, and integrated product PSMA1, GLRB, GLRA1 MEN1 1512/4885KMT2A 2085/4885
US-12558816-B2 Prepreg, molded article, and integrally molded article MACF1, ITGB3, LMNA MEN1 257/4885KMT2A 4084/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.