SCHEMBL47480

SCHEMBL47480

CCC(C)(C)C(=O)OC1(C)CC2CCC21C

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.31
HMGCR P04035 1/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL98166 0.82 SLC6A1 (0.32)
SCHEMBL2735488 0.75 HMGCR (0.32) HMGCR
SCHEMBL132916 0.74 HMGCR (0.30) HMGCR
SCHEMBL12378938 0.74 CYP1A2 (0.32)
SCHEMBL47399 0.74
SCHEMBL19418037 0.73 L3MBTL1 (0.31) L3MBTL1
SCHEMBL25701413 0.72 GPR84 (0.33)
SCHEMBL15473007 0.72 CYP1A2 (0.40) HMGCRALDH1A1
SCHEMBL6367203 0.71 SLC6A1 (0.30)
SCHEMBL120308 0.71 HMGCR (0.30) HMGCR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9897922-B2 Method of forming pattern and developer for use in the method FUJIFILM CORPORATION (JP) 2018-02-20 US disclosed
US-9523913-B2 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-12-20 US disclosed
US-9250531-B2 Method of forming resist pattern and negative tone-development resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2016-02-02 US disclosed
US-9244347-B2 Resist composition, compound, polymeric compound and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-01-26 US disclosed
US-9235123-B2 Resist composition and resist pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2016-01-12 US disclosed
US-9134617-B2 Solvent developable negative resist composition, resist pattern formation method, and method for forming pattern of layer including block copolymer TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-15 US disclosed
US-9069246-B2 Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method and resist film using the composition, and electronic device manufacturing method and electronic device using these FUJIFILM CORPORATION (JP) 2015-06-30 US disclosed
US-9023581-B2 Resist composition, method of forming resist pattern, polymeric compound, and compound TOKYO OHKA KOGYO CO., LTD (JP) 2015-05-05 US disclosed
US-8911928-B2 Resist composition, method of forming resist pattern, polymeric compound and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2014-12-16 US disclosed
US-20140356787-A1 RESIST COMPOSITION, COMPOUND, POLYMERIC COMPOUND AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2014-12-04 US disclosed
US-8012665-B2 Positive photosensitive composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2011-09-06 US disclosed
US-20110117491-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2011-05-19 US disclosed
US-7914965-B2 Resist composition and method of pattern formation with the same FUJIFILM CORPORATION (JP) 2011-03-29 US disclosed
US-7811740-B2 comprising acrylate resin having a monocyclic or polycyclic alicyclic hydrocarbon structure, and a surfactant containing a fluorine compound or fluorine containing polyethers; resist pattern with good sensitivity, resolution, adhesion, and little in development defects; for an immersion exposure FUJIFILM CORPORATION (JP) 2010-10-12 US disclosed
US-7790351-B2 Resin showing an increase in solubility in alkali developer by action of an acid, a compound being capable of generating an acid when irradiated with an actinic ray or radiation, an acrylic resin with silicon-containing units and being stable to acids but insoluble in alkali developer, solvent FUJIFILM CORPORATION (JP) 2010-09-07 US disclosed
US-20100136479-A1 POSITIVE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2010-06-03 US disclosed
US-20100040971-A1 PATTERN FORMING METHOD, AND RESIST COMPOSITION, DEVELOPER AND RINSING SOLUTION USED IN THE PATTERN FORMING METHOD FUJIFILM Corporaion (JP) 2010-02-18 US disclosed
US-20090136870-A1 Resin showing an increase in solubility in alkali developer by action of an acid, a compound being capable of generating an acid when irradiated with an actinic ray or radiation, an acrylic resin with silicon-containing units and being stable to acids but insoluble in alkali developer, solvent FUJIFILM CORPORATION (JP) 2009-05-28 US disclosed
US-20090023096-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2009-01-22 US disclosed
US-20070072118-A1 Positive photosensitive composition and pattern forming method using the same FUJI PHOTO FILM CO., LTD. 2007-03-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100136479-A1 POSITIVE PHOTOSENSITIVE COMPOSITION AFF1, F12, AFF2 EPHX2 1401/4885L3MBTL1 4280/4885HMGCR 4708/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.