SCHEMBL47861

SCHEMBL47861

Cc1ccc(-c2ccc(C)c(O)c2)cc1O

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.56
CASP1 P29466 1/20 0.56
APP P05067 2/20 0.55
ACHE P22303 1/20 0.52
TRPA1 O75762 1/20 0.52
PTGS1 P23219 1/20 0.52
CACNA1C Q13936 1/20 0.52
CYP3A4 P08684 3/20 0.50
ALOX15 P16050 2/20 0.50
HSD17B10 Q99714 2/20 0.50
ALDH1A1 P00352 2/20 0.50
KDM4E B2RXH2 1/20 0.50
CYP1A2 P05177 1/20 0.50
CYP2D6 P10635 1/20 0.50
MAPT P10636 1/20 0.50
G6PD P11413 1/20 0.50
CYP2C9 P11712 1/20 0.50
PKM P14618 1/20 0.50
HPGD P15428 1/20 0.50
ALOX12 P18054 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12387990 0.92 APP (0.70) TSHRCASP1APPACHETRPA1
SCHEMBL14295102 0.92 MCL1 (0.57) TSHRCASP1APPACHETRPA1
SCHEMBL13695146 0.90 TSHR (0.48) TSHRCASP1APPACHETRPA1
SCHEMBL31344493 0.90 HSD17B1 (0.59) TSHRCASP1APPCYP3A4ALOX15
SCHEMBL31212445 0.90 HSD17B1 (0.59) TSHRCASP1APPCYP3A4ALOX15
SCHEMBL1007614 0.90 MCL1 (0.52) TSHRCASP1APPACHETRPA1
SCHEMBL1005170 0.88 ALOX5 (0.64) TSHRCASP1APPALOX15HSD17B10
SCHEMBL7082674 0.88 ABL1 (0.52) TSHRCASP1APPACHETRPA1
SCHEMBL14803748 0.86 ALOX15 (0.74) TSHRCASP1APPACHETRPA1
SCHEMBL22107622 0.86 ERN1 (0.51) TSHRCASP1APPACHETRPA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 229 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024605-B2 Polyamide-based composite film and display device comprising same SK MICROWORKS SOLUTIONS CO., LTD. (KR) 2024-07-02 US disclosed
US-11840611-B2 Polyamide-based composite film and display device comprising same SK MICROWORKS SOLUTIONS CO., LTD. (KR) 2023-12-12 US disclosed
US-20230387548-A1 Heat/Flame-Resistant Polymer Composite-Based Solid Electrolyte Separator, Lithium Secondary Battery, and Manufacturing Method GLOBAL GRAPHENE GROUP, INC. (US) 2023-11-30 US disclosed
US-20230387548-A1 Heat/Flame-Resistant Polymer Composite-Based Solid Electrolyte Separator, Lithium Secondary Battery, and Manufacturing Method GLOBAL GRAPHENE GROUP, INC. (US) 2023-11-30 US disclosed
US-11820893-B2 Polymer film and preparation method thereof SK MICROWORKS CO., LTD. (KR) 2023-11-21 US disclosed
US-11820893-B2 Polymer film and preparation method thereof SK MICROWORKS CO., LTD. (KR) 2023-11-21 US disclosed
US-11805616-B2 Polyimide-based composite film and display device comprising same SK MICROWORKS CO., LTD. (KR) 2023-10-31 US disclosed
US-11795283-B2 Polyamide-based film, and cover window and display device comprising same SK MICROWORKS CO., LTD. (KR) 2023-10-24 US disclosed
US-11780965-B2 Polyamide-imide film and preparation method thereof SK MICROWORKS CO., LTD. (KR) 2023-10-10 US disclosed
US-11780965-B2 Polyamide-imide film and preparation method thereof SK MICROWORKS CO., LTD. (KR) 2023-10-10 US disclosed
US-20090127735-A1 DOPE AND PROCESS FOR THE PRODUCTION OF FIBER FROM THE DOPE TEIJIN LIMITED (JP) 2009-05-21 US disclosed
US-20090088505-A1 MOLDING DOPE TEIJIN LIMITED (JP) 2009-04-02 US disclosed
US-20090088505-A1 MOLDING DOPE TEIJIN LIMITED (JP) 2009-04-02 US disclosed
US-20090045725-A1 POLYARYLENE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2009-02-19 US disclosed
EP-1947132-A1 DOPE AND METHOD FOR MANUFACTURE OF FIBER USING THE DOPE TEIJIN LIMITED (JP) 2008-07-23 EP disclosed
EP-1889876-A1 DOPE FOR MOLDING TEIJIN LIMITED (JP) 2008-02-20 EP disclosed
US-20070269665-A1 Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board KANEKA CORPORATION (JP) 2007-11-22 US disclosed
US-20070269665-A1 Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board KANEKA CORPORATION (JP) 2007-11-22 US disclosed
US-20070197680-A1 Polyimide silicone resin and thermosetting composition comprising the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-08-23 US disclosed
US-20070197680-A1 Polyimide silicone resin and thermosetting composition comprising the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-08-23 US disclosed