SCHEMBL479236

SCHEMBL479236

CCC1(C=C(C)C(=O)O)CCCCC1

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6522429 1.00 CYP2C19 (0.31) CYP2C19
SCHEMBL3291143 1.00 CYP2C19 (0.31) CYP2C19
SCHEMBL2680077 1.00 CYP2C19 (0.31) CYP2C19
SCHEMBL3288533 1.00 CYP2C19 (0.31) CYP2C19
SCHEMBL2680377 1.00 CYP2C19 (0.31) CYP2C19
SCHEMBL3292924 1.00 CYP2C19 (0.31) CYP2C19
SCHEMBL2064948 0.98
SCHEMBL989309 0.98
SCHEMBL3288490 0.94
SCHEMBL3286642 0.90 CD81 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 131 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118625599-A Photosensitive resin composition, photosensitive dry film and preparation method thereof 杭州福斯特电子材料有限公司 2024-09-10 CN claimed
US-9527938-B2 Copolymer for lithography and method of manufacturing the same, resist composition, and method of manufacturing substrate MITSUBISHI RAYON CO., LTD. (JP) 2016-12-27 US claimed
US-20150099230-A1 COPOLYMER FOR LITHOGRAPHY AND METHOD OF MANUFACTURING THE SAME, RESIST COMPOSITION, AND METHOD OF MANUFACTURING SUBSTRATE MITSUBISHI RAYON CO., LTD. (JP) 2015-04-09 US claimed
US-20110053083-A1 CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION AND PROCESS FOR ITS USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-03-03 US claimed
US-11760871-B2 Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-09-19 US disclosed
CN-110133965-B Chemically amplified positive resist composition 台湾永光化学工业股份有限公司 2023-04-07 CN disclosed
US-20210395514-A1 THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-12-23 US disclosed
US-20210011379-A1 POSITIVE-WORKING PHOTORESIST COMPOSITION, PATTERN PRODUCED THEREFROM, AND METHOD FOR PRODUCING PATTERN LG CHEM, LTD. (KR) 2021-01-14 US disclosed
EP-3186226-B1 OXIME SULFONATE DERIVATIVES BASF SE (DE) 2020-06-17 EP disclosed
CN-111095105-A Actinic-ray-or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device 富士胶片株式会社 2020-05-01 CN disclosed
US-10336851-B2 Copolymer for semiconductor lithography, resist composition, and method for manufacturing substrate MITSUBISHI CHEMICAL CORPORATION 2019-07-02 US disclosed
US-20190171099-A1 POLYMERIZABLE COMPOSITION COMPRISING AN OXIME SULFONATE AS THERMAL CURING AGENT BASF SE (DE) 2019-06-06 US disclosed
US-20090226850-A1 PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-09-10 US disclosed
EP-2082872-A1 SURFACE-TREATED RESIN, METHOD FOR PRODUCING THE SAME, AND USE OF THE SAME OMRON Corporation, a corporation of Japan (JP) 2009-07-29 EP disclosed
US-7521169-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-04-21 US disclosed
EP-1817634-B1 PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN TOKYO OHKA KOGYO CO LTD (JP) 2009-04-08 EP disclosed
WO-2009038635-A1 PROCESS FOR PREPARING COMPOSITIONALLY UNIFORM COPOLYMERS DUPONT ELECTRONIC POLYMERS L.P. (US) 2009-03-26 WO disclosed
US-20090076230-A1 Process for preparing compositionally uniform copolymers DUPONT ELECTRONIC POLYMERS L.P. 2009-03-19 US disclosed
US-20070054214-A1 Acid generators, sulfonic acids, sulfonyl halides, and radiation sensitive resin compositions JSR CORPORATION (JP) 2007-03-08 US disclosed
US-20060234153-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-10-19 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20190171099-A1 POLYMERIZABLE COMPOSITION COMPRISING AN OXIME SULFONATE AS THERMAL CURING AGENT SULT1E1, COX6B1, SULT1A1 CYP2C19 189/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.