SCHEMBL4804388

SCHEMBL4804388

CCC(Br)C(Br)CC(Br)C(Br)CC(Br)C(Br)CCCCCCCC(=O)OC

nearest known ligand 0.48

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.48
TSHR P16473 4/20 0.45
ZDHHC7 Q9NXF8 1/20 0.45
LMNA P02545 4/20 0.42
ALDH1A1 P00352 1/20 0.42
PPARG P37231 2/20 0.39
CYP3A4 P08684 1/20 0.39
ATM Q13315 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
PABPC1 P11940 1/20 0.39
APOBEC3A P31941 1/20 0.39
APOBEC3G Q9HC16 1/20 0.39
PPARA Q07869 1/20 0.37
EPHX2 P34913 1/20 0.37
KMT2A Q03164 1/20 0.36
POLB P06746 1/20 0.36
POLA1 P09884 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4809286 0.90 ZDHHC7 (0.57) L3MBTL1TSHRZDHHC7LMNAPPARG
SCHEMBL4811317 0.85 TDP1 (0.45) TSHRZDHHC7LMNAALDH1A1CYP3A4
SCHEMBL4806898 0.81 FFAR4 (0.50) TSHRLMNAALDH1A1PPARGTDP1
SCHEMBL1800630 0.81 L3MBTL1 (0.51) L3MBTL1TSHRZDHHC7LMNAALDH1A1
SCHEMBL2834294 0.81 ZDHHC7 (0.50) L3MBTL1TSHRZDHHC7LMNAPPARG
SCHEMBL5052870 0.80 ZDHHC7 (0.57) L3MBTL1TSHRZDHHC7LMNAPPARG
SCHEMBL10937797 0.79 ALDH1A1 (0.48) TSHRZDHHC7ALDH1A1
SCHEMBL9396622 0.79 TSHR (0.52) L3MBTL1TSHRZDHHC7LMNAALDH1A1
SCHEMBL10929017 0.77 ZDHHC7 (0.68) L3MBTL1TSHRZDHHC7LMNAALDH1A1
SCHEMBL11821953 0.77 TSHR (0.54) L3MBTL1TSHRZDHHC7LMNAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1899750-B Solder metal, soldering flux and solder paste SHOWA DENKO KK 2010-06-16 CN disclosed
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 US disclosed
CN-1298492-C Solder metal, flux and solder paste SHOWA DENKO KK (JP) 2007-02-07 CN disclosed
CN-1899750-A Solder metal, soldering flux and solder paste SHOWA DENKO KK (JP) 2007-01-24 CN disclosed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 US disclosed
CN-1211183-C Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method SHOWA DENKO KK (JP) 2005-07-20 CN disclosed
US-6881278-B2 Flux for solder paste SHOWA DENKO K.K. (JP) 2005-04-19 US disclosed
CN-1578713-A Solder metal, flux and solder paste SHOWA DENKO KK (JP) 2005-02-09 CN disclosed
US-20030200836-A1 Flux for solder paste SHOWA DENKO K.K. 2003-10-30 US disclosed
WO-2003064102-A1 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE SHOWA DENKO K.K. (JP) 2003-08-07 WO disclosed
CN-1358123-A Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method SHOWA DENKO KK (JP) 2002-07-10 CN disclosed
US-20020046627-A1 Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product SHOWA DENKO K.K. (JP) 2002-04-25 US disclosed
US-20010042779-A1 Solder paste SHOWA DENKO KABUSHIKI KAISHA (JP) 2001-11-22 US disclosed