SCHEMBL482491

SCHEMBL482491

O=C(Nc1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(NC(=O)c3ccccc3)c2F)c1F)c1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 8/20 0.44
NPC1 O15118 5/20 0.44
HDAC1 Q13547 3/20 0.42
HDAC8 Q9BY41 1/20 0.41
HDAC6 Q9UBN7 1/20 0.41
POLB P06746 2/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
HTT P42858 1/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
ABCB1 P08183 1/20 0.39
MDM4 O15151 1/20 0.39
TP53 P04637 1/20 0.39
HDAC3 O15379 1/20 0.39
MAPK1 P28482 1/20 0.39
HDAC2 Q92769 1/20 0.39
HPGD P15428 1/20 0.39
PPARG P37231 1/20 0.37
NR1H4 Q96RI1 1/20 0.37
CYP1A2 P05177 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL599353 0.90 POLB (0.45) RAB9ANPC1HDAC1POLBSMN1; SMN2
SCHEMBL267396 0.90 KMT2A (0.43) RAB9ANPC1HDAC1HDAC8HDAC6
SCHEMBL482948 0.87 GAA (0.41) RAB9ANPC1HDAC1POLBSMN1; SMN2
SCHEMBL482982 0.86 HPGD (0.36) RAB9ANPC1POLBSMN1; SMN2HTT
SCHEMBL483289 0.84 RECQL (0.39) RAB9ANPC1SMN1; SMN2HTTMEN1
SCHEMBL268803 0.84 HPGD (0.44) RAB9ANPC1POLBSMN1; SMN2MEN1
SCHEMBL483372 0.84 RAB9A (0.42) RAB9ANPC1HDAC1HDAC6POLB
SCHEMBL483069 0.84 HDAC1 (0.39) RAB9ANPC1HDAC1HDAC6POLB
SCHEMBL5199489 0.83 ALPL (0.32) RAB9ANPC1SMN1; SMN2ALDH1A1
SCHEMBL483049 0.83 NPC1 (0.43) RAB9ANPC1SMN1; SMN2HTTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-0860741-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 2001-05-16 EP disclosed
EP-1091247-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2001-04-11 EP disclosed
US-6153660-A VERY HIGH SENSITIVITY TO BEAMS IN THE VISIBLE REGION, PARTICULARLY TO VISIBLE RAYS AT 400 NM OR MORE SUCH AS RAYS AT 488 NM OR 532 NM CORRESPONDING TO THE OUTPUT OF AR+ LASER OR YAG-SHG LASER FUJI PHOTO FILM CO., LTD. (JP) 2000-11-28 US disclosed
US-6051367-A COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH FUJI PHOTO FILM CO., LTD. (JP) 2000-04-18 US disclosed
EP-0949540-A1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJI PHOTO FILM CO., LTD (JP) 1999-10-13 EP disclosed
EP-0924570-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1999-06-23 EP disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed