SCHEMBL4827221

SCHEMBL4827221

COC(OC)[SiH2]CCCN1CCCCC1

nearest known ligand 0.45

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HRH3 Q9Y5N1 6/20 0.45
MAPT P10636 2/20 0.37
CYP1A2 P05177 2/20 0.36
MAPK1 P28482 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
POLB P06746 1/20 0.35
KCNH2 Q12809 1/20 0.35
HRH1 P35367 1/20 0.34
ALDH1A1 P00352 1/20 0.34
CYP2D6 P10635 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1995695 0.98 HRH3 (0.41) HRH3MAPTCYP1A2MAPK1SMN1; SMN2
SCHEMBL11897268 0.90 MAOB (0.32) HRH3SMN1; SMN2KCNH2
SCHEMBL1230442 0.89 HRH3 (0.38) HRH3MAPTMEN1KMT2APOLB
SCHEMBL12002828 0.85 PAOX (0.37) HRH3MAPTMEN1KMT2APOLB
SCHEMBL22206788 0.83
SCHEMBL329442 0.83
SCHEMBL1229306 0.82 CXCR4 (0.42) HRH3SMN1; SMN2MEN1KMT2APOLB
SCHEMBL9313742 0.82 HRH3 (0.42) HRH3MAPTCYP1A2MAPK1SMN1; SMN2
SCHEMBL31468641 0.82 SMN1; SMN2 (0.44) HRH3CYP1A2MAPK1SMN1; SMN2POLB
SCHEMBL1991946 0.80 HRH3 (0.39) HRH3MAPTCYP1A2MAPK1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 156 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111607227-B Three-dimensional nano carbon/polyimide composite aerogel material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-02-28 CN claimed
WO-2026100079-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100734-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
US-12504688-B2 Negative photosensitive resin composition and method for manufacturing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-23 US disclosed
US-20250370339-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-04 US disclosed
US-20250341778-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-11-06 US disclosed
US-5622784-A WATERPROOFING; MODIFIED SILICON DIOXIDE THIN FILM SEIKO EPSON CORPORATION (JP) 1997-04-22 US disclosed
EP-0580108-B1 A photosensitive polyimide composition ASAHI CHEMICAL IND (JP) 1997-03-12 EP disclosed
EP-0718696-A2 A photosensitive polyimide composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1996-06-26 EP disclosed
US-5397682-A Polyimide precursor and photosensitive composition containing the same ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1995-03-14 US disclosed
EP-0355927-B1 A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor ASAHI CHEMICAL IND (JP) 1994-11-23 EP disclosed
EP-0304136-B1 Novel photosensitive composition ASAHI CHEMICAL IND (JP) 1994-06-29 EP disclosed
EP-0580108-A2 A photosensitive polyimide composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1994-01-26 EP disclosed
US-5019482-A Polymer/oxime ester/coumarin compound photosensitive composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-05-28 US disclosed
EP-0355927-A2 A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1990-02-28 EP disclosed
EP-0304136-A2 Novel photosensitive composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1989-02-22 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 HRH3 902/4885MAPT 2839/4885CYP1A2 4765/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 HRH3 51/4885MAPT 1037/4885CYP1A2 3344/4885
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 HRH3 160/4885MAPT 2658/4885CYP1A2 3973/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.