SCHEMBL486844

SCHEMBL486844

CC(C)(c1cccc(N)c1)c1ccccc1C(C)(C)c1cccc(N)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.52
MAPK1 P28482 1/20 0.52
CYP3A4 P08684 3/20 0.44
CASP1 P29466 1/20 0.44
RECQL P46063 1/20 0.44
MAOA P21397 4/20 0.40
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
ALDH1A1 P00352 3/20 0.38
TDP1 Q9NUW8 2/20 0.37
CA12 O43570 1/20 0.37
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37
CA7 P43166 1/20 0.37
CA9 Q16790 1/20 0.37
CA14 Q9ULX7 1/20 0.37
MAOB P27338 4/20 0.36
CYP19A1 P11511 1/20 0.36
KDM4E B2RXH2 1/20 0.36
MEN1 O00255 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29374282 0.87 TSHR (0.60) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL31476400 0.87 TSHR (0.60) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL125232 0.87 TSHR (0.60) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL718562 0.85 TSHR (0.54) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL203901 0.85 TSHR (0.58) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL29408726 0.85 TSHR (0.58) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL1725375 0.83 ESR1 (0.57) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL126640 0.83 ESR1 (0.57) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL29408725 0.83 ESR1 (0.57) TSHRMAPK1CYP3A4CASP1RECQL
SCHEMBL27145615 0.82 TSHR (0.47) TSHRMAPK1CYP3A4CASP1RECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2412743-B1 THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME HITACHI CHEMICAL CO LTD (JP) 2020-08-19 EP disclosed
US-10119047-B2 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-11-06 US disclosed
US-20150203715-A1 Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same RESONAC CORPORATION (JP) 2015-07-23 US disclosed
US-20130330563-A1 MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-12-12 US disclosed
EP-2666804-A1 MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME Hitachi Chemical Co., Ltd. (JP) 2013-11-27 EP disclosed
US-20120077401-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-29 US disclosed
EP-2412743-A1 THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME Hitachi Chemical Company, Ltd. (JP) 2012-02-01 EP disclosed