SCHEMBL4887674

SCHEMBL4887674

O=C(O)c1ccc(C(=O)OCC2CO2)c(C(=O)OCC2CO2)c1

nearest known ligand 0.57

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
DHFR P00374 1/20 0.43
MGLL Q99685 5/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL679935 0.96 KDM4E (0.43) DHFRMGLL
SCHEMBL1144451 0.96 DHFR (0.42) DHFRMGLL
SCHEMBL155724 0.91 DHFR (0.44) DHFRMGLL
SCHEMBL2493818 0.90 DHFR (0.42) DHFRMGLL
SCHEMBL12177586 0.90 DHFR (0.42) DHFRMGLL
Ether SCHEMBL2787072 0.88 DHFR (0.38) DHFRMGLL
SCHEMBL8766571 0.86 DHFR (0.40) DHFRMGLL
Ethylene Glycol SCHEMBL28442528 0.86 DHFR (0.40) DHFRMGLL
SCHEMBL20144413 0.85 ALDH1A1 (0.43) DHFR
SCHEMBL21981246 0.85 CA12 (0.47)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113728066-B Adhesive and adhesive sheet 三菱化学株式会社 2023-12-29 CN disclosed
CN-117264587-A Adhesive and adhesive sheet 三菱化学株式会社 2023-12-22 CN disclosed
CN-116917399-A Composition for forming release layer and release layer 日产化学株式会社 2023-10-20 CN disclosed
US-11760904-B2 Adhesive tape DIC CORPORATION (JP) 2023-09-19 US disclosed
US-20230235195-A1 ADHESIVE TAPE DIC CORPORATION (JP) 2023-07-27 US disclosed
CN-112601794-B Adhesive tape 三菱化学株式会社 2023-07-11 CN disclosed
US-20080028985-A1 Water-Dispersed Slurry Coating TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2008-02-07 US disclosed
WO-2005056705-A1 WATER-DISPERSED SLURRY COATING SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2005-06-23 WO disclosed
US-6103825-A A HEAT-CURABLE POWDER COATING MATERIALS CIBA SPECIALTY CHEMICALS CORP. (US) 2000-08-15 US disclosed
EP-0980399-A1 MODIFIED EPOXY RESIN AND ITS USE AS A FORMULATING COMPONENT FOR HEAT-CURABLE COMPOSITIONS, ESPECIALLY FOR POWDER COATINGS Ciba SC Holding AG (CH) 2000-02-23 EP disclosed
EP-0691388-B1 Coating resin compositions TOYO BOSEKI (JP) 1999-12-08 EP disclosed
EP-0889104-A2 Coating resin compositions Toyo Boseki Kabushiki Kaisha (JP) 1999-01-07 EP disclosed
WO-1998050447-A1 MODIFIED EPOXY RESIN AND ITS USE AS A FORMULATING COMPONENT FOR HEAT-CURABLE COMPOSITIONS, ESPECIALLY FOR POWDER COATINGS CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 1998-11-12 WO disclosed
US-5563223-A CURABLE POLYESTER; FILM HAVING SUPERIOR HARDNESS, ANTISOILANT, WEATHERPROOFING, RESISTANCE TO STAINING BY FOOD-STUFF, BOILING WATER AND CORROSION RESISTANCE TOYO BOSEKI KABUSHIKI KAISHA (JP) 1996-10-08 US disclosed
EP-0691388-A1 Coating resin compositions Toyo Boseki Kabushiki Kaisha (JP) 1996-01-10 EP disclosed