Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.39 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | NAPRT | Q6XQN6 | 2/20 | 0.39 |
| ▸ | HPGD | P15428 | 2/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | ELANE | P08246 | 1/20 | 0.39 |
| ▸ | ESR1 | P03372 | 1/20 | 0.39 |
| ▸ | ITGB3 | P05106 | 1/20 | 0.39 |
| ▸ | ITGA2B | P08514 | 1/20 | 0.39 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.39 |
| ▸ | GGT1 | P19440 | 1/20 | 0.39 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.39 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.39 |
| ▸ | BLM | P54132 | 1/20 | 0.39 |
| ▸ | CES2 | O00748 | 1/20 | 0.38 |
| ▸ | CES1 | P23141 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 2/20 | 0.37 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6972085 | 0.81 | ALDH1A1 (0.31) | ALDH1A1HSD17B10TSHRNAPRTHPGD | |
| SCHEMBL10693762 | 0.77 | HPGD (0.32) | ALDH1A1HPGDKDM4EELANE | |
| SCHEMBL29026463 | 0.77 | ELANE (0.43) | ALDH1A1TSHRKDM4EELANEESR1 | |
| SCHEMBL1053847 | 0.77 | ELANE (0.43) | ALDH1A1TSHRKDM4ETDP1ELANE | |
| SCHEMBL28867306 | 0.76 | LMNA (0.54) | ALDH1A1HSD17B10TSHRNAPRTTDP1 | |
| SCHEMBL1053510 | 0.74 | KMT2A (0.40) | ALDH1A1HSD17B10TSHRHPGDKDM4E | |
| Biphenyl SCHEMBL8168014 | 0.73 | SMN1; SMN2 (0.50) | ALDH1A1HSD17B10TSHRNAPRTHPGD | |
| SCHEMBL4272675 | 0.72 | CYP1A2 (0.38) | ALDH1A1TSHRNAPRTHPGDKDM4E | |
| SCHEMBL4266491 | 0.72 | CES1 (0.42) | CES2CES1LMNAF2 | |
| SCHEMBL707854 | 0.72 | ALDH1A1 (0.38) | ALDH1A1HSD17B10TSHRNAPRTHPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024063044-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-03-28 | — | — | WO | disclosed |
| WO-2024019064-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYFUNCTIONAL SULFONIC ACID | 日産化学株式会社 | 2024-01-25 | — | — | WO | disclosed |
| WO-2024009993-A1 | METHOD OF MANUFACTURING LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2024-01-11 | — | — | WO | disclosed |
| WO-2023171733-A1 | WAFER EDGE PROTECTIVE FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | 日産化学株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2023162968-A1 | PHOTOCURABLE RESIN COMPOSITION CONTAINING SELF-CROSSLINKING POLYMER | 日産化学株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023157943-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION HAVING UNSATURATED BOND AND CYCLIC STRUCTURE | 日産化学株式会社 | 2023-08-24 | — | — | WO | disclosed |
| WO-2023136250-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-07-20 | — | — | WO | disclosed |
| WO-2023085414-A1 | POLYCYCLIC AROMATIC HYDROCARBON-BASED PHOTO-CURABLE RESIN COMPOSITION | 日産化学株式会社 | 2023-05-19 | — | — | WO | disclosed |
| WO-2023037979-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, MULTILAYER BODY USING SAID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2023-03-16 | — | — | WO | disclosed |
| WO-2023033094-A1 | WAFER EDGE PROTECTIVE-FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | 日産化学株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-7604866-B2 | Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2009-10-20 | — | — | US | disclosed |
| US-20090062460-A1 | CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20090023855-A1 | NOVEL CURABLE RESIN, PRODUCTION METHOD THEREOF, EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2009-01-22 | — | — | US | disclosed |
| CN-101124233-A | Novel curable resin, method for producing same, epoxy resin composition and electronic component device | HITACHI CHEMICAL CO LTD (JP) | 2008-02-13 | — | — | CN | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060269724-A1 | Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2006-11-30 | — | — | US | disclosed |
| EP-1651581-A2 | COATING SYSTEM FOR GLASS SURFACES, METHOD FOR THE PRODUCTION AND USE THEREOF | Chemetall GmbH (DE) | 2006-05-03 | — | — | EP | disclosed |
| WO-2004108846-A2 | COATING SYSTEM FOR GLASS SURFACES, METHOD FOR THE PRODUCTION AND USE THEREOF | CHEMETALL GMBH (DE) | 2004-12-16 | — | — | WO | disclosed |
| US-5907008-A | Black coloring composition, high heat resistance light-shielding component, array substrate, liquid crystal and method of manufacturing array substrate | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-05-25 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090062460-A1 | CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE | NCAPH, RAD51, H1-2 | ALDH1A1 2071/4885HSD17B10 3185/4885TSHR 3490/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.