Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOA | P21397 | 6/20 | 0.42 |
| ▸ | MAOB | P27338 | 6/20 | 0.42 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.36 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.36 |
| ▸ | CES2 | O00748 | 1/20 | 0.35 |
| ▸ | CES1 | P23141 | 1/20 | 0.35 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28133845 | 0.82 | PTGS2 (0.40) | MAOAMAOBCES2CES1 | |
| SCHEMBL2399414 | 0.81 | MAOA (0.47) | MAOAMAOBMEN1KMT2AALDH1A1 | |
| SCHEMBL28134630 | 0.81 | SLC6A2 (0.44) | MAOAMAOBMEN1KMT2AALDH1A1 | |
| SCHEMBL2047123 | 0.79 | CYP2C19 (0.47) | MAOAMAOBMEN1KMT2AALDH1A1 | |
| SCHEMBL28133839 | 0.78 | MAOA (0.38) | MAOAMAOBMEN1KMT2AALDH1A1 | |
| SCHEMBL8676203 | 0.78 | MAOA (0.44) | MAOAMAOBMEN1KMT2AATM | |
| SCHEMBL27536657 | 0.78 | POLB (0.38) | MEN1KMT2AATMALDH1A1MAPT | |
| SCHEMBL14921 | 0.78 | TAAR1 (0.48) | MAOAMAOBALDH1A1CYP2C19HIF1A | |
| SCHEMBL3321479 | 0.77 | MAOA (0.40) | MAOAMAOBATMALDH1A1MAPT | |
| SCHEMBL13317143 | 0.76 | F2 (0.37) | KMT2AATMALDH1A1CYP2C19CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12024590-B2 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-07-02 | — | — | US | disclosed |
| US-12022611-B2 | Prepreg, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-06-25 | — | — | US | disclosed |
| US-11958951-B2 | Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-04-16 | — | — | US | disclosed |
| CN-117720787-A | Flexible metal clad laminate and method of making the same | 科腾聚合物荷兰有限责任公司 | 2024-03-19 | — | — | CN | disclosed |
| US-20240067810-A1 | FLEXIBLE METAL CLAD LAMINATES AND METHODS OF PREPARATION THEREOF | Kraton Corporation (US) | 2024-02-29 | — | — | US | disclosed |
| US-20240002564-A1 | COPOLYMERS OF DIISOALKENYLARENE AND COMPOSITIONS THEREOF | Kraton Corporation (US) | 2024-01-04 | — | — | US | disclosed |
| US-20230094806-A1 | METAL-CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-03-30 | — | — | US | disclosed |
| US-20230054257-A1 | COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-02-23 | — | — | US | disclosed |
| US-20220220272-A1 | COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| CN-114555357-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| WO-2021024923-A1 | RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2021-02-11 | — | — | WO | disclosed |
| CN-112020523-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-12-01 | — | — | CN | disclosed |
| WO-2020230870-A1 | COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL | パナソニックＩＰマネジメント株式会社 | 2020-11-19 | — | — | WO | disclosed |
| WO-2020196759-A1 | PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2020017399-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2020-01-23 | — | — | WO | disclosed |
| US-7402645-B2 | Soluble polyfunctional vinyl aromatic polymer and method of producing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2008-07-22 | — | — | US | disclosed |
| US-20070155923-A1 | Soluble polyfunctional vinyl aromatic polymer and method of producing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2007-07-05 | — | — | US | disclosed |
| US-6900273-B1 | Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part | HITACHI CHEMICAL CO., LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-20040220342-A1 | Low-hygroscopicity low-birefringence resin compositions, molding material, sheet or film obtained therefrom, and optical part | YAMASHITA YUKIHIKO (JP) | 2004-11-04 | — | — | US | disclosed |
| EP-1205517-A1 | LOW-HYGROSCOPICITY LOW-BIREFRINGENCE RESIN COMPOSITIONS, MOLDING MATERIAL OBTAINED THEREFROM, SHEET OR FILM, AND OPTICAL PART | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-05-15 | — | — | EP | disclosed |