SCHEMBL5080637

SCHEMBL5080637

CCC(C)(C)c1cc(-n2nnc3ccccc32)c(O)c(C(C)(C)CC)c1

nearest known ligand 0.47

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
▸ KCNMA1 Q12791 2/20 0.47
▸ ATM Q13315 2/20 0.40
▸ SLC9A1 P19634 7/20 0.38
▸ SMN1; SMN2 Q16637 3/20 0.36
▸ TSHR P16473 2/20 0.36
▸ KMT2A Q03164 1/20 0.36
▸ RAB9A P51151 1/20 0.35
▸ KDM4E B2RXH2 1/20 0.35
▸ LMNA P02545 1/20 0.35
▸ RECQL P46063 1/20 0.35
▸ NPSR1 Q6W5P4 1/20 0.35
▸ HSD17B10 Q99714 1/20 0.35
▸ POLB P06746 2/20 0.34
▸ MAPK1 P28482 1/20 0.34
▸ KEAP1 Q14145 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6337162 0.84 KCNMA1 (0.45) KCNMA1ATMSLC9A1SMN1; SMN2TSHR
SCHEMBL4963816 0.83 KCNMA1 (0.51) KCNMA1ATMSLC9A1SMN1; SMN2TSHR
SCHEMBL8680885 0.80 KCNMA1 (0.48) KCNMA1ATMSLC9A1SMN1; SMN2TSHR
SCHEMBL29350743 0.79 NPC1 (0.45) ATMSMN1; SMN2TSHRKMT2ARAB9A
SCHEMBL39146 0.79 NPC1 (0.45) ATMSMN1; SMN2TSHRKMT2ARAB9A
SCHEMBL9002299 0.78 MAPK1 (0.34) ATMSMN1; SMN2TSHRKMT2ARAB9A
SCHEMBL11457333 0.78 NPC1 (0.44) ATMSMN1; SMN2TSHRKMT2ARAB9A
SCHEMBL27600005 0.78 NPC1 (0.44) ATMSMN1; SMN2TSHRKMT2ARAB9A
SCHEMBL586578 0.78 NPC1 (0.44) ATMSMN1; SMN2TSHRKMT2ARAB9A
SCHEMBL225142 0.77 KCNMA1 (0.45) KCNMA1ATMSLC9A1SMN1; SMN2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9274422-B2 Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2016-03-01 — — US disclosed
US-20140120462-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2014-05-01 — — US disclosed
CN-103502889-A Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component HITACHI CHEM DUPONT MICROSYS 2014-01-08 — — CN disclosed
EP-1891169-A1 ABRASION RESISTANT COATINGS EASTMAN CHEMICAL COMPANY (US) 2008-02-27 — — EP disclosed
WO-2006138198-A1 ABRASION RESISTANT COATINGS EASTMAN CHEMICAL COMPANY (US) 2006-12-28 — — WO disclosed
EP-0664485-B1 Protective coating for imaging elements DU PONT (US) 2000-08-16 — — EP disclosed
EP-0664485-A2 Protective coating for imaging elements E.I. DU PONT DE NEMOURS AND COMPANY (US) 1995-07-26 — — EP disclosed
US-5068171-A Photographic film FUJI PHOTO FILM CO., LTD. (JP) 1991-11-26 — — US disclosed
US-4426472-A TETRAALKYLPIPERIDINES CIBA-GEIGY CORPORATION (US) 1984-01-17 — — US disclosed
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