SCHEMBL5086724

SCHEMBL5086724

CCc1cccc(N2C(=O)C=CC2=O)c1CC

nearest known ligand 0.72

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ MGLL Q99685 13/20 0.72
▸ TLR9 Q9NR96 2/20 0.52
▸ FAAH O00519 2/20 0.44
▸ TSHR P16473 1/20 0.42
▸ LMNA P02545 2/20 0.40
▸ MEN1 O00255 1/20 0.39
▸ MAPT P10636 1/20 0.39
▸ KMT2A Q03164 1/20 0.39
▸ HSP90AA1 P07900 2/20 0.38
▸ ALDH1A1 P00352 1/20 0.38
▸ PKM P14618 1/20 0.38
▸ CCR6 P51684 1/20 0.38
▸ ATM Q13315 1/20 0.38
▸ NPSR1 Q6W5P4 1/20 0.38
▸ TDP1 Q9NUW8 1/20 0.38
▸ GABRA1 P14867 1/20 0.38
▸ GABRB2 P47870 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1535499 0.84 MGLL (1.00) MGLLTLR9FAAHTSHRLMNA
SCHEMBL29510771 0.84 MGLL (1.00) MGLLTLR9FAAHTSHRLMNA
SCHEMBL7609581 0.81 MGLL (0.72) MGLLTLR9FAAHTSHRLMNA
SCHEMBL8765659 0.79 PKM (0.49) MGLLTSHRLMNAMEN1MAPT
SCHEMBL9980563 0.79 NR1H3 (0.56) MGLLTSHRLMNAMEN1MAPT
SCHEMBL8678686 0.78 MGLL (0.57) MGLLTLR9FAAHTSHR
SCHEMBL6004440 0.78 MGLL (0.53) MGLLTLR9FAAHMAPTTDP1
SCHEMBL27593915 0.76 MGLL (0.82) MGLLTLR9FAAHTSHRLMNA
SCHEMBL8950064 0.76 MGLL (0.55) MGLLTLR9FAAHLMNAMAPT
SCHEMBL331144 0.76 MGLL (0.64) MGLLTLR9FAAHHSP90AA1GABRA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11235563-B2 Resin composition, molded article, food contact appliance and food contact container CHIMEI CORPORATION (TW) 2022-02-01 — — US disclosed
CN-109988371-B Resin composition, molded article, food contact tool, and food contact container 奇美实业股份有限公司 2021-09-17 — — CN disclosed
CN-113156762-A Photosensitive resin composition, dry film, cured product and printed wiring board 日本化药株式会社 2021-07-23 — — CN disclosed
CN-109320890-B Rubber-modified styrene resin composition, process for producing the same, and molded article 奇美实业股份有限公司 2021-05-04 — — CN disclosed
CN-108690339-B Thermoplastic resin composition and molded article 奇美实业股份有限公司 2021-03-19 — — CN disclosed
CN-106867127-B Thermoplastic resin composition suitable for vacuum forming and formed product thereof 奇美实业股份有限公司 2020-07-17 — — CN disclosed
CN-106867128-B Thermoplastic resin composition and molded article formed therefrom 奇美实业股份有限公司 2020-07-17 — — CN disclosed
US-20190202183-A1 RESIN COMPOSITION, MOLDED ARTICLE, FOOD CONTACT APPLIANCE AND FOOD CONTACT CONTAINER CHIMEI CORPORATION (TW) 2019-07-04 — — US disclosed
US-8785107-B2 Lithographic printing plate precursor EASTMAN KODAK COMPANY (US) 2014-07-22 — — US disclosed
US-20130196268-A1 LITHOGRAPHIC PRINTING PLATE PRECURSOR BANK OF AMERICA, N.A., AS AGENT 2013-08-01 — — US disclosed
US-20070155869-A1 Mono-functional monomers and methods for use thereof DESIGNER MOLECULES, INC. 2007-07-05 — — US disclosed
US-7230064-B2 Process for the preparation of urethane resins and urethane resin compositions KONISHI CO., LTD. (JP) 2007-06-12 — — US disclosed
US-7208560-B1 Process for the preparation of urethane resins and urethane resin compositions KONISHI CO., LTD. (JP) 2007-04-24 — — US disclosed
US-20050182225-A1 Curable resin composition KONISHI CO. LTD (JP) 2005-08-18 — — US disclosed
EP-1514903-A1 CURABLE RESIN COMPOSITION Konishi Co., Ltd. (JP) 2005-03-16 — — EP disclosed
US-6689539-B2 A FLUORORESIN HAVING A FLUORO ALIPHATIC GROUP OF 3 TO 20 CARBON ATOMS IN WHICH ATLEAST TWO OF THREE TERMINAL HYDROGEN ATOMS ARE SUBSTITUTED FOR FLUORINE ATOMS, AND AN ETHYLENE BASED UNSATURATED GROUP; AND A NEGATIVE PHOTOSENSITIVE KODAK POLYCHROME GRAPHICS LLC 2004-02-10 — — US disclosed
US-20030092867-A1 Process for the preparation of urethane resins and urethane resin compositions SATO SHINICHI (JP) 2003-05-15 — — US disclosed
US-20020048721-A1 Photosensitive composition and photosensitive lithographic printing plate KODAK POLYCHROME GRAPHICS L.L.C. 2002-04-25 — — US disclosed
EP-0919582-A1 PROCESS FOR THE PREPARATION OF URETHANE RESINS AND URETHANE RESIN COMPOSITIONS KONISHI CO., LTD. (JP) 1999-06-02 — — EP disclosed
US-5795936-A GRAFT POLYMER BLEND CHI MEI CORPORATION (TW) 1998-08-18 — — US disclosed
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