Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.57 |
| ▸ | GAA | P10253 | 7/20 | 0.57 |
| ▸ | ALOX12 | P18054 | 3/20 | 0.57 |
| ▸ | HTT | P42858 | 2/20 | 0.57 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.57 |
| ▸ | HSD17B10 | Q99714 | 5/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 5/20 | 0.50 |
| ▸ | HPGD | P15428 | 5/20 | 0.50 |
| ▸ | PKM | P14618 | 2/20 | 0.50 |
| ▸ | USP2 | O75604 | 2/20 | 0.50 |
| ▸ | MAPT | P10636 | 6/20 | 0.42 |
| ▸ | MEN1 | O00255 | 4/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.42 |
| ▸ | RECQL | P46063 | 4/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.42 |
| ▸ | ESR1 | P03372 | 1/20 | 0.39 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.38 |
| ▸ | LMNA | P02545 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30536052 | 0.86 | ALDH1A1 (0.59) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL30428859 | 0.86 | ALDH1A1 (0.59) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL22326130 | 0.86 | ALDH1A1 (0.59) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL5192062 | 0.84 | ALOX15 (0.45) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL7803038 | 0.81 | ALDH1A1 (0.39) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL13766036 | 0.77 | ALDH1A1 (0.69) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL24191011 | 0.77 | ALDH1A1 (0.53) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL28779026 | 0.76 | ALDH1A1 (0.45) | ALDH1A1GAAALOX12HTTHIF1A | |
| SCHEMBL1243946 | 0.76 | ALDH1A1 (0.52) | ALDH1A1GAAALOX12HTTHIF1A | |
| Hydrochloric Acid SCHEMBL1871507 | 0.74 | ALDH1A1 (0.50) | ALDH1A1GAAALOX12HTTHIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0291779-A2 | Heat-resistant positive resist, and process for the production of heat-resistant resist patterns | SIEMENS AKTIENGESELLSCHAFT (DE) | 1988-11-23 | — | — | EP | claimed |
| CN-110874015-B | Photosensitive resin composition, photosensitive resin layer using same, and electronic device | 三星SDI株式会社 | 2023-02-28 | — | — | CN | disclosed |
| CN-110088680-B | Double-layer photosensitive layer roll | 旭化成株式会社 | 2022-12-30 | — | — | CN | disclosed |
| CN-115210648-A | Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, electronic component, antenna element, semiconductor package, and display device | 东丽株式会社 | 2022-10-18 | — | — | CN | disclosed |
| CN-114895527-A | Positive photosensitive resin precursor composition, preparation method and application thereof | 南通晶爱微电子科技有限公司 | 2022-08-12 | — | — | CN | disclosed |
| CN-108690195-B | Composition for flexible substrate and flexible substrate | 奇美实业股份有限公司 | 2022-07-05 | — | — | CN | disclosed |
| CN-114207038-A | Resin composition, method for producing cured product, patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2022-03-18 | — | — | CN | disclosed |
| CN-107430334-B | Positive photosensitive resin composition, method for producing patterned cured film, and electronic component | 艾曲迪微系统股份有限公司 | 2021-07-30 | — | — | CN | disclosed |
| CN-108003614-B | Composition for flexible substrate, method for producing same, and flexible substrate | 奇美实业股份有限公司 | 2021-06-29 | — | — | CN | disclosed |
| CN-112771447-A | Positive photosensitive resin composition, photosensitive resin film using the same, and electronic device | 三星SDI株式会社 | 2021-05-07 | — | — | CN | disclosed |
| US-9268221-B2 | Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer | CHEIL INDUSTRIES INC. (KR) | 2016-02-23 | — | — | US | disclosed |
| US-20150168835-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device | SAMSUNG SDI CO., LTD. (KR) | 2015-06-18 | — | — | US | disclosed |
| CN-103865264-A | COMPOSITION FOR FLEXIBLE SUBSTRATE AND FLEXIBLE SUBSTRATE | CHI MEI CORP | 2014-06-18 | — | — | CN | disclosed |
| US-8501375-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2013-08-06 | — | — | US | disclosed |
| US-20120171609-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Layer Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Layer | CHEIL INDUSTRIES INC. (KR) | 2012-07-05 | — | — | US | disclosed |
| US-20120156616-A1 | Positive Photosensitive Resin Composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-06-21 | — | — | US | disclosed |
| CN-101130502-A | Method for preparing 2,2-dual [3-amido-4-(4-nitrophenoxy)phenyl group]-1,1,1,3,3,3-hexa-fluoropropane | UNIV DONGHUA (CN) | 2008-02-27 | — | — | CN | disclosed |
| EP-1811340-A2 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | Fujifilm Corporation (JP) | 2007-07-25 | — | — | EP | disclosed |
| US-4965134-A | Method for manufacturing highly heat-resistant dielectrics | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-10-23 | — | — | US | disclosed |
| EP-0388482-A1 | Light-sensitive composition | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-09-26 | — | — | EP | disclosed |