SCHEMBL5192062

SCHEMBL5192062

Nc1ccc(C(C(F)(F)F)C(F)(F)F)cc1O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 4/20 0.45
HSD17B10 Q99714 3/20 0.45
CYP3A4 P08684 2/20 0.45
MAPT P10636 6/20 0.41
KDM4E B2RXH2 6/20 0.41
GAA P10253 3/20 0.41
KMT2A Q03164 3/20 0.41
MEN1 O00255 2/20 0.41
POLB P06746 2/20 0.41
RAB9A P51151 1/20 0.41
ESR1 P03372 2/20 0.39
ESR2 Q92731 2/20 0.39
ALDH1A1 P00352 2/20 0.38
HIF1A Q16665 2/20 0.38
ALOX12 P18054 1/20 0.38
HTT P42858 1/20 0.38
HPGD P15428 3/20 0.34
USP2 O75604 1/20 0.34
PKM P14618 1/20 0.34
RECQL P46063 6/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23005780 0.86 ESR1 (0.50) ALOX15HSD17B10CYP3A4MAPTKDM4E
SCHEMBL5190865 0.84 ALDH1A1 (0.57) ALOX15HSD17B10CYP3A4MAPTKDM4E
SCHEMBL7803038 0.81 ALDH1A1 (0.39) ALOX15CYP3A4GAAKMT2AMEN1
SCHEMBL18999717 0.78 ALDH1A1 (0.46) ESR1ESR2ALDH1A1SHBG
SCHEMBL27498170 0.77 ALOX15 (0.42) ALOX15HSD17B10CYP3A4MAPTKDM4E
SCHEMBL27533485 0.77 ALOX15 (0.50) ALOX15HSD17B10CYP3A4MAPTKDM4E
SCHEMBL3277990 0.76 CYP3A4 (0.45) ALOX15CYP3A4MAPTKDM4EGAA
SCHEMBL16736878 0.76 TRPA1 (0.59) ALOX15HSD17B10CYP3A4MAPTKDM4E
SCHEMBL3789315 0.76 ALOX15 (0.41) ALOX15HSD17B10CYP3A4MAPTKDM4E
SCHEMBL6422982 0.74 ALOX15 (0.52) ALOX15HSD17B10CYP3A4MAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110874015-B Photosensitive resin composition, photosensitive resin layer using same, and electronic device 三星SDI株式会社 2023-02-28 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-115210648-A Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, electronic component, antenna element, semiconductor package, and display device 东丽株式会社 2022-10-18 CN disclosed
CN-114895527-A Positive photosensitive resin precursor composition, preparation method and application thereof 南通晶爱微电子科技有限公司 2022-08-12 CN disclosed
CN-107430334-B Positive photosensitive resin composition, method for producing patterned cured film, and electronic component 艾曲迪微系统股份有限公司 2021-07-30 CN disclosed
CN-112771447-A Positive photosensitive resin composition, photosensitive resin film using the same, and electronic device 三星SDI株式会社 2021-05-07 CN disclosed
CN-112592476-A Method for producing polybenzoxazole precursor and polybenzoxazole precursor 太阳控股株式会社 2021-04-02 CN disclosed
CN-112585536-A Photosensitive resin composition, dry film, cured product, and electronic component 太阳控股株式会社 2021-03-30 CN disclosed
CN-112415852-A Positive photosensitive resin composition 太阳控股株式会社 2021-02-26 CN disclosed
CN-111819493-A Photosensitive resin composition, dry film, cured product, printed wiring board, and semiconductor element 太阳控股株式会社 2020-10-23 CN disclosed
CN-110989294-A Photosensitive resin composition, photosensitive resin layer, and electronic device 三星SDI株式会社 2020-04-10 CN disclosed
CN-110967928-A Positive photosensitive resin composition, photosensitive resin layer, and electronic device 三星SDI株式会社 2020-04-07 CN disclosed
WO-2020067638-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM USING SAME, AND ELECTRONIC DEVICE 삼성에스디아이 주식회사 2020-04-02 WO disclosed
CN-110945427-A Photosensitive resin composition, dry film, cured product, printed wiring board, semiconductor element, and electronic component 太阳控股株式会社 2020-03-31 CN disclosed
CN-110874015-A Photosensitive resin composition, photosensitive resin layer using same, and electronic device 三星SDI株式会社 2020-03-10 CN disclosed
US-9323147-B2 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device SAMSUNG SDI CO., LTD. (KR) 2016-04-26 US disclosed
US-20150168835-A1 Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device SAMSUNG SDI CO., LTD. (KR) 2015-06-18 US disclosed
US-20150111153-A1 Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device CHEIL INDUSTRIES INC. (KR) 2015-04-23 US disclosed
US-8735029-B2 Positive photosensitive resin composition, and display device and organic light emitting device using the same CHEIL INDUSTRIES INC. (KR) 2014-05-27 US disclosed
EP-1811340-A2 Photosensitive resin composition and manufacturing method of semiconductor device using the same Fujifilm Corporation (JP) 2007-07-25 EP disclosed