SCHEMBL5201695

SCHEMBL5201695

COc1ccc(-c2nc(-c3ccccc3)c(-c3ccccc3)n2-n2cnc(-c3ccccc3)c2-c2ccccc2)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.50
NPSR1 Q6W5P4 2/20 0.50
ALDH1A1 P00352 2/20 0.50
KDM4E B2RXH2 2/20 0.50
TDP1 Q9NUW8 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
PTGS2 P35354 1/20 0.46
TNK2 Q07912 1/20 0.43
MAPT P10636 3/20 0.42
GAA P10253 2/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
TP53 P04637 1/20 0.42
ADORA3 P0DMS8 1/20 0.42
ADORA1 P30542 1/20 0.42
MGAM O43451 1/20 0.42
SI P14410 1/20 0.42
MGAM2 Q2M2H8 1/20 0.42
APAF1 O14727 1/20 0.41
HTT P42858 1/20 0.41
ADORA2A P29274 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6362990 0.87 NPSR1 (0.61) LMNANPSR1ALDH1A1KDM4ETDP1
SCHEMBL28919628 0.81 KDM4E (0.49) LMNAALDH1A1KDM4EL3MBTL1GAA
SCHEMBL26632662 0.78 LMNA (0.48) LMNANPSR1ALDH1A1KDM4ETDP1
SCHEMBL27881874 0.77 LMNA (0.59) LMNANPSR1ALDH1A1KDM4ETDP1
SCHEMBL4622519 0.75 HSD11B1 (0.41) LMNAALDH1A1KDM4EPTGS2SMN1; SMN2
SCHEMBL18037949 0.75 GUSB (0.40) LMNAALDH1A1MAPTGAAMGAM
SCHEMBL28919625 0.74 NSD3 (0.37) KDM4EL3MBTL1PTGS2GAASMN1; SMN2
SCHEMBL4597351 0.72 BCHE (0.45) LMNAALDH1A1KDM4ETDP1L3MBTL1
SCHEMBL4429243 0.72 TEK (0.60) LMNANPSR1ALDH1A1KDM4ETDP1
SCHEMBL5082102 0.72 TEK (0.60) LMNANPSR1ALDH1A1KDM4ETDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111699212-B Polyester film for dry film resist base material 三菱化学株式会社 2022-11-18 CN disclosed
EP-1810083-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM BY THE USE THEREOF TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-25 EP disclosed
WO-2006049049-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM BY THE USE THEREOF TOKYO OHKA KOGYO CO., LTD. (JP) 2006-05-11 WO disclosed