SCHEMBL5355482

SCHEMBL5355482

CCOC(C)OCC1(C)CC2C=CC1C2

nearest known ligand 0.36

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.36
CYP2D6 P10635 1/20 0.35
CYP2C19 P33261 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5354152 0.88 CYP2D6 (0.33) CYP2D6CYP2C19
SCHEMBL5355994 0.86 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL5356755 0.86 CYP2D6 (0.32) CYP2D6CYP2C19
SCHEMBL5359484 0.79
SCHEMBL15043191 0.78 LMNA (0.33) LMNACYP2D6CYP2C19
SCHEMBL5356027 0.77 CYP2D6 (0.36) LMNACYP2D6CYP2C19
SCHEMBL250980 0.73 CYP2D6 (0.49) CYP2D6CYP2C19
SCHEMBL5358484 0.72 ALDH1A1 (0.38) LMNACYP2D6CYP2C19
SCHEMBL3364369 0.71 CYP2D6 (0.35) CYP2D6CYP2C19
SCHEMBL15045977 0.71 CYP2D6 (0.30) CYP2D6CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
EP-1085379-B1 Radiation-sensitive resin composition JSR CORP (JP) 2006-01-04 EP disclosed
US-20050214680-A1 Radiation-sensitive resin composition MIYAJI MASAAKI 2005-09-29 US disclosed
US-6933094-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-08-23 US disclosed
US-6623907-B2 Chemical amplified photoresist JSR CORPORATION (JP) 2003-09-23 US disclosed
US-6482568-B1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-11-19 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed