SCHEMBL5355485

SCHEMBL5355485

C=Cc1ccccc1OC1(C)CCCCC1

nearest known ligand 0.36

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.33
NPSR1 Q6W5P4 2/20 0.33
HPGD P15428 1/20 0.33
P2RX7 Q99572 1/20 0.31
DRD2 P14416 1/20 0.30
SIRT1 Q96EB6 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5357435 0.98 ALDH1A1 (0.34) ALDH1A1NPSR1HPGDDRD2SIRT1
SCHEMBL5349509 0.80 ALDH1A1 (0.34) ALDH1A1NPSR1HPGD
SCHEMBL5357625 0.78 ALDH1A1 (0.33) ALDH1A1NPSR1
SCHEMBL11587461 0.75 TDP1 (0.38) ALDH1A1P2RX7DRD2
SCHEMBL15356291 0.74 TP53 (0.41) ALDH1A1DRD2
SCHEMBL1839819 0.74 TP53 (0.45) ALDH1A1HPGDDRD2
SCHEMBL15356269 0.72 ALDH1A1 (0.39) ALDH1A1HPGDDRD2
SCHEMBL15356277 0.72 ALDH1A1 (0.39) ALDH1A1HPGDDRD2
SCHEMBL1897257 0.72 ALDH1A1 (0.39) ALDH1A1HPGDDRD2
SCHEMBL13672476 0.72 DRD2 (0.44) DRD2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110526841-B Onium salt, chemically amplified positive resist composition, and resist pattern forming method 信越化学工业株式会社 2023-06-13 CN disclosed
US-11036136-B2 Onium salt, chemically amplified positive resist composition, and resist pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-06-15 US disclosed
EP-3572877-B1 ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2020-09-09 EP disclosed
EP-3572877-A1 ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2019-11-27 EP disclosed
US-9846360-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-19 US disclosed
US-9760010-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-09-12 US disclosed
US-9568821-B2 Patterning process SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-02-14 US disclosed
US-9568821-B2 Patterning process SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-02-14 US disclosed
US-20170003590-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-05 US disclosed
US-20160363866-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-15 US disclosed
US-20140065546-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-06 US disclosed
US-20140065546-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-06 US disclosed
US-7312014-B2 Poly(p-hydroxystyrene/styrene/alkyl acrylate) terpolymer derivative and acid generator comprising triphenylsulfonium benzenesulfonate derivative; forming positive pattern using transcription technology in high vacuum with irradiated energy such as electron beam, extreme ultraviolet ray and X-ray WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2007-12-25 US disclosed
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
US-20050214680-A1 Radiation-sensitive resin composition MIYAJI MASAAKI 2005-09-29 US disclosed
US-6933094-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-08-23 US disclosed
US-20040170918-A1 Poly(p-hydroxystyrene/styrene/alkyl acrylate) terpolymer derivative and acid generator comprising triphenylsulfonium benzenesulfonate derivative; forming positive pattern using transcription technology in high vacuum with irradiated energy such as electron beam, extreme ultraviolet ray and X-ray WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2004-09-02 US disclosed
EP-1406123-A1 RESIST COMPOSITIONS Wako Pure Chemical Industries, Ltd. (JP) 2004-04-07 EP disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11036136-B2 Onium salt, chemically amplified positive resist composition, and resist pattern forming process SLC6A5, SLC6A9, POLL ALDH1A1 4646/4885NPSR1 1413/4885HPGD 4360/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.