SCHEMBL5440903

SCHEMBL5440903

CC(C)=Cc1cccc(C=C(C)C)c1O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ERN1 O75460 4/20 0.44
TLR2 O60603 1/20 0.42
TLR1 Q15399 1/20 0.42
TLR6 Q9Y2C9 1/20 0.42
IAPP P10997 2/20 0.41
POLB P06746 2/20 0.38
GAA P10253 2/20 0.38
RAB9A P51151 1/20 0.38
ALDH1A1 P00352 3/20 0.38
CDK2 P24941 2/20 0.35
CDK1 P06493 1/20 0.35
ALOX12 P18054 2/20 0.35
HPGD P15428 3/20 0.35
ALOX15 P16050 2/20 0.35
RECQL P46063 2/20 0.35
HSD17B10 Q99714 2/20 0.35
TDP1 Q9NUW8 2/20 0.35
MAPT P10636 2/20 0.35
KDM4E B2RXH2 1/20 0.35
USP2 O75604 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9618491 0.88 ERN1 (0.61) ERN1IAPPPOLBGAARAB9A
SCHEMBL5992998 0.86 ALDH1A1 (0.54) ERN1TLR2TLR1TLR6IAPP
SCHEMBL9530709 0.84 ERN1 (0.38) ERN1TLR2TLR1TLR6IAPP
SCHEMBL27400809 0.84 GAA (0.42) ERN1TLR2TLR1TLR6IAPP
SCHEMBL13273489 0.83 GABRA1 (0.61) ERN1TLR2TLR1TLR6IAPP
SCHEMBL14198015 0.81 TLR2 (0.70) ERN1TLR2TLR1TLR6POLB
SCHEMBL14198061 0.81 ALOX12 (0.61) ERN1TLR2TLR1TLR6IAPP
SCHEMBL2340381 0.80 LMNA (0.38) ERN1RAB9AALDH1A1TDP1MAPT
SCHEMBL8611275 0.80 ALDH1A1 (0.53) TLR2TLR1TLR6IAPPGAA
SCHEMBL31000832 0.77 TRIM24 (0.52) ERN1POLBRAB9AALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112384552-B Polyphenylene ether, curable composition containing polyphenylene ether, dry film, prepreg, cured product, laminate, and electronic component 太阳控股株式会社 2024-01-30 CN disclosed
CN-116867646-A Curable resin laminate, dry film, cured product, and electronic component 太阳控股株式会社 2023-10-10 CN disclosed
US-20070191540-A1 LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND THE MANUFACTURING METHOD OF LOW DIELECTRIC LOSS RESIN HITACHI, LTD. (JP) 2007-08-16 US disclosed