SCHEMBL5455594

SCHEMBL5455594

C#CC(C)(O)CCCCCCCCCC

nearest known ligand 0.42

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
FDPS P14324 10/20 0.42
GGPS1 O95749 7/20 0.42
SMPD1 P17405 2/20 0.38
CES2 O00748 1/20 0.36
LPAR1 Q92633 1/20 0.36
LPAR3 Q9UBY5 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31596025 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL397739 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL2026709 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL26634468 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL1016952 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL215216 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL11866694 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL26634482 1.00 FDPS (0.42) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL1056747 0.98 FDPS (0.40) FDPSGGPS1SMPD1CES2LPAR1
SCHEMBL5801235 0.98 FDPS (0.40) FDPSGGPS1SMPD1CES2LPAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 234 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117757422-A anti-UV poisoning organic silicon gel composition and application thereof 东莞市贝特利新材料有限公司 2024-03-26 CN claimed
EP-4725993-A1 THERMALLY CONDUCTIVE TWO-COMPONENT ADDITION CURING TYPE SILICONE COMPOSITION, CURED PRODUCT, AND SHEET SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-15 EP disclosed
EP-4722267-A1 THERMAL RADICAL-CURABLE THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-08 EP disclosed
EP-4722300-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-08 EP disclosed
EP-4722299-A1 THERMALLY CONDUCTIVE TWO-COMPONENT ADDITION-CURABLE SILICONE COMPOSITION, CURED PRODUCT, AND SHEET SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-08 EP disclosed
US-20260092148-A1 PHOTO- AND HEAT-CURABLE SILICONE COMPOSITION AND PRODUCTION METHOD FOR CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-02 US disclosed
US-20260085156-A1 HEAT-CURABLE AND PHOTOCURABLE SILICONE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-26 US disclosed
EP-4715014-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-25 EP disclosed
EP-3831887-B1 SILICONE GEL COMPOSITION AND CURED PRODUCT THEREOF, AND POWER MODULE SHINETSU CHEMICAL CO (JP) 2026-03-04 EP disclosed
US-20260047263-A1 SOLAR CELL ELEMENT COATING COMPOSITION, AND SOLAR CELL MODULE AND PRODUCTION METHOD THEREFOR SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-12 US disclosed
EP-2615141-A2 Thermosetting Resin Composition for Semiconductor Encapsulation and Encapsulated Semiconductor Device Shin-Etsu Chemical Co., Ltd. (JP) 2013-07-17 EP disclosed
EP-1788032-B1 Use of basic carbonates for reducing the compression set in addition curing silicone compositions SHINETSU CHEMICAL CO (JP) 2012-11-14 EP disclosed
CN-100439435-C Thermosetting silicon rubber compsns. SHINETSU CHEMICAL CO (JP) 2008-12-03 CN disclosed
US-20080287603-A1 ADDITION CURING SILICONE COMPOSITION FOR CIPG THAT YIELDS CURED PRODUCT WITH EXCELLENT COMPRESSION SET, AND METHOD OF REDUCING COMPRESSION SET OF CURED PRODUCT OF THE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-11-20 US disclosed
US-20080287603-A1 ADDITION CURING SILICONE COMPOSITION FOR CIPG THAT YIELDS CURED PRODUCT WITH EXCELLENT COMPRESSION SET, AND METHOD OF REDUCING COMPRESSION SET OF CURED PRODUCT OF THE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-11-20 US disclosed
US-20070287771-A1 Silicone ink composition for inkjet printing, and image-forming method SHIN-ETSU CHEMICAL CO., LTD. 2007-12-13 US disclosed
EP-1788032-A2 Addition curing silicone composition for CIPG with very good compression set and method of reducing compression set Shin-Etsu Chemical Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20070112149-A1 ADDITION CURING SILICONE COMPOSITION FOR CIPG THAT YIELDS CURED PRODUCT WITH EXCELLENT COMPRESSION SET, AND METHOD OF REDUCING COMPRESSION SET OF CURED PRODUCT OF THE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-17 US disclosed
US-20070112149-A1 ADDITION CURING SILICONE COMPOSITION FOR CIPG THAT YIELDS CURED PRODUCT WITH EXCELLENT COMPRESSION SET, AND METHOD OF REDUCING COMPRESSION SET OF CURED PRODUCT OF THE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-17 US disclosed
CN-1539885-A Thermosetting silicon rubber compsns. 信越化学工业株式会社 2004-10-27 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260092148-A1 PHOTO- AND HEAT-CURABLE SILICONE COMPOSITION AND PRODUCTION METHOD FOR CURED PRODUCT THEREOF MAT1A, MMAB, MAT2B FDPS 970/4885GGPS1 1187/4885SMPD1 2776/4885
US-20260047263-A1 SOLAR CELL ELEMENT COATING COMPOSITION, AND SOLAR CELL MODULE AND PRODUCTION METHOD THEREFOR CD4, XPA, ITGA1 FDPS 4264/4885GGPS1 3771/4885SMPD1 2547/4885
US-20260085156-A1 HEAT-CURABLE AND PHOTOCURABLE SILICONE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF HSPA1B, HEATR1, HSPB1 FDPS 2319/4885GGPS1 2007/4885SMPD1 3435/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.